SCHEMBL1058867

SCHEMBL1058867

[Si].c1ccc2c(c1)CC1OC1O2

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CHRM2 P08172 2/20 0.45
CHRM4 P08173 2/20 0.45
CHRM5 P08912 2/20 0.45
CHRM1 P11229 2/20 0.45
CHRM3 P20309 2/20 0.45
MAOA P21397 6/20 0.38
MAOB P27338 6/20 0.38
AOC2 O75106 5/20 0.38
DAO P14920 1/20 0.38
HPGD P15428 1/20 0.38
TSHR P16473 1/20 0.38
NISCH Q9Y2I1 1/20 0.36
HRH3 Q9Y5N1 1/20 0.36
HDAC3 O15379 1/20 0.34
HDAC4 P56524 1/20 0.34
HDAC1 Q13547 1/20 0.34
HDAC7 Q8WUI4 1/20 0.34
HDAC2 Q92769 1/20 0.34
HDAC10 Q969S8 1/20 0.34
HDAC11 Q96DB2 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL36938 0.98 CHRM2 (0.46) CHRM2CHRM4CHRM5CHRM1CHRM3
SCHEMBL162329 0.96 CHRM2 (0.45) CHRM2CHRM4CHRM5CHRM1CHRM3
SCHEMBL22583920 0.96 CHRM2 (0.45) CHRM2CHRM4CHRM5CHRM1CHRM3
Fluoride SCHEMBL5670739 0.96 CHRM2 (0.45) CHRM2CHRM4CHRM5CHRM1CHRM3
SCHEMBL4560444 0.96 CHRM2 (0.45) CHRM2CHRM4CHRM5CHRM1CHRM3
SCHEMBL25424228 0.96 CHRM2 (0.45) CHRM2CHRM4CHRM5CHRM1CHRM3
SCHEMBL5133781 0.96 CHRM2 (0.45) CHRM2CHRM4CHRM5CHRM1CHRM3
SCHEMBL10699051 0.96 CHRM2 (0.45) CHRM2CHRM4CHRM5CHRM1CHRM3
SCHEMBL1286412 0.96 CHRM2 (0.45) CHRM2CHRM4CHRM5CHRM1CHRM3
Water SCHEMBL167691 0.96 CHRM2 (0.45) CHRM2CHRM4CHRM5CHRM1CHRM3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7875941-B2 Thin film encapsulation of MEMS devices NORTHROP GRUMMAN CORPORATION (US) 2011-01-25 US disclosed
US-20100237446-A1 THIN FILM ENCAPSULATION OF MEMS DEVICES NORTHROP GRUMMAN CORPORATION (US) 2010-09-23 US disclosed
US-7638429-B2 Thin film encapsulation of MEMS devices NORTHROP GRUMMAN CORPORATION (US) 2009-12-29 US disclosed
EP-1476394-B1 THIN FILM ENCAPSULATION OF MEMS DEVICES NORTHROP GRUMMAN CORP (US) 2008-09-17 EP disclosed
US-20060183262-A1 Thin film encapsulation of MEMS devices NORTHROP GRUMMAN CORPORATION (US) 2006-08-17 US disclosed
US-7045459-B2 Thin film encapsulation of MEMS devices NORTHROP GRUMMAN CORPORATION (US) 2006-05-16 US disclosed
EP-1476394-A2 THIN FILM ENCAPSULATION OF MEMS DEVICES Northrop Grumman Corporation (US) 2004-11-17 EP disclosed
WO-2003070625-A2 THIN FILM ENCAPSULATION OF MEMS DEVICES NORTHROP GRUMMAN CORPORATION (US) 2003-08-28 WO disclosed
US-20030155643-A1 Thin film encapsulation of MEMS devices NORTHROP GRUMMAN SYSTEMS CORPORATION 2003-08-21 US disclosed