SCHEMBL1071973

SCHEMBL1071973

C/C(=C\N=C=O)CCN=C=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1071975 1.00
SCHEMBL6412092 0.88
SCHEMBL9294234 0.76
SCHEMBL3898014 0.74
SCHEMBL6151090 0.74
SCHEMBL11337018 0.73
SCHEMBL11337022 0.73
SCHEMBL11340062 0.73
SCHEMBL8907019 0.70
SCHEMBL1826200 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112839977-B Prepreg, fiber-reinforced composite resin molded body, method for producing tubular molded body, epoxy resin composition, and tubular molded body 三菱化学株式会社 2024-02-13 CN disclosed
CN-117164914-A Prepreg and fiber-reinforced composite resin molded article 三菱化学株式会社 2023-12-05 CN disclosed
US-20230295389-A1 PREPREG, MOLDED ARTICLE AND EPOXY RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2023-09-21 US disclosed
EP-4245783-A1 PREPREG, MOLDED ARTICLE AND EPOXY RESIN COMPOSITION Mitsubishi Chemical Corporation (JP) 2023-09-20 EP disclosed
CN-116348519-A Prepreg, molded article, and epoxy resin composition 三菱化学株式会社 2023-06-27 CN disclosed
CN-114854064-A Prepreg, method for producing same, and fiber-reinforced plastic molded body 三菱化学株式会社 2022-08-05 CN disclosed
CN-110088163-B Curable resin composition, and film, molded article, prepreg, and fiber-reinforced plastic using same 三菱化学株式会社 2022-06-14 CN disclosed
CN-108623786-B Oxazolidone ring-containing epoxy resin composition, method for producing same, curable resin composition, and cured product 日铁化学材料株式会社 2022-04-05 CN disclosed
US-20210403701-A1 CURABLE RESIN COMPOSITION, AND FILM, MOLDED ARTICLE, PREPREG, AND FIBER-REINFORCED PLASTIC USING SAID CURABLE RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2021-12-30 US disclosed
US-11161975-B2 Curable resin composition, and film, molded article, prepreg, and fiber-reinforced plastic using said curable resin composition MITSUBISHI CHEMICAL CORPORATION (JP) 2021-11-02 US disclosed
US-7671147-B2 Composition of oxazolidine epoxy resin, epoxy phosphazene, phosphorus compound or polyphenylene ether and curing agent ASAHI KASEI CHEMICALS CORPORATION (JP) 2010-03-02 US disclosed
US-20090032286-A1 Epoxy Resin Composition ASAHI KASEI CHEMICALS CORPORATION (JP) 2009-02-05 US disclosed
US-20080050596-A1 Flame-Retardant Epoxy Resin Composition ASAHI KASEI CHEMICALS CORPORATION (JP) 2008-02-28 US disclosed
EP-1867672-A1 EPOXY RESIN COMPOSITION Asahi Kasei Chemicals Corporation (JP) 2007-12-19 EP disclosed
EP-1775321-A1 FLAME-RETARDANT EPOXY RESIN COMPOSITION Asahi Kasei Chemicals Corporation (JP) 2007-04-18 EP disclosed
EP-0695316-B1 URETHANE MODIFIED EPOXY RESIN COMPOSITIONS CIBA GEIGY AG (CH) 1997-12-29 EP disclosed
US-5545697-A BLEND OF EPOXY RESIN CONTAINING AN OXAZOLIDONE RING, HALOGENCONTAINING EPOXY RESIN AND CURING AGENT CIBA-GEIGY CORPORATION (US) 1996-08-13 US disclosed
EP-0695316-A1 URETHANE MODIFIED EPOXY RESIN COMPOSITIONS Ciba SC Holding AG (CH) 1996-02-07 EP disclosed
US-5449737-A Urethane modified epoxy resin compositions CIBA-GEIGY CORPORATION (US) 1995-09-12 US disclosed
WO-1995021879-A1 URETHANE MODIFIED EPOXY RESIN COMPOSITIONS CIBA-GEIGY AG (CH) 1995-08-17 WO disclosed