SCHEMBL106058

SCHEMBL106058

CCCO[Si](OCCC)(OCCC)C(C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8916731 0.85
SCHEMBL424819 0.83 ADRB2 (0.38)
SCHEMBL31091362 0.82
SCHEMBL11355531 0.78
SCHEMBL31142088 0.78
SCHEMBL31142030 0.78
SCHEMBL2398799 0.78
SCHEMBL31142040 0.78
SCHEMBL106473 0.77
SCHEMBL706720 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 560 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107325394-B Polypropylene composition and high-performance flame-retardant antistatic polypropylene pipe 中国石油化工股份有限公司 2020-09-15 CN claimed
CN-107325411-B Flame-retardant antistatic random copolymerization polypropylene composition and pipe 中国石油化工股份有限公司 2020-09-15 CN claimed
CN-107325395-B Polypropylene composition and flame-retardant antistatic pipe 中国石油化工股份有限公司 2020-07-24 CN claimed
CN-106317612-B A kind of high fondant-strength impact polypropylene foamed material and preparation method 中国石油化工股份有限公司 2018-12-28 CN claimed
EP-2628744-B1 Silicon-containing surface modifier, resist underlayer film composition containing this, and patterning process SHINETSU CHEMICAL CO (JP) 2016-11-30 EP claimed
EP-2628745-B1 Silicon-containing surface modifier, resist lower layer film-forming composition containing the same, and patterning process SHINETSU CHEMICAL CO (JP) 2015-03-25 EP claimed
US-20260118767-A1 REVERSE PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-30 US disclosed
EP-4700067-A1 COMPOSITION FOR FORMING SILICON-CONTAINING FILM, METHOD FOR FORMING FILM, AND SUPERSTRATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-02-25 EP disclosed
US-20260044081-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-02-12 US disclosed
EP-4692941-A2 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST FILM AND PATTERNING PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2026-02-11 EP disclosed
US-20260029706-A1 COMPOSITION FOR FORMING SILICON-CONTAINING FILM, METHOD FOR FORMING FILM, AND SUPER STRAIGHT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-01-29 US disclosed
EP-4660703-A2 METAL-CONTAINING FILM PATTERNING PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
US-20250372377-A1 METAL-CONTAINING FILM PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-12-04 US disclosed
EP-0578473-B1 Catalyst for polymerization of olefin and process for producing olefin polymer SHOWA DENKO KK (JP) 1997-11-19 EP disclosed
EP-0717053-A2 Catalyst for olefin polymerization and process for producing polyolefin using the same JAPAN POLYOLEFINS CO., LTD. (JP) 1996-06-19 EP disclosed
US-5476825-A Consists of magnesium, titanium and halogen compounds, an organoaluminum compound, a reaction product of organoaluminum or organoboron compound with organosilicon compound SHOWA DENKO K.K. (JP) 1995-12-19 US disclosed
EP-0578473-A1 Catalyst for polymerization of olefin and process for producing olefin polymer SHOWA DENKO KABUSHIKI KAISHA (JP) 1994-01-12 EP disclosed
US-4242252-A GELATION INHIBITION OWENS-ILLINOIS, INC. (US) 1980-12-30 US disclosed
US-4242250-A Organopolysiloxane resins formed with catalysts of formic acid and hydrocarbyl substituted ammonium hydroxide OWENS-ILLINOIS, INC. (US) 1980-12-30 US disclosed
US-4223121-A CONTROLLED HYDROLYSIS OF TRIALKOXYSILANE IN FORMIC ACID OWENS-ILLINOIS, INC. (US) 1980-09-16 US disclosed