Known targets — ChEMBL curated mechanism
ADRB1CDK4CDK6CHRM2CHRM3DPP4DRD2DRD3DRD4EGFRHRH1HTR1BHTR1DHTR1FHTR2AHTR2CHTR4SLC6A2SLC6A4
The experimentally established mechanism targets of Succinic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 7/20 | 0.50 |
| ▸ | HPGD | P15428 | 1/20 | 0.50 |
| ▸ | HCAR2 | Q8TDS4 | 1/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.45 |
| ▸ | TP53 | P04637 | 3/20 | 0.45 |
| ▸ | HIF1A | Q16665 | 3/20 | 0.45 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.45 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.45 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.42 |
| ▸ | THRB | P10828 | 2/20 | 0.42 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.41 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.41 |
| ▸ | MAPT | P10636 | 1/20 | 0.40 |
| ▸ | LMNA | P02545 | 2/20 | 0.39 |
| ▸ | ALKBH5 | Q6P6C2 | 1/20 | 0.39 |
| ▸ | SUCNR1 | Q9BXA5 | 1/20 | 0.39 |
| ▸ | EGLN1 | Q9GZT9 | 1/20 | 0.39 |
| ▸ | FFAR3 | O14843 | 1/20 | 0.39 |
| ▸ | HDAC3 | O15379 | 1/20 | 0.39 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Succinic Acid SCHEMBL3870450 | 1.00 | TSHR (0.50) | TSHRHPGDHCAR2ALDH1A1TP53 | |
| Acrylic Acid Ethyl Ester SCHEMBL11649333 | 0.92 | FFAR3 (0.52) | TSHRHPGDHCAR2ALDH1A1TP53 | |
| Glutarate SCHEMBL3867785 | 0.92 | TSHR (0.52) | TSHRHPGDHCAR2ALDH1A1TP53 | |
| Adipic Acid SCHEMBL3871335 | 0.92 | TSHR (0.52) | TSHRHPGDHCAR2ALDH1A1CYP3A4 | |
| Acrylic Acid Ethyl Ester SCHEMBL6009066 | 0.91 | — | — | |
| Succinic Acid SCHEMBL28180131 | 0.91 | TSHR (0.43) | TSHRHPGDHCAR2ALDH1A1TP53 | |
| Acrylic Acid Ethyl Ester SCHEMBL29739797 | 0.89 | TSHR (0.56) | TSHRHPGDHCAR2ALDH1A1TP53 | |
| Acrylic Acid Ethyl Ester SCHEMBL21715365 | 0.89 | TSHR (0.56) | TSHRHPGDHCAR2ALDH1A1TP53 | |
| Acrylic Acid Ethyl Ester SCHEMBL9557413 | 0.89 | TSHR (0.60) | TSHRHPGDHCAR2ALDH1A1TP53 | |
| Acrylic Acid Ethyl Ester SCHEMBL3180 | 0.89 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-3221956-A | — | — | None | — | — | JP | disclosed |
| JP-11092736-A | — | — | None | — | — | JP | disclosed |
| CN-113677721-A | Photosensitive resin composition preparation kit, photosensitive resin composition, cured film, substrate with cured film, and method for producing substrate with cured film | 株式会社钟化 | 2021-11-19 | — | — | CN | disclosed |
| CN-113396471-A | Adhesive for semiconductor, cured product and semiconductor device | 昭和电工材料株式会社 | 2021-09-14 | — | — | CN | disclosed |
| CN-111758073-A | Photosensitive resin composition, cured film, printed wiring board and method for producing same, and photosensitive resin composition production kit | 株式会社钟化 | 2020-10-09 | — | — | CN | disclosed |
| US-8421247-B2 | Connecting material having metallic particles of an oxygen state ratio and size and semiconductor device having the connecting material | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-04-16 | — | — | US | disclosed |
| CN-101842400-B | Curable sheet composition | THREE BOND CO LTD | 2012-08-08 | — | — | CN | disclosed |
| CN-101238158-B | Repellent composition containing graft copolymer, and method for producing the same | DAIKIN IND LTD | 2012-05-30 | — | — | CN | disclosed |
| EP-1554632-B1 | PROCESS FOR PRODUCING ELECTROPHORETIC DISPLAY DEVICES | CANON KK (JP) | 2011-08-24 | — | — | EP | disclosed |
| US-20110101543-A1 | CONNECTING MATERIAL AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-05-05 | — | — | US | disclosed |
| EP-0952198-B1 | Precoating type adhesive composition | THREE BOND CO LTD (JP) | 2003-12-17 | — | — | EP | disclosed |
| EP-1230855-A1 | SUSTAINED-RELEASE PREPARATION OF AQUEOUS DISPERSION TYPE AND PROCESS FOR PRODUCING THE SAME | NOF CORPORATION (JP) | 2002-08-14 | — | — | EP | disclosed |
| US-6136943-A | HIGH MOLECULAR WEIGHT, LOW VISCOSITY COATINGS; REACTION PRODUCT OF POLYAMINE, (METH)ACRYLIC COMPOUND AND VINYL COMPOUND; MICHAEL CONDENSATION | TOYO INK MFG. CO., LTD. (JP) | 2000-10-24 | — | — | US | disclosed |
| US-6025074-A | PRECOATING OF THREADED FASTENERS WITH POLYMERIZATION ACCELERATORS WITH DOUBLE BONDS | THREE BOND CO., LTD. (JP) | 2000-02-15 | — | — | US | disclosed |
| EP-0952198-A1 | Precoating type adhesive composition | THREE BOND CO., LTD. (JP) | 1999-10-27 | — | — | EP | disclosed |
| JP-H1192736-A | CONDUCTIVE RESIN PASTE AND SEMICONDUCTOR DEVICE PREPARED BY USING SAME | SUMITOMO BAKELITE CO LTD | 1999-04-06 | — | — | JP | disclosed |
| EP-0849307-B1 | Ionic organosilicon compounds, their preparation and use | WACKER CHEMIE GMBH (DE) | 1999-03-17 | — | — | EP | disclosed |
| EP-0899287-A1 | Multi-branched compounds and curable composition | TOYO INK MFG. CO., LTD. (JP) | 1999-03-03 | — | — | EP | disclosed |
| EP-0849307-A1 | Ionic organosilicon compounds, their preparation and use | Wacker-Chemie GmbH (DE) | 1998-06-24 | — | — | EP | disclosed |
| JP-H03221956-A | PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE USING SAME | HITACHI CHEM CO LTD | 1991-09-30 | — | — | JP | disclosed |