⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1245815 | 0.75 | — | — | |
| SCHEMBL28213123 | 0.70 | TSHR (0.53) | — | |
| SCHEMBL9775298 | 0.70 | TSHR (0.53) | — | |
| SCHEMBL11668631 | 0.70 | TSHR (0.40) | — | |
| SCHEMBL397697 | 0.70 | TSHR (0.40) | — | |
| SCHEMBL10875191 | 0.70 | TSHR (0.33) | — | |
| SCHEMBL2838339 | 0.68 | TSHR (0.38) | — | |
| SCHEMBL20609991 | 0.68 | MEN1 (0.31) | — | |
| SCHEMBL305894 | 0.67 | TSHR (0.30) | — | |
| SCHEMBL10595657 | 0.67 | LMNA (0.39) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20110017498-A1 | Photosensitive dielectric film | ENDICOTT INTERCONNECT TECHNOLOGIES, INC. | 2011-01-27 | — | — | US | disclosed |
| US-6794040-B2 | PRINTED CIRCUIT BOARD OR CARD HAVING PLATED THROUGH-HOLES FILLED WITH A PHOTOCURED POLYMER | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2004-09-21 | — | — | US | disclosed |
| US-6734569-B2 | Die attachment with reduced adhesive bleed-out | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2004-05-11 | — | — | US | disclosed |
| EP-0642416-B1 | FIBER/RESIN COMPOSITES AND METHOD OF PREPARATION | LOCTITE CORP (US) | 2003-10-01 | — | — | EP | disclosed |
| US-20030119226-A1 | Die attachment with reduced adhesive bleed-out | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2003-06-26 | — | — | US | disclosed |
| US-20030064212-A1 | Flowable compositions and use in filling vias and plated through-holes | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2003-04-03 | — | — | US | disclosed |
| US-6427325-B1 | Flowable compositions and use in filling vias and plated through-holes | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2002-08-06 | — | — | US | disclosed |
| US-6090474-A | Flowable compositions and use in filling vias and plated through-holes | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2000-07-18 | — | — | US | disclosed |
| US-5679719-A | APPLYING TO A FIBER A RESIN CONSISTING OF EPOXY COMPONENT CONTAINING ATLEAST ONE POLYEPOXIDE CURABLE BY HEAT, AN OLEFINICALLY UNSATURATED MONOMER CURABLE BY ACTINIC RADIATION, PHOTOINITIATOR AND ORGANIC PEROXIDE, CURING | LOCTITE CORPORATION (US) | 1997-10-21 | — | — | US | disclosed |
| US-5585414-A | HEAT CURABLE POLYEPOXIDE, ACTINIC RADIATION CURABLE UNSATURATED MONOMER, PHOTOINITIATOR, HEAT ACTIVATED ORGANIC PEROXIDE, HEAT ACTIVATED AMINE CURING AGENT FOR EPOXY COMPONENT; NONDRIPPING | LOCTITE CORPORATION (US) | 1996-12-17 | — | — | US | disclosed |
| US-5565499-A | DUAL CURING: AN EPOXY COMPONENT CURABLE BY HEAT AND AN OLEFINICALLY UNSATURATED MONOMER CURABLE BY ACTINIC RADIATION | LOCTITE CORPORATION (US) | 1996-10-15 | — | — | US | disclosed |
| US-5539012-A | Fiber/resin composites and method of preparation | LOCTITE CORPORATION (US) | 1996-07-23 | — | — | US | disclosed |