⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9579913 | 0.79 | — | — | |
| SCHEMBL20470645 | 0.79 | — | — | |
| SCHEMBL989850 | 0.77 | — | — | |
| SCHEMBL1834120 | 0.77 | — | — | |
| SCHEMBL15554713 | 0.76 | — | — | |
| Hydrochloric Acid SCHEMBL2422211 | 0.76 | — | — | |
| SCHEMBL11473785 | 0.76 | — | — | |
| SCHEMBL10616810 | 0.76 | ALDH1A1 (0.33) | — | |
| SCHEMBL11135927 | 0.76 | ALDH1A1 (0.33) | — | |
| SCHEMBL2372565 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 586 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110845415-B | Environment-friendly synthesis method of 2-ethyl-4-methylimidazole | 广东固研电子材料有限公司 | 2022-12-16 | — | — | CN | claimed |
| CN-110845415-A | Environment-friendly synthesis method of 2-ethyl-4-methylimidazole | 广州市固研电子材料有限公司 | 2020-02-28 | — | — | CN | claimed |
| US-10059827-B2 | Conductive compositions and methods of using them | CITIBANK, N.A. | 2018-08-28 | — | — | US | claimed |
| EP-2334728-B1 | LEAD-FREE CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM | ALPHA ASSEMBLY SOLUTIONS INC (US) | 2018-03-21 | — | — | EP | claimed |
| WO-2017166188-A1 | A LATENT CURING ACCELERATOR COMPOSITION AND A ONE-PART CURABLE ADHESIVE COMPOSITION COMPRISING THE SAME | HENKEL AG & CO. KGAA (DE) | 2017-10-05 | — | — | WO | claimed |
| US-20160251495-A1 | Conductive Compositions and Methods of Using Them | CITIBANK, N.A. | 2016-09-01 | — | — | US | claimed |
| US-20140153167-A1 | CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM | ALPHA METALS, INC. (US) | 2014-06-05 | — | — | US | claimed |
| US-8564140-B2 | Mono-acid hybrid conductive composition and method | ALPHA METALS, INC. (US) | 2013-10-22 | — | — | US | claimed |
| EP-2334728-A2 | CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM | Fry's Metals, Inc. (US) | 2011-06-22 | — | — | EP | claimed |
| US-20100084757-A1 | CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM | CITIBANK, N.A. | 2010-04-08 | — | — | US | claimed |
| WO-2010036953-A2 | CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM | FRY'S METALS, INC. (US) | 2010-04-01 | — | — | WO | claimed |
| US-6486256-B1 | Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst | 3M INNOVATIVE PROPERTIES COMPANY | 2002-11-26 | — | — | US | claimed |
| EP-0936236-A2 | Epoxy resin and hydrid powder coatings | HÜLS AKTIENGESELLSCHAFT (DE) | 1999-08-18 | — | — | EP | claimed |
| US-5286609-A | Process for the formation of a negative resist pattern from a composition comprising a diazoquinone compound and an imidazole and having as a heat step the use of a hot water containing spray | YAMATOYA & CO., LTD. (JP) | 1994-02-15 | — | — | US | claimed |
| US-4880892-A | PHOSPHONIUM OR PHOSPHORANE CATALYST, PROTECTIVE COATINGS | CIBA-GEIGY CORPORATION (US) | 1989-11-14 | — | — | US | claimed |
| US-4529537-A | Liquid epoxy resin hardeners and processes for their preparation | BASF AKTIENGESELLSCHAFT (DE) | 1985-07-16 | — | — | US | claimed |
| EP-0131842-A1 | Liquid curing agents for epoxy resins, and process for their preparation | BASF Aktiengesellschaft (DE) | 1985-01-23 | — | — | EP | claimed |
| US-4246394-A | PROMOTER FOR CROSSLINKING | VEBA-CHEMIE AKTIENGESELLSCHAFT (DE) | 1981-01-20 | — | — | US | claimed |
| US-4176142-A | Powder coating composition | WESTERN ELECTRIC COMPANY, INC. (US) | 1979-11-27 | — | — | US | claimed |
| JP-62187797-A | — | — | None | — | — | JP | disclosed |
| EP-4748869-A1 | EPOXY RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED ARTICLE, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2026-05-27 | — | — | EP | disclosed |
| EP-4748870-A1 | EPOXY RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2026-05-27 | — | — | EP | disclosed |
| WO-2026100231-A1 | CURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2026-05-15 | — | — | WO | disclosed |
| EP-4692055-A1 | THIOL COMPOUND | AJINOMOTO CO., INC. (JP) | 2026-02-11 | — | — | EP | disclosed |
| US-20260008904-A1 | THIOL COMPOUND | AJINOMOTO CO., INC. (JP) | 2026-01-08 | — | — | US | disclosed |
| US-20250382514-A1 | CURABLE ADHESIVE COMPOSITION COMPRISING MALEIMIDE AND THIOL | HENKEL AG & CO KGAA (DE) | 2025-12-18 | — | — | US | disclosed |
| US-20250382263-A1 | THIOL COMPOUND | AJINOMOTO CO., INC. (JP) | 2025-12-18 | — | — | US | disclosed |
| US-12466946-B2 | Method for producing FRP precursor | RESONAC CORPORATION (JP) | 2025-11-11 | — | — | US | disclosed |
| US-20250289782-A1 | THIOL COMPOUND AND USES THEREOF | SHIKOKU CHEMICALS CORPORATION (JP) | 2025-09-18 | — | — | US | disclosed |
| US-20250276509-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO LTD (KR) | 2025-09-04 | — | — | US | disclosed |
| EP-4608891-A1 | RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2025-09-03 | — | — | EP | disclosed |
| EP-4609432-A1 | RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT AND SEMICONDUCTOR DEVICE | Namics Corporation (JP) | 2025-09-03 | — | — | EP | disclosed |
| WO-2025126839-A1 | RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2025-06-19 | — | — | WO | disclosed |
| WO-2025121227-A1 | CURABLE COMPOSITION, CURED PRODUCT, ADHESIVE, AND SEALANT | 四国化成工業株式会社 | 2025-06-12 | — | — | WO | disclosed |
| CN-113444340-B | Resin composition | 味之素株式会社 | 2025-06-10 | — | — | CN | disclosed |
| US-12310224-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2025-05-20 | — | — | US | disclosed |
| US-12297643-B2 | Reinforcing material and reinforcing structure | NITTO DENKO CORPORATION (JP) | 2025-05-13 | — | — | US | disclosed |
| CN-119998945-A | Resin composition, adhesive, sealant, cured product, and semiconductor device | 纳美仕有限公司 | 2025-05-13 | — | — | CN | disclosed |
| US-12297888-B2 | Reinforcing vibration-damping material and reinforcing vibration-damping structure | NITTO DENKO CORPORATION (JP) | 2025-05-13 | — | — | US | disclosed |
| CN-119998352-A | Epoxy resin curing agent, epoxy resin composition, sealing material, electrically conductive material, thermally conductive material, adhesive for camera module, adhesive for structure, matrix resin for fiber-reinforced plastic, impregnating and fixing material, interlayer insulating film, film-type solder resist, sealing sheet, electrically conductive film, anisotropic electrically conductive film, thermally conductive film, and method for producing dyed cured product | 旭化成株式会社 | 2025-05-13 | — | — | CN | disclosed |
| CN-112724596-B | Curable composition and cured product | 盛势达技研株式会社 | 2025-04-18 | — | — | CN | disclosed |
| WO-2025069598-A1 | EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION, SEALING MATERIAL, CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE MATERIAL, ADHESIVE FOR CAMERA MODULES, ADHESIVE FOR STRUCTURES, MATRIX RESIN FOR FIBER-REINFORCED PLASTICS, IMPREGNATED FIXING MATERIAL, INTERLAYER INSULATING FILM, FILM-TYPE SOLDER RESIST, SEALING SHEET, CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE FILM, THERMALLY CONDUCTIVE FILM, AND METHOD FOR PRODUCING DYED CURED PRODUCT | 旭化成株式会社 | 2025-04-03 | — | — | WO | disclosed |
| WO-2025070192-A1 | ADHESIVE SHEET | 日東電工株式会社 | 2025-04-03 | — | — | WO | disclosed |
| EP-4524130-A1 | THIOL COMPOUND AND USES THEREOF | Shikoku Chemicals Corporation (JP) | 2025-03-19 | — | — | EP | disclosed |
| EP-4524174-A1 | CURING AGENT AND USE THEREOF | Shikoku Chemicals Corporation (JP) | 2025-03-19 | — | — | EP | disclosed |
| CN-112745793-B | Curable composition | 味之素株式会社 | 2025-03-14 | — | — | CN | disclosed |
| EP-4502010-A1 | RESIN COMPOSITION, ADHESIVE, ENCAPSULATION MATERIAL, CURED OBJECT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2025-02-05 | — | — | EP | disclosed |
| EP-4502012-A1 | RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2025-02-05 | — | — | EP | disclosed |
| EP-4502011-A1 | RESIN COMPOSITION, ADHESIVE AGENT, ENCAPSULANT, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2025-02-05 | — | — | EP | disclosed |
| WO-2025023051-A1 | EPOXY RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2025-01-30 | — | — | WO | disclosed |
| WO-2025023048-A1 | EPOXY RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED ARTICLE, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2025-01-30 | — | — | WO | disclosed |
| CN-119365518-A | Resin composition, cured product, sealing material, adhesive, insulating material, coating material, prepreg, multilayer body, and fiber-reinforced composite material | 三菱瓦斯化学株式会社 | 2025-01-24 | — | — | CN | disclosed |
| CN-119183463-A | Curing agent and use thereof | 四国化成工业株式会社 | 2024-12-24 | — | — | CN | disclosed |
| CN-119173501-A | Thiol compound and use thereof | 四国化成工业株式会社 | 2024-12-20 | — | — | CN | disclosed |
| WO-2024257781-A1 | THERMOSETTING RESIN COMPOSITION FOR FORMING WIRING BOARD, CURED PRODUCT, PREPREG, AND INTERLAYER INSULATING FILM | JSR株式会社 | 2024-12-19 | — | — | WO | disclosed |
| US-12168729-B2 | Flame-retardant epoxy composition and method of using the same | CYTEC INDUSTRIES INC. (US) | 2024-12-17 | — | — | US | disclosed |
| CN-118984848-A | Resin composition, adhesive, sealing material, cured product, semiconductor device, and electronic component | 纳美仕有限公司 | 2024-11-19 | — | — | CN | disclosed |
| CN-118984849-A | Resin composition, adhesive, sealing material, cured product, semiconductor device, and electronic component | 纳美仕有限公司 | 2024-11-19 | — | — | CN | disclosed |
| US-20240376291-A1 | EPOXY RESIN COMPOSITION, FILM, METHOD FOR PRODUCING FILM, AND CURED PRODUCTS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-11-14 | — | — | US | disclosed |
| CN-114845869-B | Reinforcing material and reinforcing structure | 日东电工株式会社 | 2024-11-12 | — | — | CN | disclosed |
| EP-4212302-B1 | METHOD FOR PRODUCING FRP PRECURSOR | RESONAC CORP (JP) | 2024-11-06 | — | — | EP | disclosed |
| CN-118871506-A | Resin composition, adhesive, sealing material, cured product, semiconductor device, and electronic component | 纳美仕有限公司 | 2024-10-29 | — | — | CN | disclosed |
| EP-3718758-B1 | REINFORCEMENT STRUCTURE AND PRODUCING METHOD OF REINFORCEMENT STRUCTURE | NITTO DENKO CORP (JP) | 2024-10-09 | — | — | EP | disclosed |
| WO-2024204052-A1 | THIOL COMPOUND | 味の素株式会社 | 2024-10-03 | — | — | WO | disclosed |
| WO-2024204053-A1 | THIOL COMPOUND | 味の素株式会社 | 2024-10-03 | — | — | WO | disclosed |
| CN-118725792-A | Composition, adhesive, cured product, and electronic component | 味之素株式会社 | 2024-10-01 | — | — | CN | disclosed |
| US-20240298513-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO., LTD. (KR) | 2024-09-05 | — | — | US | disclosed |
| CN-112745770-B | Curable composition | 味之素株式会社 | 2024-08-02 | — | — | CN | disclosed |
| EP-4405429-A1 | THERMALLY CONDUCTIVE ADHESIVE COMPOSITION, PREPARATION METHOD AND USE THEREOF | Henkel AG & Co. KGaA (DE) | 2024-07-31 | — | — | EP | disclosed |
| EP-4403595-A1 | RESIN COMPOSITION FOR JET DISPENSING, ADHESIVE FOR ELECTRONIC COMPONENT, CURED PRODUCTS THEREOF, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2024-07-24 | — | — | EP | disclosed |
| EP-4403596-A1 | RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENT, CURED PRODUCTS OF THESE, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2024-07-24 | — | — | EP | disclosed |
| US-20240240067-A1 | THERMALLY CONDUCTIVE ADHESIVE COMPOSITION, PREPARATION METHOD AND USE THEREOF | HENKEL AG & CO KGAA (DE) | 2024-07-18 | — | — | US | disclosed |
| EP-4392998-A1 | ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITION FOR BONDING SOLAR CELLS | Henkel AG & Co. KGaA (DE) | 2024-07-03 | — | — | EP | disclosed |
| EP-3689601-B1 | REINFORCING SHEET, REINFORCING MEMBER, REINFORCING KIT, PRODUCTION METHOD FOR REINFORCING SHEET, AND PRODUCTION METHOD FOR REINFORCING MEMBER | NITTO DENKO CORP (JP) | 2024-06-26 | — | — | EP | disclosed |
| CN-114213333-B | Thiol compound, method for synthesizing same, and use of thiol compound | 四国化成工业株式会社 | 2024-06-25 | — | — | CN | disclosed |
| US-20240199925-A1 | ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITION FOR BONDING SOLAR CELLS | HENKEL AG & CO KGAA (DE) | 2024-06-20 | — | — | US | disclosed |
| US-12011787-B2 | Flux, solder paste, and electronic circuit board | HARIMA CHEMICALS, INCORPORATED (JP) | 2024-06-18 | — | — | US | disclosed |
| US-20240158672-A1 | REINFORCEMENT MATERIAL AND REINFORCEMENT STRUCTURE | NITTO DENKO CORPORATION (JP) | 2024-05-16 | — | — | US | disclosed |
| CN-110054865-B | Resin composition | 味之素株式会社 | 2024-05-14 | — | — | CN | disclosed |
| CN-117980427-A | Thermally conductive adhesive composition, method for the production and use thereof | 汉高股份有限及两合公司 | 2024-05-03 | — | — | CN | disclosed |
| WO-2024089906-A1 | RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT AND SEMICONDUCTOR DEVICE | NAMICS CORPORATION (JP) | 2024-05-02 | — | — | WO | disclosed |
| WO-2024089905-A1 | RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT | NAMICS CORPORATION (JP) | 2024-05-02 | — | — | WO | disclosed |
| WO-2024090259-A1 | RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2024-05-02 | — | — | WO | disclosed |
| CN-117957270-A | Resin composition for injection dispensing, adhesive for electronic component, cured product thereof, and electronic component | 纳美仕有限公司 | 2024-04-30 | — | — | CN | disclosed |
| CN-117957068-A | Method for discharging resin composition, method for manufacturing electronic component, and electronic component | 纳美仕有限公司 | 2024-04-30 | — | — | CN | disclosed |
| CN-117940488-A | Resin composition, adhesive for electronic component, cured product thereof, and electronic component | 纳美仕有限公司 | 2024-04-26 | — | — | CN | disclosed |
| EP-3998252-B1 | THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS | SHIKOKU CHEM (JP) | 2024-04-24 | — | — | EP | disclosed |
| US-11964439-B2 | Reinforcement structure and producing method of reinforcement structure | NITTO DENKO CORPORATION (JP) | 2024-04-23 | — | — | US | disclosed |
| US-20240124621-A1 | CURABLE COMPOSITION AND USE THEREOF | HENKEL AG & CO KGAA (DE) | 2024-04-18 | — | — | US | disclosed |
| CN-117859183-A | Conductive adhesive composition for bonding solar cells | 汉高股份有限及两合公司 | 2024-04-09 | — | — | CN | disclosed |
| EP-4341354-A1 | CURABLE COMPOSITION AND USE THEREOF | Henkel AG & Co. KGaA (DE) | 2024-03-27 | — | — | EP | disclosed |
| CN-117757222-A | Epoxy resin composition and application thereof | 万华化学集团电子材料有限公司 | 2024-03-26 | — | — | CN | disclosed |
| WO-2024053282-A1 | POLYMER, COMPOSITION, CURED PRODUCT, LAMINATE, AND ELECTRONIC COMPONENT | JSR株式会社 | 2024-03-14 | — | — | WO | disclosed |
| CN-117651730-A | Resin composition and adhesive | 纳美仕有限公司 | 2024-03-05 | — | — | CN | disclosed |
| CN-117616093-A | Thermosetting adhesive sheet | 日东电工株式会社 | 2024-02-27 | — | — | CN | disclosed |
| EP-3770202-B1 | POLYMER, COMPOSITION, MOLDED ARTICLE, CURED PRODUCT AND LAMINATE | JSR CORP (JP) | 2024-02-21 | — | — | EP | disclosed |
| EP-3766919-B1 | POLYMER, COMPOSITION, MOLDED ARTICLE, CURED PRODUCT AND LAMINATE | JSR CORP (JP) | 2024-02-21 | — | — | EP | disclosed |
| CN-117580888-A | Epoxy resin composition, film, method for producing film, and cured product | 旭化成株式会社 | 2024-02-20 | — | — | CN | disclosed |
| EP-4316799-A1 | REINFORCING MATERIAL AND REINFORCING STRUCTURE | Nitto Denko Corporation (JP) | 2024-02-07 | — | — | EP | disclosed |
| EP-4301823-A1 | CURABLE ADHESIVE COMPOSITION COMPRISING MALEIMIDE AND THIOL | Henkel AG & Co. KGaA (DE) | 2024-01-10 | — | — | EP | disclosed |
| CN-117377731-A | Curable composition and use thereof | 汉高股份有限及两合公司 | 2024-01-09 | — | — | CN | disclosed |
| WO-2023228509-A1 | RESIN COMPOSITION, CURED SUBSTANCE, SEALING MATERIAL, ADHESIVE, INSULATING MATERIAL, COATING MATERIAL, PREPREG, MULTILAYER BODY, AND FIBER-REINFORCED COMPOSITE MATERIAL | 三菱瓦斯化学株式会社 | 2023-11-30 | — | — | WO | disclosed |
| WO-2023218862-A1 | THIOL COMPOUND AND USES THEREOF | 四国化成工業株式会社 | 2023-11-16 | — | — | WO | disclosed |
| WO-2023218702-A1 | CURING AGENT AND USE THEREOF | 四国化成工業株式会社 | 2023-11-16 | — | — | WO | disclosed |
| US-11807596-B2 | Thiol compounds, synthesis method therefor, and utilization of said thiol compounds | SHIKOKU CHEMICALS CORPORATION (JP) | 2023-11-07 | — | — | US | disclosed |
| EP-3713984-B1 | ADHESIVE TAPES BASED ON EPOXY RESIN REACTIVE ADHESIVES | TESA SE (DE) | 2023-11-01 | — | — | EP | disclosed |
| CN-116963902-A | Reinforcing material and reinforcing structure | 日东电工株式会社 | 2023-10-27 | — | — | CN | disclosed |
| US-20230345631-A1 | PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD | JSR CORPORATION (JP) | 2023-10-26 | — | — | US | disclosed |
| CN-116940647-A | Curable adhesive composition comprising maleimide and thiol | 汉高股份有限及两合公司 | 2023-10-24 | — | — | CN | disclosed |
| US-20230323108-A1 | METHOD FOR PRODUCING FRP PRECURSOR | RESONAC CORPORATION (JP) | 2023-10-12 | — | — | US | disclosed |
| US-11773207-B2 | Thiol compound, method for synthesizing same, and uses for said thiol compound | SHIKOKU CHEMICALS CORPORATION (JP) | 2023-10-03 | — | — | US | disclosed |
| CN-111278641-B | Laminate and reinforcing sheet | 日东电工株式会社 | 2023-10-03 | — | — | CN | disclosed |
| CN-116834174-A | Method and apparatus for producing FRP precursor | 株式会社力森诺科 | 2023-10-03 | — | — | CN | disclosed |
| WO-2023181846-A1 | RESIN COMPOSITION, ADHESIVE AGENT, ENCAPSULANT, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2023-09-28 | — | — | WO | disclosed |
| WO-2023181831-A1 | RESIN COMPOSITION, ADHESIVE OR ENCAPSULATION MATERIAL, CURED OBJECT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2023-09-28 | — | — | WO | disclosed |
| WO-2023181845-A1 | RESIN COMPOSITION, ADHESIVE, ENCAPSULATION MATERIAL, CURED OBJECT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2023-09-28 | — | — | WO | disclosed |
| WO-2023181847-A1 | RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2023-09-28 | — | — | WO | disclosed |
| CN-116715939-A | Curable resin composition, adhesive, and adhesive method | 味之素株式会社 | 2023-09-08 | — | — | CN | disclosed |
| WO-2023149394-A1 | POLYMER, COMPOSITION, CURED PRODUCT, LAMINATED BODY, AND ELECTRONIC COMPONENT | JSR株式会社 | 2023-08-10 | — | — | WO | disclosed |
| CN-116507482-A | Method for producing FRP precursor | 株式会社力森诺科 | 2023-07-28 | — | — | CN | disclosed |
| EP-4212302-A1 | METHOD FOR PRODUCING FRP PRECURSOR | Resonac Corporation (JP) | 2023-07-19 | — | — | EP | disclosed |
| CN-111788247-B | Coated particles | 味之素株式会社 | 2023-07-18 | — | — | CN | disclosed |
| US-11654656-B2 | Reinforcement sheet, reinforcement member, reinforcement kit, producing method of reinforcement sheet, and producing method of reinforcement member | NITTO DENKO CORPORATION (JP) | 2023-05-23 | — | — | US | disclosed |
| US-11654655-B2 | Reinforcement sheet, reinforcement member, reinforcement kit, producing method of reinforcement sheet, and producing method of reinforcement member | NITTO DENKO CORPORATION (JP) | 2023-05-23 | — | — | US | disclosed |
| CN-110054760-B | One-component resin composition | 味之素株式会社 | 2023-05-05 | — | — | CN | disclosed |
| CN-116063978-A | Curable composition | 味之素株式会社 | 2023-05-05 | — | — | CN | disclosed |
| WO-2023062938-A1 | METHOD FOR EJECTING RESIN COMPOSITION, METHOD FOR PRODUCING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2023-04-20 | — | — | WO | disclosed |
| WO-2023044701-A1 | THERMALLY CONDUCTIVE ADHESIVE COMPOSITION, PREPARATION METHOD AND USE THEREOF | HENKEL AG & CO. KGAA (DE) | 2023-03-30 | — | — | WO | disclosed |
| WO-2023042600-A1 | RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENT, CURED PRODUCTS OF THESE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2023-03-23 | — | — | WO | disclosed |
| WO-2023042599-A1 | RESIN COMPOSITION FOR JET DISPENSING, ADHESIVE FOR ELECTRONIC COMPONENT, CURED PRODUCTS THEREOF, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2023-03-23 | — | — | WO | disclosed |
| US-11608448-B2 | Thermosetting powder coating material, coating film using the coating material, and coated body comprising the coating film | SOMAR CORPORATION (JP) | 2023-03-21 | — | — | US | disclosed |
| US-11600778-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2023-03-07 | — | — | US | disclosed |
| WO-2023024071-A1 | ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITION FOR BONDING SOLAR CELLS | HENKEL AG & CO. KGAA (DE) | 2023-03-02 | — | — | WO | disclosed |
| US-20230062802-A1 | REINFORCING VIBRATION-DAMPING MATERIAL AND REINFORCING VIBRATION-DAMPING STRUCTURE | NITTO DENKO CORPORATION (JP) | 2023-03-02 | — | — | US | disclosed |
| WO-2023026872-A1 | EPOXY RESIN COMPOSITION | ナミックス株式会社 | 2023-03-02 | — | — | WO | disclosed |
| WO-2023017752-A1 | RESIN COMPOSITION AND ADHESIVE | ナミックス株式会社 | 2023-02-16 | — | — | WO | disclosed |
| US-20230035852-A1 | REINFORCING MATERIAL AND REINFORCING STRUCTURE | NITTO DENKO CORPORATION (JP) | 2023-02-02 | — | — | US | disclosed |
| WO-2023286499-A1 | EPOXY RESIN COMPOSITION, FILM, FILM PRODUCTION METHOD, AND CURED PRODUCT | 旭化成株式会社 | 2023-01-19 | — | — | WO | disclosed |
| WO-2023281906-A1 | HEAT-CURABLE ADHESIVE SHEET | 日東電工株式会社 | 2023-01-12 | — | — | WO | disclosed |
| WO-2023276773-A1 | RESIN COMPOSITION AND ADHESIVE | ナミックス株式会社 | 2023-01-05 | — | — | WO | disclosed |
| CN-111315719-B | Thiol compound, method for synthesizing same, and use of thiol compound | 四国化成工业株式会社 | 2022-12-27 | — | — | CN | disclosed |
| CN-110845415-B | Environment-friendly synthesis method of 2-ethyl-4-methylimidazole | 广东固研电子材料有限公司 | 2022-12-16 | — | — | CN | disclosed |
| CN-110845415-B | Environment-friendly synthesis method of 2-ethyl-4-methylimidazole | 广东固研电子材料有限公司 | 2022-12-16 | — | — | CN | disclosed |
| WO-2022241772-A1 | CURABLE COMPOSITION AND USE THEREOF | HENKEL AG & CO. KGAA (DE) | 2022-11-24 | — | — | WO | disclosed |
| US-11505651-B2 | Polymer, composition, molded article, cured product and laminate | JSR CORPORATION (JP) | 2022-11-22 | — | — | US | disclosed |
| EP-4088924-A1 | REINFORCING VIBRATION-DAMPING MATERIAL AND REINFORCING VIBRATION-DAMPING STRUCTURE | Nitto Denko Corporation (JP) | 2022-11-16 | — | — | EP | disclosed |
| EP-4082767-A1 | REINFORCING MATERIAL AND REINFORCING STRUCTURE | Nitto Denko Corporation (JP) | 2022-11-02 | — | — | EP | disclosed |
| US-11472957-B2 | Resin composition, adhesive, sealing material, dam agent, semiconductor device and image sensor module | NAMICS CORPORATION (JP) | 2022-10-18 | — | — | US | disclosed |
| WO-2022210095-A1 | POLYMER, COMPOSITION, CURED PRODUCT, MULTILAYER BODY, AND ELECTRONIC COMPONENT | JSR株式会社 | 2022-10-06 | — | — | WO | disclosed |
| CN-115124813-A | Resin composition | 味之素株式会社 | 2022-09-30 | — | — | CN | disclosed |
| WO-2022201838-A1 | REINFORCING MATERIAL AND REINFORCING STRUCTURE | 日東電工株式会社 | 2022-09-29 | — | — | WO | disclosed |
| US-20220306908-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2022-09-29 | — | — | US | disclosed |
| US-11453199-B2 | Laminate and reinforcing sheet | NITTO DENKO CORPORATION (JP) | 2022-09-27 | — | — | US | disclosed |
| US-20220293858-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO., LTD. (KR) | 2022-09-15 | — | — | US | disclosed |
| CN-113677814-B | Flux, solder paste, and electronic circuit board | 哈利玛化成株式会社 | 2022-09-13 | — | — | CN | disclosed |
| US-11441015-B2 | Coated particle | AJINOMOTO CO., INC. (JP) | 2022-09-13 | — | — | US | disclosed |
| WO-2022183481-A1 | CURABLE ADHESIVE COMPOSITION COMPRISING MALEIMIDE AND THIOL | HENKEL AG & CO. KGAA (DE) | 2022-09-09 | — | — | WO | disclosed |
| US-20220275252-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2022-09-01 | — | — | US | disclosed |
| CN-114867949-A | Reinforced vibration damping material and reinforced vibration damping structure | 日东电工株式会社 | 2022-08-05 | — | — | CN | disclosed |
| CN-114845869-A | Reinforcing material and reinforcing structure | 日东电工株式会社 | 2022-08-02 | — | — | CN | disclosed |
| US-20220235179-A1 | POLYMER, COMPOSITION, MOLDED ARTICLE, CURED PRODUCT AND LAMINATE | JSR CORPORATION (JP) | 2022-07-28 | — | — | US | disclosed |
| US-20220193834-A1 | FLUX, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD | HARIMA CHEMICALS, INCORPORATED (JP) | 2022-06-23 | — | — | US | disclosed |
| US-20220186083-A1 | Curable Adhesive Sheet and Production Method of Curable Adhesive Sheet | NITTO DENKO CORPORATION (JP) | 2022-06-16 | — | — | US | disclosed |
| US-11349077-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2022-05-31 | — | — | US | disclosed |
| US-20220153921-A1 | Resin Composition and Production Method of Bonded Structure | NITTO DENKO CORPORATION (JP) | 2022-05-19 | — | — | US | disclosed |
| EP-3998252-A1 | THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS | Shikoku Chemicals Corporation (JP) | 2022-05-18 | — | — | EP | disclosed |
| CN-111148630-B | Reinforcing sheet, reinforcing member, reinforcing kit, method for producing reinforcing sheet, and method for producing reinforcing member | 日东电工株式会社 | 2022-05-06 | — | — | CN | disclosed |
| CN-110431168-B | Curable composition and structure | 味之素株式会社 | 2022-04-29 | — | — | CN | disclosed |
| US-11312883-B2 | Conductive paste composition and ceramic electronic component having external electrodes formed using the same | BESTGRAPHENE CO., LTD (KR) | 2022-04-26 | — | — | US | disclosed |
| US-20220112330-A1 | THIOL COMPOUND, METHOD FOR SYNTHESIZING SAME, AND USES FOR SAID THIOL COMPOUND | SHIKOKU CHEMICALS CORPORATION (JP) | 2022-04-14 | — | — | US | disclosed |
| CN-109923947-B | Printed wiring board and semiconductor package | 昭和电工材料株式会社 | 2022-04-05 | — | — | CN | disclosed |
| CN-114276298-A | Thiol compound, method for synthesizing same, and use of thiol compound | 四国化成工业株式会社 | 2022-04-05 | — | — | CN | disclosed |
| US-20220096441-A1 | TREATMENT OF ACANTHAMOEBA OR BALAMUTHIA TROPHOZOITES AND/OR CYSTS | GEORGIA STATE UNIVERSITY RESEARCH FOUNDATION, INC. (US) | 2022-03-31 | — | — | US | disclosed |
| CN-114213333-A | Thiol compound, method for synthesizing same, and use of thiol compound | 四国化成工业株式会社 | 2022-03-22 | — | — | CN | disclosed |
| WO-2022054928-A1 | METHOD FOR PRODUCING FRP PRECURSOR | 昭和電工マテリアルズ株式会社 | 2022-03-17 | — | — | WO | disclosed |
| US-20220081551-A1 | FLAME-RETARDANT EPOXY COMPOSITION AND METHOD OF USING THE SAME | CYTEC INDUSTRIES INC | 2022-03-17 | — | — | US | disclosed |
| CN-114181231-A | Multi-sulfhydryl compound and preparation method thereof | 深圳市安伯斯科技有限公司 | 2022-03-15 | — | — | CN | disclosed |
| EP-3954796-A1 | FLUX, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD | Harima Chemicals, Incorporated (JP) | 2022-02-16 | — | — | EP | disclosed |
| EP-3950762-A1 | RESIN COMPOSITION AND METHOD FOR PRODUCING ADHESIVE STRUCTURE | NITTO DENKO CORPORATION (JP) | 2022-02-09 | — | — | EP | disclosed |
| EP-3950869-A1 | CURABLE ADHESIVE SHEET AND METHOD FOR PRODUCING CURABLE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2022-02-09 | — | — | EP | disclosed |
| EP-3541152-B1 | PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE | SHOWA DENKO MATERIALS CO LTD (JP) | 2022-01-05 | — | — | EP | disclosed |
| EP-3438166-B1 | RESIN COMPOSITE FILM INCLUDING CELLULOSE MICROFIBER LAYER | ASAHI CHEMICAL IND (JP) | 2021-12-15 | — | — | EP | disclosed |
| CN-113677814-A | Flux, solder paste, and electronic circuit board | 哈利玛化成株式会社 | 2021-11-19 | — | — | CN | disclosed |
| CN-113631677-A | Curable adhesive sheet and method for producing curable adhesive sheet | 日东电工株式会社 | 2021-11-09 | — | — | CN | disclosed |
| CN-113631621-A | Resin composition and method for producing bonded structure | 日东电工株式会社 | 2021-11-09 | — | — | CN | disclosed |
| CN-107530908-B | Method and apparatus for producing FRP precursor | 昭和电工材料株式会社 | 2021-11-05 | — | — | CN | disclosed |
| EP-3898836-A1 | FLAME-RETARDANT EPOXY COMPOSITION AND METHOD OF USING THE SAME | Cytec Industries, Inc. (US) | 2021-10-27 | — | — | EP | disclosed |
| EP-3199701-B1 | THIN-FILM SHEET INCLUDING CELLULOSE FINE-FIBER LAYER | ASAHI CHEMICAL IND (JP) | 2021-10-27 | — | — | EP | disclosed |
| EP-3714001-B1 | PROCESS FOR PRODUCING PRESSURE-SENSITIVE REACTIVE ADHESIVE TAPES | TESA SE (DE) | 2021-10-13 | — | — | EP | disclosed |
| CN-113444340-A | Resin composition | 味之素株式会社 | 2021-09-28 | — | — | CN | disclosed |
| US-20210292596-A1 | THERMOSETTING POWDER COATING MATERIAL, COATING FILM USING THE COATING MATERIAL, AND COATED BODY COMPRISING THE COATING FILM | SOMAR CORPORATION (JP) | 2021-09-23 | — | — | US | disclosed |
| CN-109715695-B | Resin composition, adhesive, sealing material, dam agent, semiconductor device, and image sensor module | 纳美仕有限公司 | 2021-09-14 | — | — | CN | disclosed |
| CN-106967208-B | Coated particles | 味之素株式会社 | 2021-09-10 | — | — | CN | disclosed |
| CN-113302240-A | Flame retardant epoxy compositions and methods of use thereof | 塞特工业公司 | 2021-08-24 | — | — | CN | disclosed |
| CN-113272274-A | Thiol compound, synthesis method thereof and application of thiol compound | 四国化成工业株式会社 | 2021-08-17 | — | — | CN | disclosed |
| US-11040517-B2 | Printed wiring board and semiconductor package | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2021-06-22 | — | — | US | disclosed |
| CN-112745793-A | Curable composition | 味之素株式会社 | 2021-05-04 | — | — | CN | disclosed |
| CN-112745770-A | Curable composition | 味之素株式会社 | 2021-05-04 | — | — | CN | disclosed |
| CN-112724596-A | Curable composition and cured product | 盛势达技研株式会社 | 2021-04-30 | — | — | CN | disclosed |
| CN-108884251-B | Resin composite film comprising cellulose microfiber layer | 旭化成株式会社 | 2021-04-27 | — | — | CN | disclosed |
| US-10933562-B2 | Method for producing FRP precursor and device for producing same | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2021-03-02 | — | — | US | disclosed |
| CN-112424255-A | Reactive diluent, composition, sealing material, cured product, substrate, electronic component, epoxy compound, and method for producing compound | 引能仕株式会社 | 2021-02-26 | — | — | CN | disclosed |
| WO-2021032727-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2021-02-25 | — | — | WO | disclosed |
| WO-2021032822-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2021-02-25 | — | — | WO | disclosed |
| CN-108276412-B | Glycolurils having glycidyl group and use thereof | 四国化成工业株式会社 | 2021-02-02 | — | — | CN | disclosed |
| US-10870724-B2 | High heat monomers and methods of use thereof | SABIC GLOBAL TECHNOLOGIES B.V. (NL) | 2020-12-22 | — | — | US | disclosed |
| CN-107011514-B | Photoand thermosetting resin composition | 味之素株式会社 | 2020-12-18 | — | — | CN | disclosed |
| US-20200369606-A1 | THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS | SHIKOKU CHEMICALS CORPORATION (JP) | 2020-11-26 | — | — | US | disclosed |
| CN-108102590-B | Adhesive resin and PTFE industrial hose prepared from adhesive resin | 漯河利通液压科技股份有限公司 | 2020-11-13 | — | — | CN | disclosed |
| CN-111902511-A | Sealing adhesive | 味之素株式会社 | 2020-11-06 | — | — | CN | disclosed |
| US-20200346430-A1 | LAMINATE AND REINFORCING SHEET | NITTO DENKO CORPORATION (JP) | 2020-11-05 | — | — | US | disclosed |
| US-20200339782-A1 | COATED PARTICLE | AJINOMOTO CO., INC. (JP) | 2020-10-29 | — | — | US | disclosed |
| CN-111788247-A | Coated particles | 味之素株式会社 | 2020-10-16 | — | — | CN | disclosed |
| EP-3718758-A1 | REINFORCED STRUCTURE AND METHOD FOR PRODUCING REINFORCED STRUCTURE | Nitto Denko Corporation (JP) | 2020-10-07 | — | — | EP | disclosed |
| WO-2020196119-A1 | CURABLE ADHESIVE SHEET AND METHOD FOR PRODUCING CURABLE ADHESIVE SHEET | 日東電工株式会社 | 2020-10-01 | — | — | WO | disclosed |
| WO-2020196118-A1 | RESIN COMPOSITION AND METHOD FOR PRODUCING ADHESIVE STRUCTURE | 日東電工株式会社 | 2020-10-01 | — | — | WO | disclosed |
| US-20200308457-A1 | CONDUCTIVE PASTE COMPOSITION AND CERAMIC ELECTRONIC COMPONENT HAVING EXTERNAL ELECTRODES FORMED USING THE SAME | UDUCK Advanced Materials Co., Ltd. (KR) | 2020-10-01 | — | — | US | disclosed |
| EP-3714001-A1 | PROCESS FOR PRODUCING PRESSURE-SENSITIVE REACTIVE ADHESIVE TAPES | TESA SE (DE) | 2020-09-30 | — | — | EP | disclosed |
| EP-3713984-A1 | ADHESIVE TAPES BASED ON EPOXY RESIN REACTIVE ADHESIVES | TESA SE (DE) | 2020-09-30 | — | — | EP | disclosed |
| US-20200298501-A1 | REINFORCEMENT STRUCTURE AND PRODUCING METHOD OF REINFORCEMENT STRUCTURE | NITTO DENKO CORPORATION (JP) | 2020-09-24 | — | — | US | disclosed |
| US-20200282703-A1 | REINFORCEMENT SHEET, REINFORCEMENT MEMBER, REINFORCEMENT KIT, PRODUCING METHOD OF REINFORCEMENT SHEET, AND PRODUCING METHOD OF REINFORCEMENT MEMBER | NITTO DENKO CORPORATION (JP) | 2020-09-10 | — | — | US | disclosed |
| US-20200282704-A1 | REINFORCEMENT SHEET, REINFORCEMENT MEMBER, REINFORCEMENT KIT, PRODUCING METHOD OF REINFORCEMENT SHEET, AND PRODUCING METHOD OF REINFORCEMENT MEMBER | NITTO DENKO CORPORATION (JP) | 2020-09-10 | — | — | US | disclosed |
| EP-3705289-A1 | LAMINATE AND REINFORCING SHEET | Nitto Denko Corporation (JP) | 2020-09-09 | — | — | EP | disclosed |
| EP-3702348-A1 | THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS | Shikoku Chemicals Corporation (JP) | 2020-09-02 | — | — | EP | disclosed |
| EP-3689600-A1 | REINFORCING SHEET, REINFORCING MEMBER, REINFORCING KIT, PRODUCTION METHOD FOR REINFORCING SHEET, AND PRODUCTION METHOD FOR REINFORCING MEMBER | Nitto Denko Corporation (JP) | 2020-08-05 | — | — | EP | disclosed |
| EP-3689601-A1 | REINFORCING SHEET, REINFORCING MEMBER, REINFORCING KIT, PRODUCTION METHOD FOR REINFORCING SHEET, AND PRODUCTION METHOD FOR REINFORCING MEMBER | Nitto Denko Corporation (JP) | 2020-08-05 | — | — | EP | disclosed |
| WO-2020145111-A1 | THIOL COMPOUND, METHOD FOR SYNTHESIZING SAME, AND USES FOR SAID THIOL COMPOUND | 四国化成工業株式会社 | 2020-07-16 | — | — | WO | disclosed |
| US-10703070-B2 | Resin composite film including cellulose microfiber layer | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-07-07 | — | — | US | disclosed |
| WO-2020138355-A1 | PAINT COMPOSITION SET, METHOD FOR FORMING MULTILAYER COATING FILM, ROAD MARKING METHOD, AND METHOD FOR REMOVING ROAD MARKING | 日本ペイント・インダストリアルコーティングス株式会社 | 2020-07-02 | — | — | WO | disclosed |
| EP-3118236-B1 | RESIN COMPOSITION AND CURED PRODUCT THEREOF | OMRON TATEISI ELECTRONICS CO (JP) | 2020-07-01 | — | — | EP | disclosed |
| CN-111356582-A | Reinforcing structure and method for manufacturing reinforcing structure | 日东电工株式会社 | 2020-06-30 | — | — | CN | disclosed |
| WO-2020131946-A1 | FLAME-RETARDANT EPOXY COMPOSITION AND METHOD OF USING THE SAME | CYTEC INDUSTRIES INC. (US) | 2020-06-25 | — | — | WO | disclosed |
| CN-111315719-A | Thiol compound, method for synthesizing same, and use of thiol compound | 四国化成工业株式会社 | 2020-06-19 | — | — | CN | disclosed |
| CN-107406741-B | Semiconductor device and image sensor module | 纳美仕有限公司 | 2020-06-12 | — | — | CN | disclosed |
| CN-111278641-A | Laminate and reinforcing sheet | 日东电工株式会社 | 2020-06-12 | — | — | CN | disclosed |
| CN-111163937-A | Reinforcing sheet, reinforcing member, reinforcing kit, method for producing reinforcing sheet, and method for producing reinforcing member | 日东电工株式会社 | 2020-05-15 | — | — | CN | disclosed |
| CN-111148630-A | Reinforcing sheet, reinforcing member, reinforcing kit, method for producing reinforcing sheet, and method for producing reinforcing member | 日东电工株式会社 | 2020-05-12 | — | — | CN | disclosed |
| US-10636971-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2020-04-28 | — | — | US | disclosed |
| US-20200123375-A1 | RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, DAM AGENT, SEMICONDUCTOR DEVICE AND IMAGE SENSOR MODULE | NAMICS CORPORATION (JP) | 2020-04-23 | — | — | US | disclosed |
| CN-110845415-A | Environment-friendly synthesis method of 2-ethyl-4-methylimidazole | 广州市固研电子材料有限公司 | 2020-02-28 | — | — | CN | disclosed |
| CN-110845415-A | Environment-friendly synthesis method of 2-ethyl-4-methylimidazole | 广州市固研电子材料有限公司 | 2020-02-28 | — | — | CN | disclosed |
| US-20200058876-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG MOBILE DISPLAY CO., LTD. (KR) | 2020-02-20 | — | — | US | disclosed |
| US-10550131-B2 | Mercaptoethylglycol uril compound and utilization thereof | SHIKOKU CHEMICALS CORPORATION (JP) | 2020-02-04 | — | — | US | disclosed |
| WO-2020017141-A1 | REACTIVE DILUENT, COMPOSITION, SEALING MATERIAL, CURED PRODUCT, SUBSTRATE, ELECTRONIC COMPONENT, EPOXY COMPOUND AND METHOD FOR PRODUCING COMPOUND | ＪＸＴＧエネルギー株式会社 | 2020-01-23 | — | — | WO | disclosed |
| CN-107428781-B | Mercapto ethyl glycoluril compound and application thereof | 四国化成工业株式会社 | 2020-01-10 | — | — | CN | disclosed |
| CN-110644290-A | Film sheet comprising cellulose microfine fiber layer | 旭化成株式会社 | 2020-01-03 | — | — | CN | disclosed |
| US-10472461-B2 | Semiconductor device and image sensor module | NAMICS CORPORATION (JP) | 2019-11-12 | — | — | US | disclosed |
| US-10465037-B2 | High heat monomers and methods of use thereof | SABIC GLOBAL TECHNOLOGIES B.V. (NL) | 2019-11-05 | — | — | US | disclosed |
| US-10461255-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2019-10-29 | — | — | US | disclosed |
| US-10450407-B2 | Coated particles | AJINOMOTO CO., INC. (JP) | 2019-10-22 | — | — | US | disclosed |
| US-20190315094-A1 | PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE | RESONAC CORPORATION (JP) | 2019-10-17 | — | — | US | disclosed |
| US-10427394-B2 | Method for curing resin composition | OMRON CORPORATION (JP) | 2019-10-01 | — | — | US | disclosed |
| WO-2019181789-A1 | SEALING ADHESIVE | 味の素株式会社 | 2019-09-26 | — | — | WO | disclosed |
| EP-3541152-A1 | PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE | Hitachi Chemical Company, Ltd. (JP) | 2019-09-18 | — | — | EP | disclosed |
| EP-3269722-B1 | MERCAPTOETHYLGLYCOL URIL COMPOUND AND UTILIZATION THEREOF | SHIKOKU CHEM (JP) | 2019-06-19 | — | — | EP | disclosed |
| WO-2019101916-A1 | CURABLE COMPOSITION BASED ON FATTY-ACID MODIFIED EPOXY RESINS AND CURING AGENTS | TESA SE (DE) | 2019-05-31 | — | — | WO | disclosed |
| WO-2019101914-A1 | ADHESIVE TAPES BASED ON EPOXY RESIN REACTIVE ADHESIVES | TESA SE (DE) | 2019-05-31 | — | — | WO | disclosed |
| WO-2019101913-A1 | PROCESS FOR PRODUCING PRESSURE-SENSITIVE REACTIVE ADHESIVE TAPES | TESA SE (DE) | 2019-05-31 | — | — | WO | disclosed |
| US-20190118508-A1 | Resin Composite Film Including Cellulose Microfiber Layer | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-04-25 | — | — | US | disclosed |
| US-20190074444-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO., LTD. (KR) | 2019-03-07 | — | — | US | disclosed |
| US-10221282-B2 | Resin composition, adhesive agent, and sealing agent | NAMICS CORPORATION (JP) | 2019-03-05 | — | — | US | disclosed |
| EP-3438166-A1 | RESIN COMPOSITE FILM INCLUDING CELLULOSE MICROFIBER LAYER | Asahi Kasei Kabushiki Kaisha (JP) | 2019-02-06 | — | — | EP | disclosed |
| US-20180345539-A1 | METHOD FOR PRODUCING FRP PRECURSOR AND DEVICE FOR PRODUCING SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2018-12-06 | — | — | US | disclosed |
| US-20180345540-A1 | METHOD FOR PRODUCING FRP PRECURSOR AND DEVICE FOR PRODUCING SAME | RESONAC CORPORATION (JP) | 2018-12-06 | — | — | US | disclosed |
| US-10138348-B2 | Resin composition and cured product thereof | OMRON CORPORATION (JP) | 2018-11-27 | — | — | US | disclosed |
| US-10128462-B2 | Organic light emitting diode display and manufacturing method thereof | SAMSUNG DISPLAY CO., LTD. (KR) | 2018-11-13 | — | — | US | disclosed |
| EP-3369735-A1 | GLYCOLURILS HAVING FUNCTIONAL GROUP AND USE THEREOF | Shikoku Chemicals Corporation (JP) | 2018-09-05 | — | — | EP | disclosed |
| US-10059827-B2 | Conductive compositions and methods of using them | CITIBANK, N.A. | 2018-08-28 | — | — | US | disclosed |
| EP-3075736-B1 | MERCAPTOALKYL GLYCOLURILS AND USE OF SAME | SHIKOKU CHEM (JP) | 2018-08-22 | — | — | EP | disclosed |
| US-10030023-B2 | Mercaptoalkylglycolurils and use of same | SHIKOKU CHEMICALS CORPORATION (JP) | 2018-07-24 | — | — | US | disclosed |
| US-10000622-B2 | Glycolurils having functional groups and use thereof | SHIKOKU CHEMICALS CORPORATION (JP) | 2018-06-19 | — | — | US | disclosed |
| EP-2492991-B1 | THERMALLY CONDUCTIVE MEMBER, AND BATTERY DEVICE USING SAME | NITTO DENKO CORP (JP) | 2018-04-18 | — | — | EP | disclosed |
| EP-2216171-B1 | REINFORCING MATERIAL FOR OUTER PANEL AND METHOD FOR REINFORCING OUTER PANEL | NITTO DENKO CORP (JP) | 2018-04-11 | — | — | EP | disclosed |
| US-20180051127-A1 | SEMICONDUCTOR DEVICE AND IMAGE SENSOR MODULE | NAMICS CORPORATION (JP) | 2018-02-22 | — | — | US | disclosed |
| US-20180051038-A1 | MERCAPTOETHYLGLYCOL URIL COMPOUND AND UTILIZATION THEREOF | SHIKOKU CHEMICALS CORPORATION (JP) | 2018-02-22 | — | — | US | disclosed |
| US-20180044478-A1 | RESIN COMPOSITION, ADHESIVE AGENT, AND SEALING AGENT | NAMICS CORPORATION (JP) | 2018-02-15 | — | — | US | disclosed |
| US-20180026191-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO., LTD. (KR) | 2018-01-25 | — | — | US | disclosed |
| EP-3269722-A1 | MERCAPTOETHYLGLYCOL URIL COMPOUND AND UTILIZATION THEREOF | Shikoku Chemicals Corporation (JP) | 2018-01-17 | — | — | EP | disclosed |
| US-9806261-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2017-10-31 | — | — | US | disclosed |
| US-9783704-B2 | Double-sided adhesive tape | NITTO DENKO CORPORATION (JP) | 2017-10-10 | — | — | US | disclosed |
| US-20170283565-A1 | THIN-FILM SHEET INCLUDING CELLULOSE FINE-FIBER LAYER | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2017-10-05 | — | — | US | disclosed |
| WO-2017166188-A1 | A LATENT CURING ACCELERATOR COMPOSITION AND A ONE-PART CURABLE ADHESIVE COMPOSITION COMPRISING THE SAME | HENKEL AG & CO. KGAA (DE) | 2017-10-05 | — | — | WO | disclosed |
| EP-3199701-A1 | THIN-FILM SHEET INCLUDING CELLULOSE FINE-FIBER LAYER | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2017-08-02 | — | — | EP | disclosed |
| US-20170158806-A1 | HIGH HEAT MONOMERS AND METHODS OF USE THEREOF | SHPP GLOBAL TECHNOLOGIES B.V. (NL) | 2017-06-08 | — | — | US | disclosed |
| EP-3172201-A1 | HIGH HEAT MONOMERS AND METHODS OF USE THEREOF | SABIC Global Technologies B.V. (NL) | 2017-05-31 | — | — | EP | disclosed |
| US-20170137563-A1 | COATED PARTICLES | AJINOMOTO CO., INC. (JP) | 2017-05-18 | — | — | US | disclosed |
| US-20170084868-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF | SAMSUNG DISPLAY CO., LTD. (KR) | 2017-03-23 | — | — | US | disclosed |
| US-20170066230-A1 | METHOD FOR CURING RESIN COMPOSITION | OMRON CORPORATION (JP) | 2017-03-09 | — | — | US | disclosed |
| US-20170066899-A1 | RESIN COMPOSITION AND CURED PRODUCT THEREOF | OMRON CORPORATION (JP) | 2017-03-09 | — | — | US | disclosed |
| US-9570707-B2 | Organic light emitting diode display and manufacturing method thereof | SAMSUNG DISPLAY CO., LTD. (KR) | 2017-02-14 | — | — | US | disclosed |
| EP-3118237-A1 | METHOD FOR CURING RESIN COMPOSITION | Omron Corporation (JP) | 2017-01-18 | — | — | EP | disclosed |
| EP-3118236-A1 | RESIN COMPOSITION AND CURED PRODUCT THEREOF | Omron Corporation (JP) | 2017-01-18 | — | — | EP | disclosed |
| US-20160297951-A1 | GLYCOLURILS HAVING FUNCTIONAL GROUPS AND USE THEREOF | SHIKOKU CHEMICALS CORPORATION (JP) | 2016-10-13 | — | — | US | disclosed |
| US-20160289237-A1 | MERCAPTOALKYLGLYCOLURILS AND USE OF SAME | SHIKOKU CHEMICALS CORPORATION (JP) | 2016-10-06 | — | — | US | disclosed |
| EP-3075735-A1 | GLYCOLURILS HAVING FUNCTIONAL GROUP AND USE THEREOF | Shikoku Chemicals Corporation (JP) | 2016-10-05 | — | — | EP | disclosed |
| EP-3075736-A1 | MERCAPTOALKYL GLYCOLURILS AND USE OF SAME | Shikoku Chemicals Corporation (JP) | 2016-10-05 | — | — | EP | disclosed |
| US-20160251495-A1 | Conductive Compositions and Methods of Using Them | CITIBANK, N.A. | 2016-09-01 | — | — | US | disclosed |
| US-9355938-B2 | Conductive compositions and methods of using them | CITIBANK, N.A. | 2016-05-31 | — | — | US | disclosed |
| US-9257673-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2016-02-09 | — | — | US | disclosed |
| WO-2016014536-A1 | HIGH HEAT MONOMERS AND METHODS OF USE THEREOF | SABIC GLOBAL TECHNOLOGIES B.V. (NL) | 2016-01-28 | — | — | WO | disclosed |
| US-20150357601-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF | YOULCHON CHEMICAL CO., LTD. (KR) | 2015-12-10 | — | — | US | disclosed |
| US-9112180-B2 | Organic light emitting diode display and manufacturing method thereof | SAMSUNG DISPLAY CO., LTD. (KR) | 2015-08-18 | — | — | US | disclosed |
| US-20150090922-A1 | THERMALLY CONDUCTIVE SHEET | NITTO DENKO CORPORATION (JP) | 2015-04-02 | — | — | US | disclosed |
| US-20150069376-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO LTD (KR) | 2015-03-12 | — | — | US | disclosed |
| US-20140367883-A1 | PRODUCING METHOD OF THERMALLY CONDUCTIVE SHEET | NITTO DENKO CORPORATION (JP) | 2014-12-18 | — | — | US | disclosed |
| US-8865334-B2 | Thermally conductive member, and battery device using the same | NITTO DENKO CORPORATION (JP) | 2014-10-21 | — | — | US | disclosed |
| US-20140287543-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO., LTD. (KR) | 2014-09-25 | — | — | US | disclosed |
| US-8829772-B2 | Organic light emitting diode display with heat dissipating adhesive | SAMSUNG DISPLAY CO., LTD. (KR) | 2014-09-09 | — | — | US | disclosed |
| US-8822058-B2 | — | — | 2014-09-02 | — | — | US | disclosed |
| US-8796712-B2 | Phosphor layer and light-emitting device | NITTO DENKO CORPORATION (JP) | 2014-08-05 | — | — | US | disclosed |
| US-8786186-B2 | Organic light emitting diode display with adhesive layer | SAMSUNG DISPLAY CO., LTD. (KR) | 2014-07-22 | — | — | US | disclosed |
| EP-1493558-B1 | Reinforcing sheet for steel plate | NITTO DENKO CORP (JP) | 2014-06-11 | — | — | EP | disclosed |
| US-8749978-B2 | Power module | NITTO DENKO CORPORATION (JP) | 2014-06-10 | — | — | US | disclosed |
| US-20140153167-A1 | CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM | ALPHA METALS, INC. (US) | 2014-06-05 | — | — | US | disclosed |
| US-8716733-B2 | Transfer sheet for phosphor layer and light-emitting device | NITTO DENKO CORPORATION (JP) | 2014-05-06 | — | — | US | disclosed |
| US-8665404-B2 | Liquid crystal cell substrate, liquid crystal cell, liquid crystal panel, and liquid crystal display | NITTO DENKO CORPORATION (JP) | 2014-03-04 | — | — | US | disclosed |
| US-20140030539-A1 | FOAMING COMPOSITION FOR FILLING AND SEALING, FOAMING MEMBER FOR FILLING AND SEALING, AND FOAM FOR FILLING AND SEALING | NITTO DENKO CORPORATION (JP) | 2014-01-30 | — | — | US | disclosed |
| EP-2684925-A1 | DOUBLE-COATED ADHESIVE TAPE | Nitto Denko Corporation (JP) | 2014-01-15 | — | — | EP | disclosed |
| US-20130344323-A1 | DOUBLE-SIDED ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2013-12-26 | — | — | US | disclosed |
| US-8597812-B2 | Thermally conductive member and battery pack device using same | NITTO DENKO CORPORATION (JP) | 2013-12-03 | — | — | US | disclosed |
| US-8592844-B2 | Light-emitting diode device | NITTO DENKO CORPORATION (JP) | 2013-11-26 | — | — | US | disclosed |
| US-20130302659-A1 | THERMALLY CONDUCTIVE MEMBER, AND BATTERY DEVICE USING THE SAME | NITTO DENKO CORPORATION (JP) | 2013-11-14 | — | — | US | disclosed |
| US-20130292652-A1 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | SAMSUNG DISPLAY CO., LTD. (KR) | 2013-11-07 | — | — | US | disclosed |
| EP-1604816-B1 | Reinforcing sheet for steel plate | NITTO DENKO CORP (JP) | 2013-10-23 | — | — | EP | disclosed |
| US-8564140-B2 | Mono-acid hybrid conductive composition and method | ALPHA METALS, INC. (US) | 2013-10-22 | — | — | US | disclosed |
| US-8557896-B2 | Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film | CHEIL INDUSTRIES, INC. (KR) | 2013-10-15 | — | — | US | disclosed |
| US-8547465-B2 | Imaging device module | NITTO DENKO CORPORATION (JP) | 2013-10-01 | — | — | US | disclosed |
| US-20130153142-A1 | REINFORCING SHEET AND REINFORCING METHOD | NITTO DENKO CORPORATION (JP) | 2013-06-20 | — | — | US | disclosed |
| US-20130139874-A1 | CONDUCTIVE ADHESIVE SHEET, METHOD FOR PRODUCING THE SAME, COLLECTOR ELECTRODE, AND SOLAR CELL MODULE | NITTO DENKO CORPORATION (JP) | 2013-06-06 | — | — | US | disclosed |
| EP-2599846-A1 | Conductive adhesive sheet, method for producing the same, collector electrode, and solar cell module | NITTO DENKO CORPORATION (JP) | 2013-06-05 | — | — | EP | disclosed |
| US-20130101772-A1 | THERMALLY CONDUCTIVE REINFORCING COMPOSITION, THERMALLY CONDUCTIVE REINFORCING SHEET, REINFORCING METHOD, AND REINFORCING STRUCTURE | NITTO DENKO CORPORATION (JP) | 2013-04-25 | — | — | US | disclosed |
| EP-1772473-B1 | EPOXY RESIN, METHOD FOR PRODUCING SAME AND EPOXY RESIN COMPOSITION THEREOF | KUKDO CHEMICAL CO LTD (KR) | 2013-03-27 | — | — | EP | disclosed |
| US-20120326194-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF | SAMSUNG DISPLAY CO., LTD. (KR) | 2012-12-27 | — | — | US | disclosed |
| US-20120328889-A1 | THERMALLY FOAMABLE RESIN COMPOSITION, THERMALLY FOAMABLE RESIN SHEET, THERMALLY FOAMABLE LAMINATE, AND FOAMED MATERIAL AND PROCESS FOR PRODUCTION THEREOF | NITTO DENKO CORPORATION (JP) | 2012-12-27 | — | — | US | disclosed |
| US-20120313499-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG MOBILE DISPLAY CO., LTD. (KR) | 2012-12-13 | — | — | US | disclosed |
| US-20120313508-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG MOBILE DISPLAY CO., LTD. (KR) | 2012-12-13 | — | — | US | disclosed |
| US-20120285674-A1 | THERMAL CONDUCTIVE SHEET, INSULATING SHEET, AND HEAT DISSIPATING MEMBER | NITTO DENKO CORPORATION (JP) | 2012-11-15 | — | — | US | disclosed |
| US-20120286194-A1 | THERMAL CONDUCTIVE SHEET, INSULATING SHEET, AND HEAT DISSIPATING MEMBER | NITTO DENKO CORPORATION (JP) | 2012-11-15 | — | — | US | disclosed |
| US-8298673-B2 | Vibration-damping reinforcement composition, vibration-damping reinforcement material, and method for vibration damping and reinforcement of thin sheet | NITTO DENKO CORPORATION (JP) | 2012-10-30 | — | — | US | disclosed |
| US-20120219838-A1 | THERMALLY CONDUCTIVE MEMBER AND BATTERY PACK DEVICE USING SAME | NITTO SHINKO CORPORATION (JP) | 2012-08-30 | — | — | US | disclosed |
| EP-2492991-A1 | THERMALLY CONDUCTIVE MEMBER, AND BATTERY DEVICE USING SAME | Nitto Denko Corporation (JP) | 2012-08-29 | — | — | EP | disclosed |
| US-8211540-B2 | Adhesive film composition, associated dicing die bonding film, die package, and associated methods | CHEIL INDUSTRIES, INC. (KR) | 2012-07-03 | — | — | US | disclosed |
| US-20120115382-A1 | MAGNETIC REINFORCING COMPOSITION, REINFORCING SHEET AND METHODS FOR PRODUCING THE SAME | Nitto Denko Automotive, Inc. (US) | 2012-05-10 | — | — | US | disclosed |
| US-20120101246-A1 | Epoxy Resin, Method for Producing Same and Epoxy Resin Composition Thereof | KUKDO CHEMICAL CO., LTD. (KOREAN CORPORATION) (KR) | 2012-04-26 | — | — | US | disclosed |
| US-20120055545-A1 | CONDUCTIVE ADHESIVE MEMBER AND SOLAR CELL MODULE | NITTO DENKO CORPORATION (JP) | 2012-03-08 | — | — | US | disclosed |
| EP-2426735-A1 | Conductive adhesive member and solar cell module | Nitto Denko Corporation (JP) | 2012-03-07 | — | — | EP | disclosed |
| US-20120029117-A1 | ADHESIVE FILM FOR SEMICONDUCTOR ASSEMBLY | CHEIL INDUSTRIES, INC. (KR) | 2012-02-02 | — | — | US | disclosed |
| US-8092906-B2 | Reduced volatile organic compound emissions; reinforcement, vibration suppression; epoxy resin impregnated glass fiber cloth | NITTO DENKO CORPORATION (JP) | 2012-01-10 | — | — | US | disclosed |
| US-20110316032-A1 | PHOSPHOR LAYER AND LIGHT-EMITTING DEVICE | NITTO DENKO CORPORATION (JP) | 2011-12-29 | — | — | US | disclosed |
| US-20110316031-A1 | TRANSFER SHEET FOR PHOSPHOR LAYER AND LIGHT-EMITTING DEVICE | NITTO DENKO CORPORATION (JP) | 2011-12-29 | — | — | US | disclosed |
| US-20110267557-A1 | BACK LIGHT AND LIQUID CRYSTAL DISPLAY DEVICE | NITTO DENKO CORPORATION (JP) | 2011-11-03 | — | — | US | disclosed |
| US-20110259566-A1 | THERMAL CONDUCTIVE SHEET | NITTO DENKO CORPORATION (JP) | 2011-10-27 | — | — | US | disclosed |
| US-20110259568-A1 | THERMAL CONDUCTIVE SHEET | NITTO DENKO CORPORATION (JP) | 2011-10-27 | — | — | US | disclosed |
| US-20110262728-A1 | THERMAL CONDUCTIVE SHEET, LIGHT-EMITTING DIODE MOUNTING SUBSTRATE, AND THERMAL CONDUCTIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2011-10-27 | — | — | US | disclosed |
| US-20110259565-A1 | HEAT DISSIPATION STRUCTURE | NITTO DENKO CORPORATION (JP) | 2011-10-27 | — | — | US | disclosed |
| US-20110259567-A1 | THERMAL CONDUCTIVE SHEET | NITTO DENKO CORPORATION (JP) | 2011-10-27 | — | — | US | disclosed |
| US-20110259569-A1 | THERMAL CONDUCTIVE SHEET | NITTO DENKO CORPORATION (JP) | 2011-10-27 | — | — | US | disclosed |
| US-20110260185-A1 | LIGHT-EMITTING DIODE DEVICE | NITTO DENKO CORPORATION (JP) | 2011-10-27 | — | — | US | disclosed |
| US-20110261535-A1 | POWER MODULE | NITTO DENKO CORPORATION (JP) | 2011-10-27 | — | — | US | disclosed |
| US-20110259564-A1 | THERMAL CONDUCTIVE SHEET | NITTO DENKO CORPORATION (JP) | 2011-10-27 | — | — | US | disclosed |
| US-20110261242-A1 | IMAGING DEVICE MODULE | NITTO DENKO CORPORATION (JP) | 2011-10-27 | — | — | US | disclosed |
| US-8017533-B2 | Multilayer; confining sheet and foamed reinforcing layer | NITTO DENKO CORPORATION (JP) | 2011-09-13 | — | — | US | disclosed |
| US-20110160339-A1 | ADHESIVE COMPOSITION FOR A SEMICONDUCTOR DEVICE, ADHESIVE FILM, AND DICING DIE-BONDING FILM | CHEIL INDUSTRIES, INC. (KR) | 2011-06-30 | — | — | US | disclosed |
| EP-2334728-A2 | CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM | Fry's Metals, Inc. (US) | 2011-06-22 | — | — | EP | disclosed |
| US-7927514-B2 | Microcapsule-based hardener for epoxy resin, masterbatch-based hardener composition for epoxy resin, one-part epoxy resin composition, and processed good | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2011-04-19 | — | — | US | disclosed |
| US-20110045278-A1 | Filling foam composition and foam filling member | NITTO DENKO CORPORATION (JP) | 2011-02-24 | — | — | US | disclosed |
| US-20110031758-A1 | Reinforcing sheet for wind power generator blades, reinforcing structure of wind power generator blade, wind power generator, method for reinforcing the wind power generator blade | NITTO DENKO CORPORATION (JP) | 2011-02-10 | — | — | US | disclosed |
| US-20110031759-A1 | Foam filling material for wind power generator blades, foam filling member for wind power generator blades, wind power generator blade, wind power generator, and method for producing the wind power generator blade | NITTO DENKO CORPORATION (JP) | 2011-02-10 | — | — | US | disclosed |
| US-20110031757-A1 | Vibration damping sheet for wind power generator blades, vibration damping structure of wind power generator blade, wind power generator, and method for damping vibration of wind power generator blade | NITTO DENKO CORPORATION (JP) | 2011-02-10 | — | — | US | disclosed |
| US-7875344-B2 | improved adhesiveness and handleability in a wide temperature range around room temperature; acrylonitrile-butadiene rubber | NITTO DENKO CORPORATION (JP) | 2011-01-25 | — | — | US | disclosed |
| US-7854860-B2 | High-speed curable two-part liquid epoxy resin adhesivescomprising a microcapsulated hardener for comprising an amineadduct of a epoxy resin and a covering or shell of an epoxyresin having infrared-sensitve binding groups; storage stability; sovent resistance; high adhesiveness; dispersibility | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2010-12-21 | — | — | US | disclosed |
| US-20100271580-A1 | LIQUID CRYSTAL CELL SUBSTRATE, LIQUID CRYSTAL CELL, LIQUID CRYSTAL PANEL, AND LIQUID CRYSTAL DISPLAY | NITTO DENKO CORPORATION (JP) | 2010-10-28 | — | — | US | disclosed |
| US-7820772-B2 | comprises an amine adduct and a low-molecular amine compound 2-methylimidazole; bisphenol A type epoxy resin reacted with 2-methylimidazole as the amine adduct; excellent hardening property at low temperature, and storage stability at low and high temperature; adhesives; sealant | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2010-10-26 | — | — | US | disclosed |
| US-20100256302-A1 | VIBRATION-DAMPING REINFORCEMENT COMPOSITION, VIBRATION-DAMPING REINFORCEMENT MATERIAL, AND METHOD FOR VIBRATION DAMPING AND REINFORCEMENT OF THIN SHEET | NITTO DENKO CORPORATION (JP) | 2010-10-07 | — | — | US | disclosed |
| EP-2216171-A2 | Reinforcing Material for Outer Panel and Method for Reinforcing Outer Panel | NITTO DENKO CORPORATION (JP) | 2010-08-11 | — | — | EP | disclosed |
| US-20100196689-A1 | REINFORCING MATERIAL FOR OUTER PANEL AND METHOD FOR REINFORCING OUTER PANEL | NITTO DENKO CORPORATION (JP) | 2010-08-05 | — | — | US | disclosed |
| US-20100178482-A1 | Reinforcing material for vehicle ceiling material | NITTO DENKO CORPORATION (JP) | 2010-07-15 | — | — | US | disclosed |
| US-20100168368-A1 | Epoxy Resin, Method for Producing Same and Epoxy Resin Composition Thereof | KUKDO CHEMICAL CO., LTD. (KOREAN CORPORATION) (KR) | 2010-07-01 | — | — | US | disclosed |
| US-7714976-B2 | Optical resin sheet and liquid crystal cell substrate including the same, liquid crystal display device, substrate for an image display device, and image display device | NITTO DENKO CORPORATION (JP) | 2010-05-11 | — | — | US | disclosed |
| US-20100084757-A1 | CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM | CITIBANK, N.A. | 2010-04-08 | — | — | US | disclosed |
| WO-2010036953-A2 | CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM | FRY'S METALS, INC. (US) | 2010-04-01 | — | — | WO | disclosed |
| US-20100055416-A1 | COMPOSITE AND MANUFACTURING METHOD THEREOF | SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) | 2010-03-04 | — | — | US | disclosed |
| US-20090261298-A1 | High-speed curable two-part liquid epoxy resin adhesivescomprising a microcapsulated hardener for comprising an amineadduct of a epoxy resin and a covering or shell of an epoxyresin having infrared-sensitve binding groups; storage stability; sovent resistance; high adhesiveness; dispersibility | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2009-10-22 | — | — | US | disclosed |
| US-20090194124-A1 | Hair Shaping Kit and Process Comprising at Least One Non-Hydroxide Imine | MALLE GERARD | 2009-08-06 | — | — | US | disclosed |
| US-20090186962-A1 | Microcapsule-Based Hardener for Epoxy Resin, Masterbatch-Based Hardener Composition for Epoxy Resin, One-Part Epoxy Resin Composition, and Processed Good | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2009-07-23 | — | — | US | disclosed |
| US-7553891-B2 | Flame-retardant epoxy resin composition, and electronic device, laminated circuit board, multilayered circuit board and printed circuit board using the flame-retardant epoxy resin composition | FUJI XEROX CORPORATION (JP) | 2009-06-30 | — | — | US | disclosed |
| US-20090162650-A1 | Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methods | CHEIL INDUSTRIES, INC. (KR) | 2009-06-25 | — | — | US | disclosed |
| EP-2072340-A1 | REINFORCING MATERIAL FOR VEHICLE CEILING MATERIAL | NITTO DENKO CORPORATION (JP) | 2009-06-24 | — | — | EP | disclosed |
| US-20090139537-A1 | HAIR RELAXING COMPOSITION COMPRISING AT LEAST ONE NON-HYDROXIDE IMINE | L'OREAL S.A. | 2009-06-04 | — | — | US | disclosed |
| US-20090141472-A1 | Adhesive composition for die bonding in semiconductor assembly, adhesive film prepared therefrom, device including the same, and associated methods | CHEIL INDUSTRIES, INC. (KR) | 2009-06-04 | — | — | US | disclosed |
| US-20090136748-A1 | Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods | CHEIL INDUSTRIES, INC. (KR) | 2009-05-28 | — | — | US | disclosed |
| US-20090110940-A1 | Adhesive film composition, associated dicing die bonding film, die package, and associated methods | CHEIL INDUSTRIES, INC. (KR) | 2009-04-30 | — | — | US | disclosed |
| US-20090091878-A1 | Image Display Device Reinforcing Sheet, Image Display Device and Method for Reinforcing the Same | NITTO DENKO CORPORATION (JP) | 2009-04-09 | — | — | US | disclosed |
| US-20090076180-A1 | Epoxy resin composition using latent curing agent and curable by photo and heat in combination | NAMICS CORPORATION (JP) | 2009-03-19 | — | — | US | disclosed |
| US-7494715-B2 | Steel plate reinforcing sheet | NITTO DENKO CORPORATION (JP) | 2009-02-24 | — | — | US | disclosed |
| US-20090015781-A1 | Optical Resin Sheet and Liquid Crystal Cell Substrate Including the Same, Liquid Crystal Display Device, Substrate for an Image Display Device, and Image Display Device | NITTO DENKO CORPORATION (JP) | 2009-01-15 | — | — | US | disclosed |
| EP-2012295-A1 | REINFORCING SHEET FOR IMAGE DISPLAY, IMAGE DISPLAY, AND METHOD FOR REINFORCING THE SAME | Nitto Denko Corporation (JP) | 2009-01-07 | — | — | EP | disclosed |
| US-20080311405-A1 | Reinforcing Sheet | PERMACEL | 2008-12-18 | — | — | US | disclosed |
| CN-100442955-C | Wiring board sheet and its manufacturing method, multilayer board, and its manufacturng method | MATSUSHITA ELECTRIC WORKS LTD (JP) | 2008-12-10 | — | — | CN | disclosed |
| US-20080251757-A1 | Latent Hardener For Epoxy Resin and Epoxy Resin Composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2008-10-16 | — | — | US | disclosed |
| EP-1980580-A1 | MICROCAPSULE TYPE HARDENER FOR EPOXY RESIN, MASTERBATCH TYPE HARDENER COMPOSITION FOR EPOXY RESIN, ONE-PACK TYPE EPOXY RESIN COMPOSITION, AND PROCESSED ARTICLE | Asahi Kasei Chemicals Corporation (JP) | 2008-10-15 | — | — | EP | disclosed |
| US-7397651-B2 | Electrolyte for electrolytic capacitor, electrolytic capacitor and process for producing tetrafluoroaluminate salt of organic onium | MITSUBISHI CHEMICAL CORPORATION (JP) | 2008-07-08 | — | — | US | disclosed |
| EP-1930359-A1 | HIGH-STABILITY MICROENCAPSULATED HARDENER FOR EPOXY RESIN AND EPOXY RESIN COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2008-06-11 | — | — | EP | disclosed |
| US-20080009602-A1 | Epoxy Resin, Method For Producing Same And Epoxy Resin Composition Thereof | KUKDO CHEMICAL CO. LTD (KR) | 2008-01-10 | — | — | US | disclosed |
| EP-1852452-A1 | LATENT HARDENER FOR EPOXY RESIN AND EPOXY RESIN COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2007-11-07 | — | — | EP | disclosed |
| US-20070244268-A1 | Hardener for Epoxy Resin and Epoxy Resin Composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2007-10-18 | — | — | US | disclosed |
| US-7267870-B2 | Pressure-sensitive adhesive sheet for steel plates | NITTO DENKO CORPORATION (JP) | 2007-09-11 | — | — | US | disclosed |
| US-7259803-B2 | Resin sheet, liquid crystal cell substrate comprising the same | NITTO DENKO CORPORATION (JP) | 2007-08-21 | — | — | US | disclosed |
| US-20070188977-A1 | ELECTROLYTE FOR ELECTROLYTIC CAPACITOR, ELECTROLYTIC CAPACITOR AND PROCESS FOR PRODUCING TETRAFLUOROALUMINATE SALT OF ORGANIC ONIUM | MITSUBISHI CHEMICAL CORPORATION (JP) | 2007-08-16 | — | — | US | disclosed |
| EP-1586615-B1 | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same | HITACHI CHEMICAL CO LTD (JP) | 2007-08-15 | — | — | EP | disclosed |
| US-20070128376-A1 | Resin sheet, liquid crystal cell substrate, liquid crytal display device, substrate for an electroluminescence display device, electroluminescence display device, and substrate for a solar cell | NITTO DENKO CORPORATION (JP) | 2007-06-07 | — | — | US | disclosed |
| US-20070117485-A1 | Laminated film | NITTO DENKO CORPORATION (JP) | 2007-05-24 | — | — | US | disclosed |
| EP-1772473-A1 | EPOXY RESIN, METHOD FOR PRODUCING SAME AND EPOXY RESIN COMPOSITION THEREOF | Tohto Kasei Co., Ltd. (JP) | 2007-04-11 | — | — | EP | disclosed |
| US-20070055039-A1 | Latent curing agent and composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2007-03-08 | — | — | US | disclosed |
| EP-1504890-B1 | Adhesive sheet for steel plate | NITTO DENKO CORP (JP) | 2007-03-07 | — | — | EP | disclosed |
| US-20070042168-A1 | Resin sheet, liquid crystal cell substrate, liquid crystal display device, substrate for an electroluminescence display device, electroluminescence display device, and a substrate for a solar cell | NITTO DENKO CORPORATION (JP) | 2007-02-22 | — | — | US | disclosed |
| EP-1731545-A1 | HARDENER FOR EPOXY RESIN AND EPOXY RESIN COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2006-12-13 | — | — | EP | disclosed |
| EP-1531040-B1 | Method of reinforcing a steel plate with a resin rubber composition | NITTO DENKO CORP (JP) | 2006-10-04 | — | — | EP | disclosed |
| US-20060217462-A1 | curing agent; coated particles containing a metal hydrate | FUJI XEROX CO., LTD. (JP) | 2006-09-28 | — | — | US | disclosed |
| WO-2006076310-A2 | REINFORCING SHEET | PERMACEL (US) | 2006-07-20 | — | — | WO | disclosed |
| US-20060147898-A1 | Cell microchip | NITTO DENKO CORPORATION (JP) | 2006-07-06 | — | — | US | disclosed |
| EP-1671997-A1 | LATENT CURING AGENT AND COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2006-06-21 | — | — | EP | disclosed |
| US-20060128835-A1 | Capsule type hardener and composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2006-06-15 | — | — | US | disclosed |
| US-7060346-B2 | Resin sheets, processes for producing the same, and liquid crystal displays | NITTO DENKO CORPORATION (JP) | 2006-06-13 | — | — | US | disclosed |
| EP-1655363-A1 | CELL MICROCHIP | NITTO DENKO CORPORATION (JP) | 2006-05-10 | — | — | EP | disclosed |
| EP-1209211-B1 | ADHESIVE, ADHESIVE MEMBER, CIRCUIT SUBSTRATE FOR SEMICONDUCTOR MOUNTING HAVING ADHESIVE MEMBER, AND SEMICONDUCTOR DEVICE CONTAINING THE SAME | HITACHI CHEMICAL CO LTD (JP) | 2006-01-25 | — | — | EP | disclosed |
| US-20050276984-A1 | Steel plate reinforcing sheet | NITTO DENKO CORPORATION (JP) | 2005-12-15 | — | — | US | disclosed |
| EP-1604816-A1 | Reinforcing sheet for steel plate | NITTO DENKO CORPORATION (JP) | 2005-12-14 | — | — | EP | disclosed |
| EP-1593701-A1 | Curable resin composition | Ajinomoto Co., Inc. (JP) | 2005-11-09 | — | — | EP | disclosed |
| US-20050237307-A1 | Transparent laminate, pen-input image display, and image display method | NITTO DENKO CORPORATION (JP) | 2005-10-27 | — | — | US | disclosed |
| EP-1586615-A1 | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2005-10-19 | — | — | EP | disclosed |
| EP-0950677-B1 | Curable resin composition | AJINOMOTO KK (JP) | 2005-10-19 | — | — | EP | disclosed |
| EP-1141071-B1 | HIGH STRENGTH EPOXY ADHESIVE AND USES THEREOF | 3M INNOVATIVE PROPERTIES CO (US) | 2005-09-14 | — | — | EP | disclosed |
| US-6942906-B2 | Resin sheets containing dispersed particles, processes for producing the same, and liquid crystal displays | NITTO DENKO CORPORATION (JP) | 2005-09-13 | — | — | US | disclosed |
| US-20050196456-A1 | Controlled release particles | 3M INNOVATIVE PROPERTIES COMPANY | 2005-09-08 | — | — | US | disclosed |
| US-6936313-B2 | Resin sheets containing dispersed particles, processes for producing the same, and liquid crystal displays | NITTO DENKO CORPORATION (JP) | 2005-08-30 | — | — | US | disclosed |
| EP-1557438-A1 | CAPSULE TYPE HARDENER AND COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2005-07-27 | — | — | EP | disclosed |
| US-20050153079-A1 | Method of manufacturing laminated polarizing plate, laminated polarizing plate obtained by the method, and image display including the same | NITTO DENKO CORPORATION (JP) | 2005-07-14 | — | — | US | disclosed |
| US-20050136017-A1 | Cosmetic containing an imine reactive with the cystines of keratin fibers via a beta-elimination reaction to produce dehydroalanine and lead to formation of lanthionine in a medium free of polyhydroxylated alkane; guanidine and/or amidine imines such as dimethylguanidine; noncaustic for use on hair, skin | L'OREAL S.A. (FR) | 2005-06-23 | — | — | US | disclosed |
| US-20050129645-A1 | Hair shaping composition comprising at least one non-hydroxide imine | L'OREAL | 2005-06-16 | — | — | US | disclosed |
| US-20050129877-A1 | Resin sheet, liquid crystal cell substrate comprising the same | NITTO DENKO CORPORATION (JP) | 2005-06-16 | — | — | US | disclosed |
| EP-1532963-A1 | Composition for straightening the hair comprising at least one imine not being an hydroxide | L'OREAL (FR) | 2005-05-25 | — | — | EP | disclosed |
| EP-1532960-A1 | Hair styling composition containing a non-hydroxide imine | L'OREAL (FR) | 2005-05-25 | — | — | EP | disclosed |
| US-20050103422-A1 | Steel-plate-reinforcement resin composition, steel plate reinforcing sheet, and reinforcing method of steel plate | NITTO DENKO CORPORATION (JP) | 2005-05-19 | — | — | US | disclosed |
| EP-1531040-A2 | Method of reinforcing a steel plate with a resin rubber composition | NITTO DENKO CORPORATION (JP) | 2005-05-18 | — | — | EP | disclosed |
| US-20050032447-A1 | Adhesive sheet for steel plate | NITTO DENKO CORPORATION (JP) | 2005-02-10 | — | — | US | disclosed |
| US-20050032448-A1 | Pressure-sensitive adhesive sheet for steel plates | NITTO DENKO CORPORATION | 2005-02-10 | — | — | US | disclosed |
| EP-1504890-A2 | Adhesive sheet for steel plate | NITTO DENKO CORPORATION (JP) | 2005-02-09 | — | — | EP | disclosed |
| EP-1504893-A2 | Pressure-sensitive adhesive sheet for steel plates | NITTO DENKO CORPORATION (JP) | 2005-02-09 | — | — | EP | disclosed |
| US-20050025955-A1 | Steel plate reinforcing sheet | NITTO DENKO CORPORATION (JP) | 2005-02-03 | — | — | US | disclosed |
| CN-1575627-A | Wiring board sheet and its manufacturing method, multilayer board, and its manufacturng method | MATSUSHITA ELECTRIC WORKS LTD (JP) | 2005-02-02 | — | — | CN | disclosed |
| EP-1493558-A1 | Reinforcing sheet for steel plate | NITTO DENKO CORPORATION (JP) | 2005-01-05 | — | — | EP | disclosed |
| US-6838170-B2 | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2005-01-04 | — | — | US | disclosed |
| EP-0942028-B1 | Epoxy resin composition | AJINOMOTO KK (JP) | 2004-11-24 | — | — | EP | disclosed |
| US-6818263-B2 | Resin sheets containing dispersed particles and liquid crystal displays | NITTO DENKO CORPORATION (JP) | 2004-11-16 | — | — | US | disclosed |
| US-6800157-B2 | CHAIN EXTENDER, A CATALYST, A REACTIVE EPOXY RESIN, AND A POLYMERIC TOUGHNER FORMS A THERMALLY CURABLE STRUCTURAL ADHESIVE | 3M INNOVATIVE PROPERTIES COMPANY | 2004-10-05 | — | — | US | disclosed |
| US-6798487-B1 | Liquid crystal cell substrate including resin substrate, gas barrier layer, crosslinked resin layer and polarizing layer | NITTO DENKO CORPORATION (JP) | 2004-09-28 | — | — | US | disclosed |
| US-20040121087-A1 | Resin sheets containing dispersed particles, processes for producing the same, and liquid crystal displays | NITTO DENKO CORPORATION | 2004-06-24 | — | — | US | disclosed |
| EP-0933385-B1 | Flame retardant epoxy resin for printed board, prepreg, and metal foil clad laminate using the same | HITACHI CHEMICAL CO LTD (JP) | 2004-06-02 | — | — | EP | disclosed |
| US-6740266-B2 | Epoxy optical sheet and process for producing the same | NITTO DENKO CORPORATION (JP) | 2004-05-25 | — | — | US | disclosed |
| EP-1392115-A1 | CONTROLLED RELEASE PARTICLES | 3M Innovative Properties Company (US) | 2004-03-03 | — | — | EP | disclosed |
| US-6673441-B1 | EPOXY RESIN, HARDENER, EPOXIDIZED ACRYLIC COPOLYMER HAVING GLYCIDYL (METH)ACRYLATE COMONOMER, AND LATENT CURING ACCELERATOR | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-01-06 | — | — | US | disclosed |
| US-20030155836-A1 | SMALL-SIZE MOTOR | UDA SHIGENORI (JP) | 2003-08-21 | — | — | US | disclosed |
| US-20030145949-A1 | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same | TANAKA YUKO (JP) | 2003-08-07 | — | — | US | disclosed |
| US-20030144416-A1 | High strength epoxy adhesive and uses thereof | 3M INNOVATIVE PROPERTIES COMPANY | 2003-07-31 | — | — | US | disclosed |
| US-6565975-B2 | Multilayered resin plate and process for producing the same | NITTO DENKO CORPORATION (JP) | 2003-05-20 | — | — | US | disclosed |
| EP-0658583-B1 | Epoxy resin-hardener system having elastic properties | SOLUTIA GERMANY GMBH & CO KG (DE) | 2003-04-16 | — | — | EP | disclosed |
| US-20030031694-A1 | Controlled release particles | 3M INNOVATIVE PROPERTIES COMPANY | 2003-02-13 | — | — | US | disclosed |
| US-20030012957-A1 | Epoxy optical sheet and process for producing the same | NITTO DENKO CORPORATION | 2003-01-16 | — | — | US | disclosed |
| US-6500518-B2 | Epoxy optical sheet and process for producing the same | NITTO DENKO CORPORATION (JP) | 2002-12-31 | — | — | US | disclosed |
| US-6486256-B1 | Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst | 3M INNOVATIVE PROPERTIES COMPANY | 2002-11-26 | — | — | US | disclosed |
| US-6482899-B2 | LATENCY CURING AGENTS; STORAGE STABILITY | AJINOMOTO CO., INC. (JP) | 2002-11-19 | — | — | US | disclosed |
| US-20020160127-A1 | Resin sheets containing dispersed particles, processes for producing the same, and liquid crystal displays | NITTO DENKO CORPORATION (JP) | 2002-10-31 | — | — | US | disclosed |
| WO-2002085113-A1 | CONTROLLED RELEASE PARTICLES | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2002-10-31 | — | — | WO | disclosed |
| EP-1238798-A1 | Resin sheets containing dispersed particles, processes for producing the same, and liquid crystal displays | NITTO DENKO CORPORATION (JP) | 2002-09-11 | — | — | EP | disclosed |
| US-20020119298-A1 | EPOXY OPTICAL SHEET AND PROCESS FOR PRODUCING THE SAME | NITTO DENKO CORPORATION (JP) | 2002-08-29 | — | — | US | disclosed |
| US-20020102367-A1 | Resin sheets containing dispersed particles and liquid crystal displays | NITTO DENKO CORPORATION (JP) | 2002-08-01 | — | — | US | disclosed |
| EP-1217396-A2 | Resin sheets, processes for producing the same, and liquid crystal displays | NITTO DENKO CORPORATION (JP) | 2002-06-26 | — | — | EP | disclosed |
| US-20020068134-A1 | Resin sheets, processes for producing the same, and liquid crystal displays | NITTO DENKO CORPORATION | 2002-06-06 | — | — | US | disclosed |
| EP-1209211-A1 | ADHESIVE, ADHESIVE MEMBER, CIRCUIT SUBSTRATE FOR SEMICONDUCTOR MOUNTING HAVING ADHESIVE MEMBER, AND SEMICONDUCTOR DEVICE CONTAINING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-05-29 | — | — | EP | disclosed |
| EP-0658584-B1 | Epoxy resin-hardener system having elastic properties | SOLUTIA GERMANY GMBH & CO KG (DE) | 2002-05-22 | — | — | EP | disclosed |
| US-20020010287-A1 | Latency curing agents; storage stability | AJINOMOTO CO., INC. (JP) | 2002-01-24 | — | — | US | disclosed |
| EP-0675143-B1 | Amine-modified epoxy resin composition | SOLUTIA GERMANY GMBH & CO KG (DE) | 2002-01-02 | — | — | EP | disclosed |
| US-20010053425-A1 | Multilayered resin plate and process for producing the same | NITTO DENKO CORPORATION (JP) | 2001-12-20 | — | — | US | disclosed |
| US-6329473-B1 | USED AS COATING FOR CRACK BRIDGING, AS AN ADHESIVE AND IN POWDER SURFACE COATINGS | SOLUTIA GERMANY GMBH & CO., KG (DE) | 2001-12-11 | — | — | US | disclosed |
| EP-1141071-A2 | HIGH STRENGTH EPOXY ADHESIVE AND USES THEREOF | 3M Innovative Properties Company (US) | 2001-10-10 | — | — | EP | disclosed |
| US-20010010857-A1 | Resin substrate for optical use | NITTO DENKO CORPORATION (JP) | 2001-08-02 | — | — | US | disclosed |
| EP-1118461-A2 | Multilayered resin plate and process for producing the same | NITTO DENKO CORPORATION (JP) | 2001-07-25 | — | — | EP | disclosed |
| US-6232426-B1 | BLEND CONTAINING A THIOL, COMPOUND, LATENT CURING AGENT AND BORATE EATER | AJINOMOTO CO., INC. (JP) | 2001-05-15 | — | — | US | disclosed |
| US-6214468-B1 | Flame retardant epoxy resin composition for printed board, and prepreg and metal foil clad laminate using the same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-04-10 | — | — | US | disclosed |
| EP-0617069-B1 | Curable, powdery mixtures | HOECHST AG (DE) | 2000-11-02 | — | — | EP | disclosed |
| WO-2000022024-A2 | HIGH STRENGTH EPOXY ADHESIVE AND USES THEREOF | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2000-04-20 | — | — | WO | disclosed |
| EP-0950677-A2 | Curable resin composition | Ajinomoto Co., Inc. (JP) | 1999-10-20 | — | — | EP | disclosed |
| EP-0942028-A1 | Epoxy resin composition | Ajinomoto Co., Inc. (JP) | 1999-09-15 | — | — | EP | disclosed |
| EP-0936236-A2 | Epoxy resin and hydrid powder coatings | HÜLS AKTIENGESELLSCHAFT (DE) | 1999-08-18 | — | — | EP | disclosed |
| EP-0933385-A2 | Flame retardant epoxy resin for printed board, prepreg, and metal foil clad laminate using the same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1999-08-04 | — | — | EP | disclosed |
| US-5874501-A | POLY(P-HYDROXYSTYRENE) WITH AROMATIC MOIETY AND ALIPHATIC MOIETY WITH INORGANIC OXIDE | KEEHAN DONALD J (US) | 1999-02-23 | — | — | US | disclosed |
| US-5766386-A | Method of producing metal clad laminate | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1998-06-16 | — | — | US | disclosed |
| EP-0594133-B1 | Polythiol epoxy resin composition with extended working life | AJINOMOTO KK (JP) | 1998-05-06 | — | — | EP | disclosed |
| EP-0407554-B1 | METALLIC OXIDE-OXIRANE POLYMERS AND PREPOLYMERS | KEEHAN DONALD J (US) | 1997-09-17 | — | — | EP | disclosed |
| WO-1997031047-A1 | MULTI-FUNCTIONAL OXIRANE POLYMERS | KEEHAN DONALD J (US) | 1997-08-28 | — | — | WO | disclosed |
| US-5661223-A | Composition of phenolic resin-modified epoxy resin and straight chain polymer | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 1997-08-26 | — | — | US | disclosed |
| US-5658996-A | A LIQUID POLYEPOXIDE PREPOLYMER THE REACTION PRODUCT OF A TRISHYDROXYPHENYL, AN AROMATIC DIGLYCIDYL ETHER AND METAL OXIDE; CURABLE, LOW VISCOSITY; FORMED POLYEPOXIDE IS HEAT AND CHEMICAL RESISTANCE, ELONGATION, TOUGHNESS | KEEHAN DONALD J (US) | 1997-08-19 | — | — | US | disclosed |
| US-5585446-A | EPOXY RESIN ADHESIVE COMPOSITION | HOECHST AKTIENGESELLSCHAFT (DE) | 1996-12-17 | — | — | US | disclosed |
| EP-0622357-B1 | Process for the production of cyclic amidine | LION AKZO COMPANY LIMITED (JP) | 1996-11-06 | — | — | EP | disclosed |
| US-5567782-A | ELASTIC ADHESIVE | HOECHST AKTIENGESELLSCHAFT (DE) | 1996-10-22 | — | — | US | disclosed |
| EP-0703258-A2 | Curable, powdery mixtures | HOECHST AKTIENGESELLSCHAFT (DE) | 1996-03-27 | — | — | EP | disclosed |
| EP-0352550-B1 | Resin composition for laminate | MITSUBISHI ELECTRIC CORP (JP) | 1996-03-27 | — | — | EP | disclosed |
| US-5459208-A | Elasticity at low temperatures; automobile structural adhesive | HOECHST AKTIENGESELLSCHAFT (DE) | 1995-10-17 | — | — | US | disclosed |
| EP-0675185-A2 | Elastic amine-modified epoxy resin composition | HOECHST AKTIENGESELLSCHAFT (DE) | 1995-10-04 | — | — | EP | disclosed |
| EP-0675143-A2 | Amine-modified epoxy resin composition | HOECHST AKTIENGESELLSCHAFT (DE) | 1995-10-04 | — | — | EP | disclosed |
| EP-0515680-B1 | EPOXY RESIN-IMPREGNATED PREPREG | TEIJIN LTD (JP) | 1995-09-06 | — | — | EP | disclosed |
| US-5439977-A | Comprising a liquid epoxide compound, anhydride, secondary amine and imidazole-epoxide compound adduct having latent solubility upon heating; storage stability; workability; seals; electrical apparatus | AJINOMOTO CO., INC. (JP) | 1995-08-08 | — | — | US | disclosed |
| US-5436301-A | Copper foil laminate for chip boards | TEIJIN LIMITED (JP) | 1995-07-25 | — | — | US | disclosed |
| US-5430112-A | Epoxy resin and polythiol composition | AJINOMOTO CO., INC. (JP) | 1995-07-04 | — | — | US | disclosed |
| EP-0658584-A2 | Epoxy resin-hardener system having elastic properties | HOECHST AKTIENGESELLSCHAFT (DE) | 1995-06-21 | — | — | EP | disclosed |
| EP-0658583-A2 | Epoxy resin-hardener system having elastic properties | HOECHST AKTIENGESELLSCHAFT (DE) | 1995-06-21 | — | — | EP | disclosed |
| US-5380899-A | Process for the production of cyclic amidine | LION AKZO CO., LTD. (JP) | 1995-01-10 | — | — | US | disclosed |
| EP-0622357-A1 | Process for the production of cyclic amidine | LION AKZO COMPANY LIMITED (JP) | 1994-11-02 | — | — | EP | disclosed |
| EP-0617069-A2 | Curable, powdery mixtures | HOECHST AKTIENGESELLSCHAFT (DE) | 1994-09-28 | — | — | EP | disclosed |
| EP-0594133-A2 | Polythiol epoxy resin composition with extended working life | Ajinomoto Co., Inc. (JP) | 1994-04-27 | — | — | EP | disclosed |
| US-5286609-A | Process for the formation of a negative resist pattern from a composition comprising a diazoquinone compound and an imidazole and having as a heat step the use of a hot water containing spray | YAMATOYA & CO., LTD. (JP) | 1994-02-15 | — | — | US | disclosed |
| EP-0331507-B1 | POLYVINYL CHLORIDE PLASTISOL COMPOSITION | ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) | 1993-05-19 | — | — | EP | disclosed |
| US-5210152-A | Metal oxide vulcanization in the presence of amidine compounds | BAYER AKTIENGESELLSCHAFT (DE) | 1993-05-11 | — | — | US | disclosed |
| EP-0525936-A1 | Accelerator for curing epoxy resins | TEXACO CHEMICAL COMPANY (US) | 1993-02-03 | — | — | EP | disclosed |
| US-5169912-A | Hydrolyzable oxygen bonding with epoxide; silica, titania; high performance coatings, adhesives | KEEHAN DONALD J (US) | 1992-12-08 | — | — | US | disclosed |
| EP-0515680-A1 | EPOXY RESIN-IMPREGNATED PREPREG | TEIJIN LIMITED (JP) | 1992-12-02 | — | — | EP | disclosed |
| US-5091481-A | Heat resistance | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 1992-02-25 | — | — | US | disclosed |
| EP-0209617-B1 | SMALL-SIZE MOTOR | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1992-01-29 | — | — | EP | disclosed |
| EP-0433808-A2 | Process for vulcanising polychloroprene | BAYER AG (DE) | 1991-06-26 | — | — | EP | disclosed |
| US-5026816-A | Reaction product of diglycidyl ether of (bisphenol a or resorcinol) with metallic oxide in presence of imidazole catalyst | KEEHAN DONALD J (US) | 1991-06-25 | — | — | US | disclosed |
| US-4977201-A | Blended with modified epoxy resin, blocked isocyanate, latent curing for resin as tackifier, automobile undercoatings | ASAHI DENKA KOGYO K.K. (JP) | 1990-12-11 | — | — | US | disclosed |
| EP-0394965-A2 | Resin composition for laminate | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 1990-10-31 | — | — | EP | disclosed |
| WO-1990008168-A1 | METALLIC OXIDE-OXIRANE POLYMERS AND PREPOLYMERS | KEEHAN DONALD J (US) | 1990-07-26 | — | — | WO | disclosed |
| EP-0352550-A2 | Resin composition for laminate | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 1990-01-31 | — | — | EP | disclosed |
| US-4880892-A | PHOSPHONIUM OR PHOSPHORANE CATALYST, PROTECTIVE COATINGS | CIBA-GEIGY CORPORATION (US) | 1989-11-14 | — | — | US | disclosed |
| EP-0331507-A1 | Polyvinyl chloride plastisol composition | ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) | 1989-09-06 | — | — | EP | disclosed |
| EP-0140324-B1 | POLYARYLENE SULFIDES WITH REDUCED CORROSIVENESS | BAYER AG (DE) | 1989-06-21 | — | — | EP | disclosed |
| US-4695613-A | EPOXY RESIN, CYCLIC AMIDINE NEUTRALIZED OLIGOESTER | HUELS AKTIENGESELLSCHAFT (DE) | 1987-09-22 | — | — | US | disclosed |
| EP-0175874-B1 | CARBOXYL GROUP CONTAINING CURING AGENTS | HÜLS AKTIENGESELLSCHAFT (DE) | 1987-09-09 | — | — | EP | disclosed |
| JP-S62187797-A | LUBRICATING AGENT | MATSUSHITA ELECTRIC IND CO LTD | 1987-08-17 | — | — | JP | disclosed |
| EP-0093959-B1 | PROCESS FOR THE PREPARATION OF GLYCIDYL-1,2,4-TRIAZOLIDIN-3,5-DIONES | BAYER AG (DE) | 1987-03-04 | — | — | EP | disclosed |
| EP-0111073-B1 | PROCESS FOR THE PREPARATION OF 2-IMIDAZOLINES | BASF Aktiengesellschaft (DE) | 1987-02-25 | — | — | EP | disclosed |
| EP-0209617-A1 | Small-size motor | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1987-01-28 | — | — | EP | disclosed |
| EP-0131842-B1 | LIQUID CURING AGENTS FOR EPOXY RESINS, AND PROCESS FOR THEIR PREPARATION | BASF Aktiengesellschaft (DE) | 1986-12-10 | — | — | EP | disclosed |
| EP-0198226-A2 | Curing agent for an epoxy resin-based powdery coating | HÜLS AKTIENGESELLSCHAFT (DE) | 1986-10-22 | — | — | EP | disclosed |
| US-4609699-A | AMINE STABILIZER | BAYER AKTIENGESELLSCHAFT (DE) | 1986-09-02 | — | — | US | disclosed |
| EP-0175874-A1 | Carboxyl group containing curing agents | HÜLS AKTIENGESELLSCHAFT (DE) | 1986-04-02 | — | — | EP | disclosed |
| US-4529537-A | Liquid epoxy resin hardeners and processes for their preparation | BASF AKTIENGESELLSCHAFT (DE) | 1985-07-16 | — | — | US | disclosed |
| US-4529537-A | Liquid epoxy resin hardeners and processes for their preparation | BASF AKTIENGESELLSCHAFT (DE) | 1985-07-16 | — | — | US | disclosed |
| EP-0140324-A2 | Polyarylene sulfides with reduced corrosiveness | BAYER AG (DE) | 1985-05-08 | — | — | EP | disclosed |
| US-4514556-A | REACTION OF 2-ETHYL-4-METHYL IMIDAZOLE WITH CATALYST AND FORMALDEHYDE OR METHYLENIZING AGENT, CURING AGENT FOR EPOXY RESIN | SHIKOKU CHEMICALS CORPORATION (JP) | 1985-04-30 | — | — | US | disclosed |
| EP-0131842-A1 | Liquid curing agents for epoxy resins, and process for their preparation | BASF Aktiengesellschaft (DE) | 1985-01-23 | — | — | EP | disclosed |
| EP-0131842-A1 | Liquid curing agents for epoxy resins, and process for their preparation | BASF Aktiengesellschaft (DE) | 1985-01-23 | — | — | EP | disclosed |
| EP-0051787-B1 | AMIDINES AND AMIDINE/ISOCYANATE ADDUCTS, METHODS OF PREPARING THEM AND THEIR USE AS CATALYSTS IN CURING EPOXY RESINS | BAYER AG (DE) | 1984-12-19 | — | — | EP | disclosed |
| EP-0126531-A2 | 4,4'-Methylene-bis-(2-ethyl-5-methyl imidazole) and methods of producing and using the same | SHIKOKU CHEMICALS CORPORATION (JP) | 1984-11-28 | — | — | EP | disclosed |
| EP-0111073-A1 | Process for the preparation of 2-imidazolines | BASF Aktiengesellschaft (DE) | 1984-06-20 | — | — | EP | disclosed |
| US-4455425-A | EPOXY RESINS, CURING AGENTS | BAYER AKTIENGESELLSCHAFT (DE) | 1984-06-19 | — | — | US | disclosed |
| US-4455426-A | CATALYST FOR HARDENING EPOXY RESINS | BAYER AKTIENGESELLSCHAFT (DE) | 1984-06-19 | — | — | US | disclosed |
| US-4424353-A | INTERMEDIATES FOR ISOCYANATE ADDUCTS, EPOXY RESIN CURING AGENTS | BAYER AKTIENGESELLSCHAFT (DE) | 1984-01-03 | — | — | US | disclosed |
| US-4424313-A | ORGANO-NITROGEN SALTS | BAYER AKTIENGESELLSCHAFT (DE) | 1984-01-03 | — | — | US | disclosed |
| EP-0093959-A2 | Process for the preparation of glycidyl-1,2,4-triazolidin-3,5-diones | BAYER AG (DE) | 1983-11-16 | — | — | EP | disclosed |
| EP-0085913-A1 | Reactive polymers containing carboxylic groups, process for their production and their use as curing agents in powder lacquers | BAYER AG (DE) | 1983-08-17 | — | — | EP | disclosed |
| US-4355058-A | STORAGE STABLE CURABLE EPOXY RESINS | CHEMISCHE WERKE HUELS AKTIENGESELLSCHAFT (DE) | 1982-10-19 | — | — | US | disclosed |
| EP-0051787-A2 | Amidines and amidine/isocyanate adducts, methods of preparing them and their use as catalysts in curing epoxy resins | BAYER AG (DE) | 1982-05-19 | — | — | EP | disclosed |
| EP-0001468-B1 | POWDERED COATING PRODUCTS, PROCESS FOR THEIR PREPARATION AND THEIR USE | CHEMISCHE WERKE HÜLS AG (DE) | 1982-05-12 | — | — | EP | disclosed |
| EP-0000971-B1 | POUDERY COATING COMPOSITION | CHEMISCHE WERKE HÜLS AG (DE) | 1982-03-24 | — | — | EP | disclosed |
| EP-0000232-B1 | PROCESS FOR THE PREPARATION OF BLOCKED POLYISOCYANATES AND BLOCKED POLYISOCYANATES OBTAINABLE THERBY | CHEMISCHE WERKE HÜLS AG (DE) | 1981-12-09 | — | — | EP | disclosed |
| EP-0001467-B1 | STOVING LACQUERS HAVING AN EXTENDED POT LIFE ON THE BASIS OF POLYISOCYANATE MASKED WITH IMIDAZOLINES | CHEMISCHE WERKE HÜLS AG (DE) | 1981-10-21 | — | — | EP | disclosed |
| US-4255551-A | EXTRUDING WITH A SOLID HYDROXYL GROUP-CONTAINING POLYESTER, COOLING, MILLING, SCREENING; STORAGE STABILITY | CHEMISCHE WERKE HULS AG (DE) | 1981-03-10 | — | — | US | disclosed |
| US-4246394-A | PROMOTER FOR CROSSLINKING | VEBA-CHEMIE AKTIENGESELLSCHAFT (DE) | 1981-01-20 | — | — | US | disclosed |
| US-4242248-A | WEATHER RESISTANT COIL COATING | CHEMISCHE WERKE HULS AG (DE) | 1980-12-30 | — | — | US | disclosed |
| US-4210687-A | SHATTERPROOF COATING FOR BOTTLES | CHEMISCHE WERKE HULS AKTIENGESELLSCHAFT (DE) | 1980-07-01 | — | — | US | disclosed |
| EP-0000208-B1 | PROCESS FOR THE PREPARATION OF IMIDAZOLES | BASF Aktiengesellschaft (DE) | 1980-04-30 | — | — | EP | disclosed |
| US-4200725-A | Method of producing blocked polyisocyanates by reaction of an imidazoline with an isocyanate | CHEMISCHE WERKE HULS A.G. (DE) | 1980-04-29 | — | — | US | disclosed |
| US-4176142-A | Powder coating composition | WESTERN ELECTRIC COMPANY, INC. (US) | 1979-11-27 | — | — | US | disclosed |
| EP-0001468-A1 | Powdered coating products, process for their preparation and their use | CHEMISCHE WERKE HÜLS AG (DE) | 1979-04-18 | — | — | EP | disclosed |
| EP-0001467-A1 | Stoving lacquers having an extended pot life on the basis of polyisocyanate masked with imidazolines | CHEMISCHE WERKE HÜLS AG (DE) | 1979-04-18 | — | — | EP | disclosed |
| EP-0001148-A1 | Method of coating glass surfaces | CHEMISCHE WERKE HÜLS AG (DE) | 1979-03-21 | — | — | EP | disclosed |
| EP-0000971-A1 | Poudery coating composition | CHEMISCHE WERKE HÜLS AG (DE) | 1979-03-07 | — | — | EP | disclosed |
| EP-0000418-A1 | Process for glueing materials | CHEMISCHE WERKE HÜLS AG (DE) | 1979-01-24 | — | — | EP | disclosed |
| EP-0000232-A1 | Process for the preparation of blocked polyisocyanates and blocked polyisocyanates obtainable therby | CHEMISCHE WERKE HÜLS AG (DE) | 1979-01-10 | — | — | EP | disclosed |
| EP-0000208-A1 | Process for the preparation of imidazoles | BASF Aktiengesellschaft (DE) | 1979-01-10 | — | — | EP | disclosed |
| US-4127562-A | HARDENER, VARNISH ADDITIVES, 1,2-EPOXY COMPOUNDS | VEBA-CHEMIE AKTIENGESELLSCHAFT (DE) | 1978-11-28 | — | — | US | disclosed |
| US-4007299-A | 1,2-EPOXY COMPOUND, POLYCARBOXYLATE | VEBA-CHEMIE AG (DT) | 1977-02-08 | — | — | US | disclosed |
| US-3947384-A | EPOXY COMPOUND, POLYCARBOXYLIC ACID AND CYCLIC AMIDINE | VEBA-CHEMIE AKTIENGESELLSCHAFT (DT) | 1976-03-30 | — | — | US | disclosed |
| US-3947384-A | EPOXY COMPOUND, POLYCARBOXYLIC ACID AND CYCLIC AMIDINE | VEBA-CHEMIE AKTIENGESELLSCHAFT (DT) | 1976-03-30 | — | — | US | disclosed |