SCHEMBL1066186

SCHEMBL1066186

C=CC(=O)OC[Si](CC)(OCC)OCC

nearest known ligand 0.44

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TSHR P16473 8/20 0.44
HPGD P15428 1/20 0.44
ALDH1A1 P00352 5/20 0.40
TP53 P04637 3/20 0.40
HIF1A Q16665 3/20 0.40
CYP3A4 P08684 2/20 0.40
MAPK1 P28482 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
HSD17B10 Q99714 1/20 0.39
THRB P10828 3/20 0.38
HCAR2 Q8TDS4 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1066041 0.87 TSHR (0.46) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL1066807 0.86 TSHR (0.46) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL1068293 0.86 TSHR (0.50) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL29249573 0.83 TSHR (0.51) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL1068582 0.82 TSHR (0.50) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL16537073 0.81 TSHR (0.44) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL109189 0.81 TSHR (0.47) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL108947 0.80 TSHR (0.43) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL28023752 0.80 TSHR (0.47) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL106210 0.80 TSHR (0.43) TSHRHPGDALDH1A1TP53HIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117136204-A Polysiloxane resin and use thereof 株式会社钟化 2023-11-28 CN disclosed
CN-107001583-B Photocurable and thermosetting resin composition, cured product, and laminate 株式会社钟化 2019-06-18 CN disclosed
CN-107001583-A Photocurable and thermosetting resin composition, cured product, and laminate 株式会社钟化 2017-08-01 CN disclosed
US-9266981-B2 Conjugated diene random copolymer having alkoxysilane unit KOREA KUMHO PETROCHEMICAL CO., LTD. (KR) 2016-02-23 US disclosed
US-20150065639-A1 CONJUGATED DIENE RANDOM COPOLYMER HAVING ALKOXYSILANE UNIT KOREA KUMHO PETROCHEMICAL CO., LTD. (KR) 2015-03-05 US disclosed
CN-102746467-B Curable composition and process for production of organosilicon compound TOAGOSEI CO LTD 2015-01-14 CN disclosed
US-8829142-B2 Curable composition and process for production of organosilicon compound TOAGOSEI CO., LTD. (JP) 2014-09-09 US disclosed
EP-2270070-B1 CURABLE COMPOSITION, AND PROCESS FOR PRODUCTION OF ORGANOSILICON COMPOUND TOAGOSEI CO LTD (JP) 2014-07-30 EP disclosed
EP-2565217-B1 Curable composition and process for production of organosilicon compound TOAGOSEI CO LTD (JP) 2014-05-14 EP disclosed
US-20130149455-A1 CURABLE COMPOSITION AND PROCESS FOR PRODUCTION OF ORGANOSILICON COMPOUND TOAGOSEI CO., LTD. (JP) 2013-06-13 US disclosed
EP-2565217-A1 Curable composition and process for production of organosilicon compound TOAGOSEI CO., LTD. (JP) 2013-03-06 EP disclosed
US-20110071255-A1 CURABLE COMPOSITION AND PROCESS FOR PRODUCTION OF ORGANOSILICON COMPOUND TOAGOSEI CO., LTD. (JP) 2011-03-24 US disclosed
EP-2270070-A1 CURABLE COMPOSITION, AND PROCESS FOR PRODUCTION OF ORGANOSILICON COMPOUND Toagosei Co., Ltd (JP) 2011-01-05 EP disclosed