SCHEMBL1020196

SCHEMBL1020196

CCOCc1ccc(COC)o1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALOX5 P09917 2/20 0.47
L3MBTL1 Q9Y468 2/20 0.38
HTT P42858 2/20 0.36
NPC1 O15118 6/20 0.34
RAB9A P51151 5/20 0.34
POLB P06746 3/20 0.34
TDP1 Q9NUW8 2/20 0.34
MAPK1 P28482 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
KMT2A Q03164 3/20 0.33
MEN1 O00255 2/20 0.33
HSP90AA1 P07900 1/20 0.33
PDE5A O76074 1/20 0.33
KDM4E B2RXH2 2/20 0.32
LMNA P02545 2/20 0.32
ALDH1A1 P00352 1/20 0.32
MAPT P10636 1/20 0.32
DPP4 P27487 1/20 0.32
DAO P14920 1/20 0.32
GAA P10253 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL631961 0.91 ALOX5 (0.49) ALOX5L3MBTL1NPC1RAB9APOLB
SCHEMBL55096 0.86 DAO (0.38) ALOX5L3MBTL1HTTNPC1RAB9A
SCHEMBL17791258 0.84 ALOX5 (0.45) ALOX5L3MBTL1NPC1RAB9APOLB
SCHEMBL19049630 0.82 ALOX5 (0.40) ALOX5L3MBTL1HTTNPC1RAB9A
SCHEMBL631723 0.81 ALOX5 (0.46) ALOX5L3MBTL1NPC1RAB9APOLB
SCHEMBL17791255 0.81 ALOX5 (0.46) ALOX5L3MBTL1NPC1RAB9APOLB
SCHEMBL25076245 0.80 ALOX5 (0.40) ALOX5L3MBTL1NPC1RAB9APOLB
SCHEMBL3654147 0.80 TSHR (0.36) ALOX5L3MBTL1NPC1RAB9ATDP1
SCHEMBL31329423 0.80 DAO (0.39) ALOX5L3MBTL1POLBTDP1KDM4E
SCHEMBL15196843 0.79 ALOX5 (0.42) ALOX5L3MBTL1NPC1RAB9APOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9943903-B2 Binder composition for making self-hardening foundry molds, and method of producing foundry mold using the same KAO CORPORATION (JP) 2018-04-17 US claimed
EP-2752258-B1 ADHESIVE AGENT COMPOSITION FOR MOLD USED IN SELF-HARDENING MOLDING AND METHOD FOR PRODUCING MOLD USING THE SAME KAO CORP (JP) 2017-10-04 EP claimed
US-20140296372-A1 BINDER COMPOSITION FOR MAKING SELF-HARDENING FOUNDRY MOLDS, AND METHOD OF PRODUCING FOUNDRY MOLD USING THE SAME KAO CORPORATION (JP) 2014-10-02 US claimed
EP-2752258-A1 ADHESIVE AGENT COMPOSITION FOR MOLD USED IN SELF-HARDENING MOLDING AND METHOD FOR PRODUCING MOLD USING THE SAME Kao Corporation (JP) 2014-07-09 EP claimed
CN-112512722-B Binder composition for mold making 花王株式会社 2023-02-28 CN disclosed
CN-112512722-A Binder composition for mold making 花王株式会社 2021-03-16 CN disclosed
CN-112368091-A Binder composition for mold making 花王株式会社 2021-02-12 CN disclosed
CN-112236247-A Binder composition for mold making 花王株式会社 2021-01-15 CN disclosed
CN-112203784-A Binder composition for mold making 花王株式会社 2021-01-08 CN disclosed
EP-2773695-B1 BINDER COMPOSITION FOR MOLD FORMATION KAO CORP (JP) 2020-10-21 EP disclosed
CN-108348986-B Casting mold molding kit 花王株式会社 2020-08-28 CN disclosed
EP-2828325-B1 BINDER COMPOSITION FOR MAKING FOUNDRY MOLDS KAO CORP (JP) 2020-04-15 EP disclosed
EP-2272603-A1 METHOD FOR PRODUCING MOLD Kao Corporation (JP) 2011-01-12 EP disclosed
EP-0778095-B1 BINDER COMPOSITION FOR MOLD PRODUCTION AND PROCESS FOR PRODUCING MOLD KAO CORP (JP) 2007-02-21 EP disclosed
CN-1062202-C Binder composition for mold production and process for producing mold KAO CARP (JP) 2001-02-21 CN disclosed
US-5932628-A BLEND OF SAND AND POLYFURFURAL ALCOHOL KAO CORPORATION (JP) 1999-08-03 US disclosed
CN-1155856-A Binder composition for mold production and process for producing mold KAO CORP (JP) 1997-07-30 CN disclosed
EP-0778095-A1 BINDER COMPOSITION FOR MOLD PRODUCTION AND PROCESS FOR PRODUCING MOLD Kao Corporation (JP) 1997-06-11 EP disclosed
US-5616631-A CONTAINING FURAN DERIVATIVES AS CURING ACCELERATORS KAO CORPORATION (JP) 1997-04-01 US disclosed
EP-0698432-A1 Binder composition for mold making, binder/curing agent composition for mold making and sand composition for mold making Kao Corporation (JP) 1996-02-28 EP disclosed