⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2881630 | 0.79 | — | — | |
| SCHEMBL1016317 | 0.74 | — | — | |
| SCHEMBL18694589 | 0.72 | — | — | |
| SCHEMBL18694587 | 0.72 | — | — | |
| SCHEMBL352733 | 0.71 | — | — | |
| SCHEMBL1014591 | 0.70 | — | — | |
| SCHEMBL1016296 | 0.70 | — | — | |
| SCHEMBL1016937 | 0.69 | MAOA (0.31) | — | |
| SCHEMBL1017568 | 0.67 | CYP1A2 (0.33) | — | |
| SCHEMBL1018383 | 0.67 | CYP1A2 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3156450-B1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD, BUILDUP FILM, BUILDUP BOARD, FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED RESIN MOLDED ARTICLE | DAINIPPON INK & CHEMICALS (JP) | 2019-10-09 | — | — | EP | disclosed |
| US-10301471-B2 | Curable resin composition, cured product thereof, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, build-up film, build-up substrate, fiber-reinforced composite material, and fiber-reinforced resin molded product | DIC CORPORATION (JP) | 2019-05-28 | — | — | US | disclosed |
| EP-3156450-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD, BUILDUP FILM, BUILDUP BOARD, FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED RESIN MOLDED ARTICLE | DIC Corporation (JP) | 2017-04-19 | — | — | EP | disclosed |
| US-20170101532-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR ENCAPSULATING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, BUILD-UP SUBSTRATE, FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED RESIN MOLDED PRODUCT | DIC CORPORATION (JP) | 2017-04-13 | — | — | US | disclosed |
| US-20130116287-A1 | FUNGICIDE HYDROXIMOYL-HETEROCYCLES DERIVATIVES | BAYER INTELLECTUAL PROPERTY GMBH (DE) | 2013-05-09 | — | — | US | disclosed |
| US-20130012546-A1 | FUNGICIDE HYDROXIMOYL-TETRAZOLE DERIVATIVES | BAYER CROPSCIENCE AG (DE) | 2013-01-10 | — | — | US | disclosed |
| US-8247595-B2 | Organic sulfur compound and its use for controlling harmful arthropod | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2012-08-21 | — | — | US | disclosed |
| EP-2152668-B1 | ORGANIC SULFUR COMPOUND AND ITS USE FOR CONTROLLING HARMFUL ARTHROPODS | SUMITOMO CHEMICAL CO (JP) | 2011-01-12 | — | — | EP | disclosed |
| US-20100160434-A1 | ORGANIC SULFUR COMPOUND AND ITS USE FOR CONTROLLING HARMFUL ARTHROPOD | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| EP-0795269-B1 | Herbicidal combinations | SYNGENTA PARTICIPATIONS AG (CH) | 2003-07-30 | — | — | EP | disclosed |
| US-6090750-A | REDUCING PHYTOTOXICITY OF DICAMBA TO CROP PLANTS BY CO-APPLYING A QUINOLINYLOXY ALKANOIC ACID DERIVATIVE SUCH AS CLOQUINTOCET-MEXYL TOGETHER WITH DICAMBA | NOVARTIS AG (CH) | 2000-07-18 | — | — | US | disclosed |
| EP-0795269-A1 | Herbicidal combinations | Novartis AG (CH) | 1997-09-17 | — | — | EP | disclosed |