Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.32 |
| ▸ | POLB | P06746 | 1/20 | 0.32 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.30 |
| ▸ | HPGD | P15428 | 1/20 | 0.30 |
| ▸ | LMNA | P02545 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5423440 | 0.85 | KDM4E (0.35) | KDM4EALDH1A1 | |
| SCHEMBL6063691 | 0.81 | KDM4E (0.33) | KDM4EALDH1A1 | |
| SCHEMBL19130089 | 0.79 | — | — | |
| SCHEMBL6063754 | 0.79 | KDM4E (0.32) | KDM4EALDH1A1 | |
| SCHEMBL19130358 | 0.79 | — | — | |
| SCHEMBL6063022 | 0.78 | KDM4E (0.31) | KDM4EALDH1A1 | |
| SCHEMBL6063481 | 0.76 | KDM4E (0.34) | KDM4EALDH1A1 | |
| SCHEMBL201969 | 0.75 | ALDH1A1 (0.31) | KDM4EPOLBALDH1A1HPGDLMNA | |
| SCHEMBL200055 | 0.73 | KDM4E (0.30) | KDM4EALDH1A1 | |
| SCHEMBL949048 | 0.73 | ALDH1A1 (0.32) | KDM4EALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9263416-B2 | Methods and materials useful for chip stacking, chip and wafer bonding | SUMITOMO BAKELITE CO., LTD. (JP) | 2016-02-16 | — | — | US | disclosed |
| US-20140349446-A1 | METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING | PROMERUS, LLC (US) | 2014-11-27 | — | — | US | disclosed |
| US-8816485-B2 | Methods and materials useful for chip stacking, chip and wafer bonding | SUMITOMO BAKELITE CO., LTD. (JP) | 2014-08-26 | — | — | US | disclosed |
| US-20120175721-A1 | Methods And Materials Useful For Chip Stacking, Chip And Wafer Bonding | PROMERUS LLC (US) | 2012-07-12 | — | — | US | disclosed |