SCHEMBL10311682

SCHEMBL10311682

CN1C(=O)C(C(C)(C)C)C(C(C)(C)C)C1=O

nearest known ligand 0.30

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
ADRA2C P18825 1/20 0.30
GSK3A P49840 1/20 0.30
GSK3B P49841 1/20 0.30
MGLL Q99685 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20625906 0.85
SCHEMBL20625884 0.84
SCHEMBL19337484 0.83
SCHEMBL12250053 0.79
SCHEMBL13448389 0.79
SCHEMBL14564574 0.79
SCHEMBL19702943 0.74 CYP2D6 (0.33)
SCHEMBL9612235 0.74 ALDH1A1 (0.34)
SCHEMBL14410569 0.74 ALDH1A1 (0.34)
SCHEMBL19912034 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11586108-B2 Pattern-forming composition, film, infrared cut filter, infrared transmitting filter, solid image pickup element, infrared sensor, and camera module FUJIFILM CORPORATION (JP) 2023-02-21 US disclosed
US-20210173309-A1 METHOD OF FORMING REVERSED PATTERN AND METHOD OF MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2021-06-10 US disclosed
US-20200218150-A1 PATTERN-FORMING COMPOSITION, FILM, INFRARED CUT FILTER, INFRARED TRANSMITTING FILTER, SOLID IMAGE PICKUP ELEMENT, INFRARED SENSOR, AND CAMERA MODULE FUJIFILM CORPORATION (JP) 2020-07-09 US disclosed
US-10678132-B2 Resin for hydrophobilizing resist surface, method for production thereof, and positive resist composition containing the resin FUJIFILM CORPORATION (JP) 2020-06-09 US disclosed
US-20200124963-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2020-04-23 US disclosed
US-10017696-B2 Thermosetting composition with photo-alignment property, alignment layer, substrate with alignment layer, retardation plate, and device DAI NIPPON PRINTING CO., LTD. (JP) 2018-07-10 US disclosed
US-9023576-B2 Positive resist composition for immersion exposure and pattern-forming method using the same FUJIFILM CORPORATION (JP) 2015-05-05 US disclosed
US-20130020684-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2013-01-24 US disclosed
US-20120322007-A1 PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2012-12-20 US disclosed
US-20120178894-A1 COMPOUND HAVING SILSESQUIOXANE SKELETON AND ITS POLYMER INAGAKI JYUN-ICHI (JP) 2012-07-12 US disclosed
US-20100240855-A1 Compound having silsesquioxane skeleton and its polymer JNC CORPORATION (JP) 2010-09-23 US disclosed
US-20100009288-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD USING SAME FUJIFILM CORPORATION (JP) 2010-01-14 US disclosed
EP-2141183-A1 Actinic ray-sensitive or radiation-sensitive resin composition and pattern forming method using same Fujifilm Corporation (JP) 2010-01-06 EP disclosed
WO-2008093856-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE POSITIVE RESIST COMPOSITION FUJIFILM CORPORATION (JP) 2008-08-07 WO disclosed
EP-1518908-B1 Ink composition for electrostatic ink-jet recording and method of ink-jet recording FUJIFILM CORP (JP) 2007-05-30 EP disclosed