Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | THRB | P10828 | 5/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.40 |
| ▸ | TSHR | P16473 | 1/20 | 0.40 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.40 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.40 |
| ▸ | HTT | P42858 | 2/20 | 0.38 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.38 |
| ▸ | THRA | P10827 | 1/20 | 0.38 |
| ▸ | KIF11 | P52732 | 1/20 | 0.37 |
| ▸ | KCNN4 | O15554 | 1/20 | 0.36 |
| ▸ | LMNA | P02545 | 1/20 | 0.36 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.36 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.36 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.36 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.35 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.35 |
| ▸ | CHRM3 | P20309 | 1/20 | 0.35 |
| ▸ | MEN1 | O00255 | 1/20 | 0.35 |
| ▸ | POLB | P06746 | 1/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6849252 | 0.82 | THRB (0.41) | THRBALDH1A1TSHRCYP2C19HIF1A | |
| SCHEMBL29501029 | 0.82 | THRB (0.34) | THRB | |
| SCHEMBL3169549 | 0.78 | CYP2C19 (0.46) | THRBALDH1A1TSHRCYP2C19HIF1A | |
| SCHEMBL6545257 | 0.77 | CYP2C19 (0.40) | ALDH1A1CYP2C19HIF1AHTTKIF11 | |
| SCHEMBL7859075 | 0.77 | HTT (0.46) | THRBALDH1A1TSHRCYP2C19HIF1A | |
| SCHEMBL29005902 | 0.77 | CYP2C19 (0.37) | THRBALDH1A1TSHRCYP2C19HIF1A | |
| Hydrochloric Acid SCHEMBL7049938 | 0.77 | THRB (0.33) | THRBALDH1A1CYP2C19THRACYP3A4 | |
| SCHEMBL28732568 | 0.77 | CYP2C19 (0.53) | ALDH1A1TSHRCYP2C19HIF1AKIF11 | |
| Acrylic Acid Methyl Ester SCHEMBL27464307 | 0.76 | KCNN4 (0.42) | THRBALDH1A1TSHRCYP2C19HTT | |
| SCHEMBL15901527 | 0.76 | THRB (0.40) | THRBALDH1A1TSHRCYP2C19HIF1A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11942353-B2 | Adhesive tape for semiconductor processing and method for producing semiconductor device | LINTEC CORPORATION (JP) | 2024-03-26 | — | — | US | disclosed |
| WO-2024058094-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | リンテック株式会社 | 2024-03-21 | — | — | WO | disclosed |
| US-11842916-B2 | Semiconductor processing adhesive tape and method of manufacturing semiconductor device | LINTEC CORPORATION (JP) | 2023-12-12 | — | — | US | disclosed |
| WO-2023054318-A1 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | リンテック株式会社 | 2023-04-06 | — | — | WO | disclosed |
| WO-2023281858-A1 | PROTECTIVE SHEET FOR SEMICONDUCTOR PROCESSING, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | リンテック株式会社 | 2023-01-12 | — | — | WO | disclosed |
| WO-2023281860-A1 | PROTECTIVE SHEET FOR SEMICONDUCTOR PROCESSING AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | リンテック株式会社 | 2023-01-12 | — | — | WO | disclosed |
| WO-2023281861-A1 | PROTECTIVE SHEET FOR SEMICONDUCTOR PROCESSING, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | リンテック株式会社 | 2023-01-12 | — | — | WO | disclosed |
| WO-2023281859-A1 | PROTECTIVE SHEET FOR SEMICONDUCTOR PROCESSING AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | リンテック株式会社 | 2023-01-12 | — | — | WO | disclosed |
| CN-112334558-B | Adhesive tape for semiconductor processing and method for manufacturing semiconductor device | 琳得科株式会社 | 2022-12-06 | — | — | CN | disclosed |
| CN-115397938-A | Double-sided adhesive sheet and method for manufacturing semiconductor device | 琳得科株式会社 | 2022-11-25 | — | — | CN | disclosed |
| US-7361971-B2 | Semiconductor wafer protection structure and laminated protective sheet for use therein | LINTEC CORPORATION (JP) | 2008-04-22 | — | — | US | disclosed |
| US-20060043532-A1 | Protective structure of semiconductor wafer, method for protecting semiconductor wafer, multilayer protective sheet used therein, and method for processing semiconductor wafer | LINTEC CORPORATION (JP) | 2006-03-02 | — | — | US | disclosed |
| EP-1542274-A1 | PROTECTIVE STRUCTURE OF SEMICONDUCTOR WAFER, METHOD FOR PROTECTING SEMICONDUCTOR WAFER, MULTILAYER PROTECTIVE SHEET USED THEREIN, AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER | Lintec Corporation (JP) | 2005-06-15 | — | — | EP | disclosed |
| US-6878441-B2 | Pressure sensitive adhesive sheet | LINTEC CORPORATION (JP) | 2005-04-12 | — | — | US | disclosed |
| EP-1002845-B1 | Pressure sensitive adhesive sheet and method of use thereof | LINTEC CORP (JP) | 2005-03-02 | — | — | EP | disclosed |
| EP-0999250-B1 | Pressure sensitive adhesive sheet for use in semiconductor wafer working | LINTEC CORP (JP) | 2004-03-31 | — | — | EP | disclosed |
| US-20030104199-A1 | Pressure sensitive adhesive sheet | LINTEC CORPORATION | 2003-06-05 | — | — | US | disclosed |
| US-6524701-B1 | A substrate with an intermediate layer superimposed on it and a pressure sensitive adhesive layer superimposed on the intermediate layer | LINTEC CORPORATION (JP) | 2003-02-25 | — | — | US | disclosed |
| EP-1002845-A2 | Pressure sensitive adhesive sheet and method of use thereof | Lintec Corporation (JP) | 2000-05-24 | — | — | EP | disclosed |
| EP-0999250-A2 | Pressure sensitive adhesive sheet for use in semiconductor wafer working | Lintec Corporation (JP) | 2000-05-10 | — | — | EP | disclosed |