SCHEMBL10180321

SCHEMBL10180321

Cc1cc(C(=O)O)cc(C)c1OCC1CO1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.42
GLA P06280 1/20 0.42
TDP1 Q9NUW8 1/20 0.42
TP53 P04637 3/20 0.41
TSHR P16473 3/20 0.41
HIF1A Q16665 2/20 0.41
SMN1; SMN2 Q16637 2/20 0.41
CYP3A4 P08684 1/20 0.41
VDR P11473 1/20 0.38
MEN1 O00255 3/20 0.37
KMT2A Q03164 3/20 0.37
MAPT P10636 2/20 0.37
HPGD P15428 2/20 0.37
PKM P14618 2/20 0.37
CYP1A2 P05177 1/20 0.37
PPARG P37231 1/20 0.37
LMNA P02545 1/20 0.37
GAA P10253 1/20 0.37
TPMT P51580 1/20 0.37
PLA2G2A P14555 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10350237 0.86 ALDH1A1 (0.45) ALDH1A1GLATDP1TP53TSHR
SCHEMBL10793352 0.81 ALDH1A1 (0.42) ALDH1A1GLATDP1TP53TSHR
SCHEMBL10180471 0.80 ALDH1A1 (0.54) ALDH1A1GLATDP1TSHRVDR
SCHEMBL24161572 0.80 TPMT (0.47) ALDH1A1TDP1TSHRKMT2AMAPT
SCHEMBL3128534 0.80 ALDH1A1 (0.47) ALDH1A1GLATDP1TP53TSHR
SCHEMBL3128527 0.80 ALDH1A1 (0.47) ALDH1A1GLATDP1TP53TSHR
SCHEMBL49658 0.79 ALDH1A1 (0.50) ALDH1A1GLATDP1TP53TSHR
SCHEMBL13117147 0.79 ALDH1A1 (0.50) ALDH1A1GLATDP1TP53TSHR
SCHEMBL4470150 0.79 ALDH1A1 (0.50) ALDH1A1GLATDP1TP53TSHR
SCHEMBL27689081 0.78 ALDH1A1 (0.41) ALDH1A1TDP1TP53SMN1; SMN2CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3594259-B1 EPOXY POLYMER, EPOXY RESIN, EPOXY RESIN COMPOSITION, RESIN SHEET, B-STAGE SHEET, CURED PRODUCT, C-STAGE SHEET, METAL FOIL WITH RESIN, METAL SUBSTRATE AND METHOD FOR MANUFACTURING EPOXY RESIN RESONAC CORP (JP) 2024-04-17 EP disclosed
US-11535700-B2 Epoxy polymer, epoxy resin, epoxy resin composition, resin sheet, b-stage sheet, cured product, c-stage sheet, metal foil with resin, metal substrate and method for manufacturing SHOWA DENKO MATERIALS CO., LTD. (JP) 2022-12-27 US disclosed
EP-2474539-B1 DIEPOXY COMPOUND, PROCESS FOR PRODUCING SAME, AND COMPOSITION CONTAINING THE DIEPOXY COMPOUND SUMITOMO CHEMICAL CO (JP) 2013-11-27 EP disclosed
EP-2474539-A1 DIEPOXY COMPOUND, PROCESS FOR PRODUCING SAME, AND COMPOSITION CONTAINING THE DIEPOXY COMPOUND Sumitomo Chemical Company, Limited (JP) 2012-07-11 EP disclosed