SCHEMBL1069110

SCHEMBL1069110

CCC(C)(C)C(CCCCC(C)(C)C)C(=O)O

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSPD1 P10809 1/20 0.39
BLM P54132 1/20 0.39
HSPE1 P61604 1/20 0.39
ACACB O00763 1/20 0.38
ACACA Q13085 1/20 0.38
MEN1 O00255 1/20 0.36
HPGD P15428 1/20 0.36
RECQL P46063 1/20 0.36
KMT2A Q03164 1/20 0.36
HSD17B10 Q99714 1/20 0.36
CA2 P00918 1/20 0.34
MAPK1 P28482 1/20 0.34
GPR84 Q9NQS5 3/20 0.33
FFAR1 O14842 2/20 0.33
GRIK1 P39086 2/20 0.33
GRIK2 Q13002 2/20 0.33
SLC1A2 P43004 2/20 0.33
SLC1A1 P43005 2/20 0.33
MAPT P10636 1/20 0.32
LCK P06239 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28046135 0.85 HSPD1 (0.39) HSPD1BLMHSPE1ACACBACACA
SCHEMBL6297156 0.83 HSPD1 (0.56) HSPD1BLMHSPE1MEN1HPGD
SCHEMBL28806780 0.81 ACACB (0.44) HSPD1BLMHSPE1ACACBACACA
SCHEMBL29170384 0.81 ACACB (0.44) HSPD1BLMHSPE1ACACBACACA
SCHEMBL139346 0.81 ACACB (0.32) ACACBACACA
SCHEMBL7555101 0.79 FOLH1 (0.42) HSPD1BLMHSPE1MEN1KMT2A
SCHEMBL30549440 0.78 HSPD1 (0.37) HSPD1BLMHSPE1ACACBACACA
SCHEMBL28976130 0.78 HSPD1 (0.54) HSPD1BLMHSPE1MEN1HPGD
Ammonia Solution, Strong SCHEMBL28463035 0.76 HSPD1 (0.53) HSPD1BLMHSPE1MEN1HPGD
SCHEMBL15183510 0.76 ACACB (0.45) ACACBACACAMEN1KMT2ACA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2033984-B1 Heat-curable polyimide silicone composition and a cured film therefrom SHINETSU CHEMICAL CO (JP) 2011-01-19 EP disclosed
EP-2033984-A2 Heat-curable polyimide silicone composition and a cured film therefrom Shin-Etsu Chemical Co., Ltd. (JP) 2009-03-11 EP disclosed