SCHEMBL10353023

SCHEMBL10353023

CCC(CCCN1C(=O)C=CC1=O)CC(CC)CCCN1C(=O)C=CC1=O

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 11/20 0.54
FAAH O00519 5/20 0.54
PTGS1 P23219 7/20 0.53
PTGS2 P35354 7/20 0.53
ALDH1A1 P00352 2/20 0.52
LMNA P02545 2/20 0.52
MAPT P10636 2/20 0.52
NPSR1 Q6W5P4 2/20 0.52
HSP90AA1 P07900 1/20 0.52
TLR9 Q9NR96 1/20 0.52
TP53 P04637 1/20 0.52
PKM P14618 1/20 0.52
HPGD P15428 1/20 0.52
XBP1 P17861 1/20 0.52
MAPK1 P28482 1/20 0.52
HTT P42858 1/20 0.52
RECQL P46063 1/20 0.52
RAB9A P51151 1/20 0.52
SMN1; SMN2 Q16637 1/20 0.52
GPR35 Q9HC97 1/20 0.52

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13286631 0.87 MGLL (0.56) MGLLFAAHPTGS1PTGS2ALDH1A1
SCHEMBL22280007 0.87 MGLL (0.61) MGLLFAAHPTGS1PTGS2ALDH1A1
SCHEMBL13286614 0.86 MGLL (0.55) MGLLFAAHPTGS1PTGS2ALDH1A1
SCHEMBL28847998 0.82 MGLL (0.55) MGLLFAAHPTGS1PTGS2ALDH1A1
SCHEMBL16322660 0.80 MGLL (0.72) MGLLFAAHPTGS1PTGS2ALDH1A1
SCHEMBL28847877 0.79 MGLL (0.55) MGLLFAAHPTGS1PTGS2ALDH1A1
SCHEMBL1535468 0.78 MGLL (0.54) MGLLFAAHPTGS1PTGS2ALDH1A1
SCHEMBL6534769 0.77 MGLL (0.58) MGLLFAAHPTGS1PTGS2ALDH1A1
SCHEMBL9695896 0.76 MGLL (0.52) MGLLFAAHPTGS1PTGS2ALDH1A1
SCHEMBL3482198 0.76 MGLL (0.62) MGLLFAAHPTGS1PTGS2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0202498-B1 USE OF A THERMO-SETTING, POLYMERIZABLE COMPOSITION AND WIRING BOARD HITACHI, LTD. (JP) 1990-07-11 EP claimed
US-4738900-A HEAT RESISTANT DIELECTRIC LAYER OF A POLYMER OF AN AROMATIC DIMALEIMIDE AND AN AROMATIC DICYANAMIDE HITACHI, LTD. (JP) 1988-04-19 US claimed
EP-0202498-A2 Use of a thermo-setting, polymerizable composition and wiring board HITACHI, LTD. (JP) 1986-11-26 EP claimed
US-4738900-A HEAT RESISTANT DIELECTRIC LAYER OF A POLYMER OF AN AROMATIC DIMALEIMIDE AND AN AROMATIC DICYANAMIDE HITACHI, LTD. (JP) 1988-04-19 US disclosed
EP-0202498-A2 Use of a thermo-setting, polymerizable composition and wiring board HITACHI, LTD. (JP) 1986-11-26 EP disclosed