SCHEMBL10500656

SCHEMBL10500656

FC[SiH](Cl)Cl

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL177913 0.67
SCHEMBL467769 0.59
SCHEMBL3810465 0.59
SCHEMBL467719 0.59
SCHEMBL467505 0.56
SCHEMBL2349485 0.56
SCHEMBL2099147 0.56
SCHEMBL301860 0.56
SCHEMBL17423480 0.56
SCHEMBL7114313 0.56

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118197917-A Wafer processing method and etching-depositing integrated equipment for wafer processing 中微半导体设备(上海)股份有限公司 2024-06-14 CN claimed
CN-113004522-B Low-surface-energy fluorine-silicon additive for epoxy resin and preparation method thereof 无锡龙驰氟硅新材料有限公司 2022-03-15 CN claimed
CN-113004522-A Low-surface-energy fluorine-silicon additive for epoxy resin and preparation method thereof 无锡龙驰氟硅新材料有限公司 2021-06-22 CN claimed
US-12403437-B2 Method for producing nanodiamonds doped with group 14 element, and method for purifying same DAICEL CORPORATION (JP) 2025-09-02 US disclosed
US-12351463-B2 Heteroatom-doped nanodiamond DAICEL CORPORATION (JP) 2025-07-08 US disclosed
CN-113631252-B Method for producing and purifying nanodiamond doped with carbon group element 株式会社大赛璐 2025-05-23 CN disclosed
US-20250002355-A1 HETEROATOM-DOPED NANODIAMOND PARTICLES AND METHOD FOR PRODUCING HETEROATOM-DOPED NANODIAMOND PARTICLES DAICEL CORPORATION (JP) 2025-01-02 US disclosed
WO-2024219059-A1 NV CENTER-CONTAINING NANODIAMOND PARTICLE AND METHOD FOR PRODUCING SAME 株式会社ダイセル 2024-10-24 WO disclosed
CN-118197917-A Wafer processing method and etching-depositing integrated equipment for wafer processing 中微半导体设备(上海)股份有限公司 2024-06-14 CN disclosed
EP-4382481-A1 HETEROATOM-DOPED NANODIAMOND PARTICLES AND METHOD FOR PRODUCING HETEROATOM-DOPED NANODIAMOND PARTICLES Daicel Corporation (JP) 2024-06-12 EP disclosed
CN-117794856-A Heteroatom-doped nanodiamond particles and method for producing heteroatom-doped nanodiamond particles 株式会社大赛璐 2024-03-29 CN disclosed
EP-3950110-A1 EXPLOSIVE COMPOSITION AND METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING HETEROATOM-DOPED NANODIAMOND Daicel Corporation (JP) 2022-02-09 EP disclosed
EP-3950586-A1 HETEROATOM-DOPED NANODIAMOND Daicel Corporation (JP) 2022-02-09 EP disclosed
CN-113631253-A Explosive composition, method for producing same, and method for producing heteroatom-doped nanodiamond 株式会社大赛璐 2021-11-09 CN disclosed
CN-113631512-A Nano-diamond doped with heteroatom 株式会社大赛璐 2021-11-09 CN disclosed
CN-113631252-A Method for producing and purifying carbon group element-doped nanodiamond 株式会社大赛璐 2021-11-09 CN disclosed
CN-113004522-A Low-surface-energy fluorine-silicon additive for epoxy resin and preparation method thereof 无锡龙驰氟硅新材料有限公司 2021-06-22 CN disclosed
WO-2020195998-A9 EXPLOSIVE COMPOSITION AND METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING HETEROATOM-DOPED NANODIAMOND 株式会社ダイセル 2020-12-03 WO disclosed
WO-2020195998-A1 EXPLOSIVE COMPOSITION AND METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING HETEROATOM-DOPED NANODIAMOND 株式会社ダイセル 2020-10-01 WO disclosed
US-4818563-A FORMING ACTIVATED SPECIES SEPARATELY, FEEDING INTO CHAMBER WITH SUBSTRATE, HEATING CANON KABUSHIKI KAISHA (JP) 1989-04-04 US disclosed