SCHEMBL1021763

SCHEMBL1021763

CCOC(C)=C(C)C(=O)O

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.50
LMNA P02545 1/20 0.50
HSD17B10 Q99714 1/20 0.50
ALOX15 P16050 1/20 0.42
MGAM O43451 1/20 0.42
GAA P10253 1/20 0.42
SI P14410 1/20 0.42
MGAM2 Q2M2H8 1/20 0.42
SOAT1 P35610 1/20 0.42
HCAR2 Q8TDS4 1/20 0.39
TRPA1 O75762 1/20 0.39
GLO1 Q04760 1/20 0.38
TSHR P16473 2/20 0.36
CYP2D6 P10635 2/20 0.35
EGLN1 Q9GZT9 1/20 0.35
THRB P10828 1/20 0.35
FNTA P49354 1/20 0.35
FNTB P49356 1/20 0.35
PGGT1B P53609 1/20 0.35
MAPT P10636 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL466000 1.00 ALDH1A1 (0.50) ALDH1A1LMNAHSD17B10ALOX15MGAM
Methacrylic Acid SCHEMBL7055703 0.91 ALDH1A1 (0.42) ALDH1A1LMNAHSD17B10ALOX15MGAM
SCHEMBL19678255 0.81 ALDH1A1 (0.52) ALDH1A1LMNAHSD17B10ALOX15MGAM
SCHEMBL6553346 0.80 HCAR2 (0.43) ALDH1A1LMNAHSD17B10GAAHCAR2
SCHEMBL4892609 0.80 HCAR2 (0.43) ALDH1A1LMNAHSD17B10GAAHCAR2
SCHEMBL481466 0.80 ALDH1A1 (0.59) ALDH1A1LMNAHSD17B10ALOX15TSHR
SCHEMBL7541604 0.80 ALDH1A1 (0.33) ALDH1A1LMNAHSD17B10ALOX15KDM4E
SCHEMBL8185637 0.79 ALDH1A1 (0.50) ALDH1A1LMNAHSD17B10ALOX15MGAM
SCHEMBL6786515 0.79 ALDH1A1 (0.50) ALDH1A1LMNAHSD17B10ALOX15MGAM
SCHEMBL166091 0.79 ALDH1A1 (0.50) ALDH1A1LMNAHSD17B10ALOX15MGAM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 76 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0984053-B1 PHOTOCHROMIC POLYMERIZABLE COMPOSITION TOKUYAMA CORP (JP) 2006-09-06 EP claimed
WO-2024135741-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 株式会社レゾナック 2024-06-27 WO disclosed
US-20240160103-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD RESONAC CORPORATION (JP) 2024-05-16 US disclosed
US-11921424-B2 Photosensitive resin composition, dry film using same, printed wiring board, and printed wiring board manufacturing method Hitachi Chemical Company, Ltd. (FIPAS) (JP) 2024-03-05 US disclosed
WO-2023238732-A1 LAYERED STRUCTURE, CURED PRODUCT OF RESIN LAYER IN SAID LAYERED STRUCTURE, AND ELECTRONIC COMPONENT HAVING SAID CURED PRODUCT 太陽ホールディングス株式会社 2023-12-14 WO disclosed
US-20230350292-A1 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM USING SAME, PRINTED WIRING BOARD, AND PRINTED WIRING BOARD MANUFACTURING METHOD RESONAC CORPORATION (JP) 2023-11-02 US disclosed
US-20230331915-A1 Isocyanate-Modified Polyimide Resin, Resin Composition and Cured Product of Same NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2023-10-19 US disclosed
WO-2023153103-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 株式会社レゾナック 2023-08-17 WO disclosed
WO-2023140293-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 株式会社レゾナック 2023-07-27 WO disclosed
WO-2023139682-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 株式会社レゾナック 2023-07-27 WO disclosed
WO-2004070427-A2 METHOD OF PREPARING MOULDED ARTICLES BY MEANS OF PHOTOPOLYMERISATION IN VISIBLE OR NEAR-ULTRAVIOLET LIGHT ESSILOR INTERNATIONAL COMPAGNIE GENERALE D'OPTIQUE (FR) 2004-08-19 WO disclosed
EP-0663411-B2 Photo-imaging resist ink and cured product thereof NIPPON KAYAKU KK (JP) 2002-08-14 EP disclosed
US-6254958-B1 CURABLE COPOLYMER OF N-ALKOXYMETHYLACRYLAMIDE AND ACRYLOYLOXY ALKYL TRIALKYL AMMONIUM ALKYL SULFATE, PHOTOINITIATOR AND GRAIN FLOUR; HIGH SPEED INK ABSORPTION NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2001-07-03 US disclosed
EP-1039994-A1 METHOD FOR OBTAINING AN OPHTHALMIC LENS COMPRISING A SURFACE UTILITY MICROSTRUCTURE AND RESULTING OPHTHALMIC LENSES ESSILOR INTERNATIONAL COMPAGNIE GENERALE D'OPTIQUE (FR) 2000-10-04 EP disclosed
WO-2000045777-A1 COMPOSITION, KIT, METHOD AND DEVICE FOR HAIR TREATMENT DIJK EDDY VAN (BE) 2000-08-10 WO disclosed
WO-1999029494-A1 METHOD FOR OBTAINING AN OPHTHALMIC LENS COMPRISING A SURFACE UTILITY MICROSTRUCTURE AND RESULTING OPHTHALMIC LENSES ESSILOR INTERNATIONAL COMPAGNIE GENERALE D'OPTIQUE (FR) 1999-06-17 WO disclosed
EP-0879828-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ARTICLES NIPPON KAYAKU KABUSHIKI KAISHA (JP) 1998-11-25 EP disclosed
EP-0663411-B1 Photo-imaging resist ink and cured product thereof NIPPON KAYAKU KK (JP) 1997-05-28 EP disclosed
EP-0663411-A1 Photo-imaging resist ink and cured product thereof Nippon Kayaku Kabushiki Kaisha (JP) 1995-07-19 EP disclosed
US-5378291-A Hexavalent chromium ions, acrylic emulsion polymer NIHON PARKERIZING CO., LTD. (JP) 1995-01-03 US disclosed