⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL670466 | 0.81 | — | — | |
| SCHEMBL517963 | 0.77 | — | — | |
| Thiourea SCHEMBL5598366 | 0.76 | MCL1 (0.46) | — | |
| SCHEMBL3071670 | 0.75 | ST14 (0.32) | — | |
| SCHEMBL6769908 | 0.73 | — | — | |
| SCHEMBL3072568 | 0.72 | KDM4E (0.36) | — | |
| SCHEMBL9202307 | 0.71 | MCL1 (0.52) | — | |
| SCHEMBL18053603 | 0.71 | — | — | |
| SCHEMBL4482343 | 0.71 | MCL1 (0.52) | — | |
| SCHEMBL24528786 | 0.71 | MCL1 (0.47) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260109849-A1 | EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-23 | — | — | US | disclosed |
| WO-2025121026-A1 | EPOXY RESIN COMPOSITION, RESIN PASTE, RESIN FILM, AND SEMICONDUCTOR DEVICE | 旭化成株式会社 | 2025-06-12 | — | — | WO | disclosed |
| CN-119894957-A | Epoxy resin composition, resin paste, film-type adhesive, printed circuit board, semiconductor chip package, and electronic device | 旭化成株式会社 | 2025-04-25 | — | — | CN | disclosed |
| WO-2025009354-A1 | EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE | 旭化成株式会社 | 2025-01-09 | — | — | WO | disclosed |
| US-20240301176-A1 | EPOXY RESIN COMPOSITION, ADHESIVE FILM, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR USING ADHESIVE FILM | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-09-12 | — | — | US | disclosed |
| CN-116615509-A | Epoxy resin composition, adhesive film, printed circuit board, semiconductor chip package, semiconductor device, and method for using adhesive film | 旭化成株式会社 | 2023-08-18 | — | — | CN | disclosed |
| CN-114075323-A | Masterbatch type thermosetting resin composition and thermosetting resin composition | 旭化成株式会社 | 2022-02-22 | — | — | CN | disclosed |
| EP-1867672-B1 | EPOXY RESIN COMPOSITION | ASAHI KASEI CHEMICALS CORP (JP) | 2011-01-26 | — | — | EP | disclosed |
| US-7671147-B2 | Composition of oxazolidine epoxy resin, epoxy phosphazene, phosphorus compound or polyphenylene ether and curing agent | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2010-03-02 | — | — | US | disclosed |
| US-20090032286-A1 | Epoxy Resin Composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2009-02-05 | — | — | US | disclosed |
| US-20080050596-A1 | Flame-Retardant Epoxy Resin Composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2008-02-28 | — | — | US | disclosed |
| EP-1867672-A1 | EPOXY RESIN COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2007-12-19 | — | — | EP | disclosed |
| EP-1775321-A1 | FLAME-RETARDANT EPOXY RESIN COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2007-04-18 | — | — | EP | disclosed |
| US-4833204-A | Epoxy resin composition for a copper-clad laminate | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1989-05-23 | — | — | US | disclosed |
| US-3945896-A | Electrolytic carboxylation of acetonitrile and alpha-substituted acetonitriles | MONSANTO COMPANY (US) | 1976-03-23 | — | — | US | disclosed |