SCHEMBL1069067

SCHEMBL1069067

C=CC(=O)OCCCCn1c(=O)n(CCCCOC(=O)C=C)c(=O)n(CCCCOC(=O)C=C)c1=O

nearest known ligand 0.62

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
TSHR P16473 7/20 0.62
ALDH1A1 P00352 4/20 0.62
CYP3A4 P08684 3/20 0.62
HPGD P15428 1/20 0.52
TP53 P04637 3/20 0.47
HIF1A Q16665 3/20 0.47
HSD17B10 Q99714 1/20 0.47
THRB P10828 2/20 0.40
MAPK1 P28482 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
ATM Q13315 1/20 0.33
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33
HCAR2 Q8TDS4 3/20 0.33
NPSR1 Q6W5P4 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16694127 0.98 TSHR (0.66) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL16694109 0.98 TSHR (0.66) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL22063940 0.98 TSHR (0.60) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL22064159 0.97 TSHR (0.63) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL5269389 0.95 TSHR (0.59) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL23810921 0.91 TSHR (0.51) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL29061665 0.89 TSHR (0.53) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL42549 0.87 TSHR (0.52) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL22064163 0.87 TSHR (0.50) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL14271657 0.83 ALDH1A1 (0.46) TSHRALDH1A1CYP3A4HPGDTP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0298448-B1 Radiation-curable adhesive tape FURUKAWA ELECTRIC CO LTD (JP) 1994-06-29 EP claimed
US-20240142875-A1 NEGATIVE TYPE PHOTOSENSITIVE COMPOSITION MERCK PATENT GMBH (DE) 2024-05-02 US disclosed
US-11815849-B2 Electrophotographic photosensitive member, process cartridge and electrophotographic image forming apparatus CANON KABUSHIKI KAISHA (JP) 2023-11-14 US disclosed
US-11815849-B2 Electrophotographic photosensitive member, process cartridge and electrophotographic image forming apparatus CANON KABUSHIKI KAISHA (JP) 2023-11-14 US disclosed
CN-116685908-A Negative photosensitive composition 默克专利有限公司 2023-09-01 CN disclosed
CN-110582839-B Radiation-curable adhesive tape for dicing 古河电气工业株式会社 2023-06-06 CN disclosed
US-20230152719-A1 ELECTROPHOTOGRAPHIC PHOTOSENSITIVE MEMBER, PROCESS CARTRIDGE AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS CANON KABUSHIKI KAISHA (JP) 2023-05-18 US disclosed
US-20230152719-A1 ELECTROPHOTOGRAPHIC PHOTOSENSITIVE MEMBER, PROCESS CARTRIDGE AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS CANON KABUSHIKI KAISHA (JP) 2023-05-18 US disclosed
US-11319511-B2 Compositions comprising encapsulates THE PROCTER & GAMBLE COMPANY (US) 2022-05-03 US disclosed
CN-110352472-B Adhesive tape for processing semiconductor substrate and method for manufacturing semiconductor device 住友电木株式会社 2020-09-29 CN disclosed
US-7906582-B2 Polymerizable composition, tacky material, and adhesive FUJIFILM CORPORATION (JP) 2011-03-15 US disclosed
EP-2277965-A2 Removable pressure-sensitive adhesive composition and pressure-sensitive adhesive tape or sheet Nitto Denko Corporation (JP) 2011-01-26 EP disclosed
EP-1820834-B1 Pressure-sensitive adhesive tape NITTO DENKO CORP (JP) 2008-08-27 EP disclosed
US-20080199691-A1 POLYMERIZABLE COMPOSITION, TACKY MATERIAL, AND ADHESIVE FUJIFILM CORPORATION (JP) 2008-08-21 US disclosed
US-20080138618-A1 REMOVABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET NITTO DENKO CORPORATION (JP) 2008-06-12 US disclosed
EP-1930386-A2 Removable pressure-sensitive adhesive composition and pressure-sensitive adhesive tape or sheet NITTO DENKO CORPORATION (JP) 2008-06-11 EP disclosed
EP-1894982-A1 Pressure-sensitive adhesive tape or sheet for application to active surface in dicing and method of picking up cut pieces of work NITTO DENKO CORPORATION (JP) 2008-03-05 EP disclosed
EP-1820834-A1 Pressure-sensitive adhesive tape NITTO DENKO CORPORATION (JP) 2007-08-22 EP disclosed
US-20070190318-A1 Pressure-sensitive adhesive tape or sheet for application to active surface in dicing and method of picking up chips of work NITTO DENKO CORPORATION (JP) 2007-08-16 US disclosed
EP-0298448-B1 Radiation-curable adhesive tape FURUKAWA ELECTRIC CO LTD (JP) 1994-06-29 EP disclosed