SCHEMBL10595000

SCHEMBL10595000

CC(C)C(C)(C)OC(=O)c1cc(C(=O)O)c(C(=O)O)cc1C(=O)O

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.42
KDM4E B2RXH2 3/20 0.34
NPSR1 Q6W5P4 1/20 0.34
LCK P06239 1/20 0.32
FYN P06241 1/20 0.32
HSD17B10 Q99714 4/20 0.31
TDP1 Q9NUW8 3/20 0.31
CYP2C9 P11712 2/20 0.31
MEN1 O00255 1/20 0.31
CYP2D6 P10635 1/20 0.31
CYP2C19 P33261 1/20 0.31
KMT2A Q03164 1/20 0.31
ALOX15 P16050 1/20 0.31
GRM8 O00222 1/20 0.31
GRM6 O15303 1/20 0.31
SLC6A2 P23975 1/20 0.31
SLC6A4 P31645 1/20 0.31
DRD3 P35462 1/20 0.31
GRM4 Q14833 1/20 0.31
CA12 O43570 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10388128 0.83 CA12 (0.44) ALDH1A1HSD17B10TDP1MEN1KMT2A
SCHEMBL828860 0.82 ALDH1A1 (0.37) ALDH1A1NPSR1LCKFYNHSD17B10
SCHEMBL27389488 0.82 ALDH1A1 (0.37) ALDH1A1NPSR1LCKFYNHSD17B10
SCHEMBL28401369 0.82 ALDH1A1 (0.37) ALDH1A1NPSR1LCKFYNHSD17B10
SCHEMBL828474 0.82 ALDH1A1 (0.37) ALDH1A1NPSR1LCKFYNHSD17B10
SCHEMBL5070915 0.81 ALDH1A1 (0.50) ALDH1A1KDM4EHSD17B10TDP1CYP2C9
Ethane SCHEMBL27588974 0.80 ALDH1A1 (0.48) ALDH1A1KDM4EHSD17B10TDP1CYP2C9
SCHEMBL29489355 0.76 TSHR (0.50) ALDH1A1KDM4EHSD17B10TDP1CA1
SCHEMBL24726400 0.76 HSD17B10 (0.35) ALDH1A1KDM4ELCKFYNHSD17B10
Ethane SCHEMBL4644131 0.76 KDM4E (0.38) ALDH1A1KDM4ENPSR1HSD17B10CYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3144338-B1 VARNISH INCLUDING 2-PHENYL-4,4'-DIAMINODIPHENYL ETHER, IMIDE RESIN COMPOSITION HAVING EXCELLENT MOLDABILITY, CURED RESIN MOLDED ARTICLE HAVING EXCELLENT BREAKING ELONGATION, PREPREG THEREOF, IMIDE PREPREG THEREOF, AND FIBER-REINFORCED MATERIAL THEREOF HAVING HIGH HEAT RESISTANCE AND EXCELLENT MECHANICAL STRENGTH KANEKA CORP (JP) 2023-10-25 EP disclosed
WO-2019226641-A9 VARNISH OF POLYIMIDE HAVING HIGH HEAT RESISTANCE AND EXCELLENT MECHANICAL STRENGTH KANEKA AMERICAS HOLDING, INC. (US) 2020-01-23 WO disclosed
US-20170152399-A1 VARNISH INCLUDING 2-PHENYL-4,4'-DIAMINODIPHENYL ETHER, IMIDE RESIN COMPOSITION HAVING EXCELLENT MOLDABILITY, CURED RESIN MOLDED ARTICLE HAVING EXCELLENT BREAKING ELONGATION, PREPREG THEREOF, IMIDE PREPREG THEREOF, AND FIBER-REINFORCED MATERIAL THEREOF HAVING HIGH HEAT RESISTANCE AND EXCELLENT MECHANICAL STRENGTH KANEKA CORPORATION (JP) 2017-06-01 US disclosed
EP-3144338-A1 VARNISH USING 2-PHENYL-4,4'-DIAMINODIPHENYL ETHER, IMIDE RESIN COMPOSITION EXHIBITING EXCELLENT MOLDABILITY, CURED RESIN MOLDED ARTICLE HAVING EXCELLENT BREAKING ELONGATION, PREPREG USING SAME, IMIDE PREPREG, AND FIBER-REINFORCED MATERIAL EXHIBITING EXCELLENT HEAT RESISTANCE AND MECHANICAL STRENGTH Kaneka Corporation (JP) 2017-03-22 EP disclosed
EP-0336374-A2 Processing polyimide precursor compositions ETHYL CORPORATION (US) 1989-10-11 EP disclosed