SCHEMBL1036902

SCHEMBL1036902

OC1(O)C=CC(OC2=CCC(O)(O)C=C2)=CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6369664 0.82
SCHEMBL4232200 0.70
SCHEMBL28904639 0.68
SCHEMBL7740576 0.67
SCHEMBL7719873 0.64
SCHEMBL2776690 0.64
SCHEMBL2909261 0.61 ESR1 (0.32)
SCHEMBL222999 0.61 ALDH1A1 (0.31)
SCHEMBL6751190 0.53
SCHEMBL28876071 0.52

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 71 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0333002-B1 Heat-resistant resin composition IDEMITSU PETROCHEMICAL CO (JP) 1994-04-27 EP claimed
EP-2731993-B1 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME LG INNOTEK CO LTD (KR) 2023-08-30 EP disclosed
US-9974172-B2 Epoxy resin compound and radiant heat circuit board using the same LG INNOTEK CO., LTD. (KR) 2018-05-15 US disclosed
US-20140318835-A1 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME LG INNOTEK CO., LTD. (KR) 2014-10-30 US disclosed
US-20140290986-A1 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME LG INNOTEK CO., LTD. (KR) 2014-10-02 US disclosed
EP-2731993-A2 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME LG Innotek Co., Ltd. (KR) 2014-05-21 EP disclosed
WO-2013032238-A9 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME LG INNOTEK CO., LTD. (KR) 2013-06-06 WO disclosed
WO-2013009114-A9 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME LG INNOTEK CO., LTD. (KR) 2013-04-04 WO disclosed
WO-2013032238-A2 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME LG INNOTEK CO., LTD. (KR) 2013-03-07 WO disclosed
WO-2013009114-A2 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME LG INNOTEK CO., LTD. (KR) 2013-01-17 WO disclosed
US-6214892-B1 MIXING AN AQUEOUS SOLUTION AND THE ORGANIC MIXTURE, REMOVING THE ORGANIC SOLVENT FROM THE LIQUID-LIQUID DISPERSION THEREBY FORMING A SLURRY; SEPARATING THE POLYCARBONATE FROM THE SLURRY GENERAL ELECTRIC COMPANY 2001-04-10 US disclosed
WO-2001009222-A1 POLYESTERCARBONATE COMPRISING RESIDUES OF BRANCHED DIACIDS GENERAL ELECTRIC COMPANY (US) 2001-02-08 WO disclosed
US-6184334-B1 HEATING, IN ONE OR MORE STAGES, MIXTURE COMPRISING DIPHENOL AND DIARYLCARBONATE; INTRODUCING IN SAME STAGE OR DIFFERENT STAGES ALKALI METAL SALTS OF OXOACIDS OF SULFUR AS POLYMERIZATION CATALYST GENERAL ELECTRIC COMPANY 2001-02-06 US disclosed
US-6184335-B1 HEATING, IN ONE OR MORE STAGES, MIXTURE COMPRISING DIPHENOL AND DIARYLCARBONATE; IN THE SAME STAGE OR DIFFERENT STAGES INTRODUCING CATALYTICALLY EFFECTIVE AMOUNT OF AN ALKALI AND/OR ALKALI EARTH METAL SALT OF ARYL SULFONIC ACID GENERAL ELECTRIC COMPANY 2001-02-06 US disclosed
US-6143858-A REACTING INTERFACIALLY A DIHYDRIC PHENOL, A CARBONATE PRECURSOR, AND A BRANCHED ALIPHATIC DICARBOXYLIC ACID OF 10 TO ABOUT 40 CARBON ATOMS, AND RAISING THE PH FOR THE REMAINDER OF THE CARBONATE PRECURSOR TIME; LOW MELT VISCOSITY GENERAL ELECTRIC COMPANY (US) 2000-11-07 US disclosed
US-5710238-A Process for preparing branched polycarbonates by solid state polymerization GENERAL ELECTRIC COMPANY (US) 1998-01-20 US disclosed
US-5102975-A Liquid crystalline polycarbonate from dihydroxy biphenyl and dihydroxy diphenyl ether GENERAL ELECTRIC COMPANY (US) 1992-04-07 US disclosed
EP-0152012-A2 Method for enhancing ionizing radiation resistance of polymer compositions GENERAL ELECTRIC COMPANY (US) 1985-08-21 EP disclosed
US-4292417-A CROSSLINKED SULFATED POLYETHER DAICEL LTD. (JP) 1981-09-29 US disclosed
US-4200726-A Semipermeable membrane of phenoxy resin containing sulfuric acid groups or salts thereof DAICEL LTD. (JP) 1980-04-29 US disclosed