SCHEMBL10548828

SCHEMBL10548828

CC(C)/N=C(/NC(C)C)OC(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9825498 1.00
Oxalic Acid SCHEMBL11791667 0.90 TSHR (0.33)
SCHEMBL9432221 0.80
SCHEMBL4141652 0.80 CA12 (0.32)
SCHEMBL17050367 0.80 CA12 (0.32)
SCHEMBL4141650 0.80 CA12 (0.32)
SCHEMBL14835784 0.79
SCHEMBL14835782 0.79
SCHEMBL15927997 0.76
SCHEMBL8499111 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4692940-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MANUFACTURING METHOD Sumitomo Bakelite Co., Ltd. (JP) 2026-02-11 EP disclosed
US-12216113-B2 Method for preparing analysis sample, analysis method, and kit for preparing analysis sample SHIMADZU CORPORATION (JP) 2025-02-04 US disclosed
US-20240321803-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2024-09-26 US disclosed
US-20240272551-A1 NEGATIVE-TYPE PHOTOSENSITIVE POLYMER, POLYMER SOLUTION, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2024-08-15 US disclosed
WO-2022270529-A1 NEGATIVE PHOTOSENSITIVE POLYMER, POLYMER SOLUTION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE 住友ベークライト株式会社 2022-12-29 WO disclosed
WO-2022270527-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE POLMER, CURED FILM AND SEMICONDUCTOR DEVICE 住友ベークライト株式会社 2022-12-29 WO disclosed
WO-2022172988-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE 住友ベークライト株式会社 2022-08-18 WO disclosed
US-20210164989-A1 METHOD FOR PREPARING ANALYSIS SAMPLE, ANALYSIS METHOD, AND KIT FOR PREPARING ANALYSIS SAMPLE SHIMADZU CORPORATION (JP) 2021-06-03 US disclosed
EP-3812767-A1 METHOD FOR PREPARING ANALYSIS SAMPLE, ANALYSIS METHOD, AND KIT FOR PREPARING ANALYSIS SAMPLE SHIMADZU CORPORATION (JP) 2021-04-28 EP disclosed
WO-2008005268-A1 SUBSTITUTED PIPERIDINES THAT INCREASE P53 ACTIVITY AND THE USES THEREOF SCHERING CORPORATION (US) 2008-01-10 WO disclosed
US-4833163-A INSECTICIDES, NEMATOCIDES, MITICIDES ROUSSEL UCLAF (FR) 1989-05-23 US disclosed
US-4547522-A INSECTICIDE, MITICIDE, FUNGICIDE, BACTERICIDE,OR NEMATOCIDE ROUSSEL UCLAF (FR) 1985-10-15 US disclosed
US-4431576-A COSMETICS; TOILETRIES; DETERGENTS; INSECTICIDES; WAXES ROUSSEL UCLAF (FR) 1984-02-14 US disclosed
US-4402972-A INSECTICIDES ROUSSEL UCLAF (FR) 1983-09-06 US disclosed
US-3947274-A Silver halide photographic material containing an isourea derivative as antifoggant FUJI PHOTO FILM CO., LTD. (JA) 1976-03-30 US disclosed