⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15902482 | 0.93 | GAA (0.52) | — | |
| SCHEMBL29045278 | 0.91 | CYP1A2 (0.45) | — | |
| SCHEMBL20276162 | 0.87 | CYP1A2 (0.45) | — | |
| SCHEMBL28084236 | 0.87 | CYP1A2 (0.45) | — | |
| SCHEMBL29191098 | 0.87 | CYP1A2 (0.45) | — | |
| SCHEMBL15010581 | 0.87 | CYP1A2 (0.45) | — | |
| SCHEMBL28097115 | 0.86 | GAA (0.50) | — | |
| SCHEMBL28142247 | 0.86 | CYP1A2 (0.48) | — | |
| SCHEMBL2607005 | 0.86 | CYP1A2 (0.59) | — | |
| Ethyl Propionate SCHEMBL21647321 | 0.85 | GAA (0.48) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 9719 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260147279-A1 | DEVELOPER COMPOSITION FOR METAL-CONTAINING PHOTORESIST, AND METHOD OF FORMING PATTERNS INCLUDING DEVELOPING METHOD USING THE COMPOSITION | SAMSUNG SDI CO., LTD. (KR) | 2026-05-28 | — | — | US | claimed |
| US-20250377591-A1 | PHOTORESIST COMPOSITION AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | SAMSUNG ELECTRONICS CO LTD (KR) | 2025-12-11 | — | — | US | claimed |
| US-20250270481-A1 | THINNER COMPOSITION | DONGWOO FINE-CHEM CO., LTD. (KR) | 2025-08-28 | — | — | US | claimed |
| WO-2025106703-A1 | BIO-BASED COMPOSITIONS FOR PHOTORESISTS AND PATTERNING | HUSTAD PHILLIP DENE (US) | 2025-05-22 | — | — | WO | claimed |
| WO-2025106697-A1 | BIO-BASED COMPOSITIONS FOR PHOTORESISTS AND PATTERNING | HUSTAD PHILLIP DENE (US) | 2025-05-22 | — | — | WO | claimed |
| CN-114995058-B | Resin precursor composition, polyimide resin film containing resin precursor composition and application of polyimide resin film | 吉林奥来德光电材料股份有限公司 | 2025-05-06 | — | — | CN | claimed |
| CN-119620541-A | Preparation and application of bottom anti-reflection coating with high etching rate | 儒芯微电子材料（上海）有限公司 | 2025-03-14 | — | — | CN | claimed |
| US-20250021002-A1 | BOTTOM ANTI-REFLECTIVE COATING FOR DEEP ULTRAVIOLET LITHOGRAPHY, PREPARATION METHOD THEREFOR AND USE THEREOF | CHINA ADVANCED LITHOGRAPHIC MATERIAL TECHNOLOGY CO. LTD. (CN) | 2025-01-16 | — | — | US | claimed |
| CN-119081003-A | Polymerization reaction technology and application of crosslinkable polymer | 厦门大学 | 2024-12-06 | — | — | CN | claimed |
| CN-119087744-A | Immersion photoresist composition | 万华化学集团股份有限公司 | 2024-12-06 | — | — | CN | claimed |
| EP-0832082-A1 | N-HETEROARYL-PYRIDINESULFONAMIDE DERIVATIVES AND THEIR USE AS ENDOTHELIN ANTAGONISTS | ZENECA LIMITED (GB) | 1998-04-01 | — | — | EP | claimed |
| US-5700860-A | Liquid crystal orienting agent | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1997-12-23 | — | — | US | claimed |
| WO-1996040681-A1 | N-HETEROARYL-PYRIDINESULFONAMIDE DERIVATIVES AND THEIR USE AS ENDOTHELIN ANTAGONISTS | ZENECA LIMITED (GB) | 1996-12-19 | — | — | WO | claimed |
| EP-0718693-A2 | Photoresist compositions and components | SHIPLEY COMPANY INC. (US) | 1996-06-26 | — | — | EP | claimed |
| US-5456853-A | Ether esters and carbonates; nontoxic; evironmentally safe | RUST-OLEUM CORPORATION (US) | 1995-10-10 | — | — | US | claimed |
| EP-0211667-B1 | RADIATION-SENSITIVE RESIN COMPOSITION | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1992-03-11 | — | — | EP | claimed |
| EP-0457367-A1 | Radiation-sensitive resin composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1991-11-21 | — | — | EP | claimed |
| US-4814492-A | Method of preparing alkyl acrylates | TEXACO INC. (US) | 1989-03-21 | — | — | US | claimed |
| EP-0273026-A2 | Solvents for Photoresist compositions | SHIPLEY COMPANY INC. (US) | 1988-06-29 | — | — | EP | claimed |
| EP-0211667-A2 | Radiation-sensitive resin composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1987-02-25 | — | — | EP | claimed |