⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3922740 | 0.79 | — | — | |
| SCHEMBL2469601 | 0.79 | — | — | |
| SCHEMBL1072433 | 0.78 | — | — | |
| SCHEMBL3720367 | 0.78 | — | — | |
| Hydrochloric Acid SCHEMBL2994228 | 0.77 | — | — | |
| SCHEMBL18496767 | 0.72 | THRB (0.32) | — | |
| SCHEMBL2793070 | 0.71 | — | — | |
| Ethylenediamine SCHEMBL28547211 | 0.69 | — | — | |
| Methylamine SCHEMBL978488 | 0.68 | — | — | |
| SCHEMBL35885 | 0.68 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111518505-B | Moisture-hardening resin composition, preparation method thereof and application thereof as sealant | 浙江新安化工集团股份有限公司 | 2021-11-12 | — | — | CN | disclosed |
| CN-107428891-B | Curable composition | 施敏打硬株式会社 | 2021-04-20 | — | — | CN | disclosed |
| CN-105745290-B | Method for applying aged coating on substrate and coating composition suitable for use in the method | 阿克佐诺贝尔国际涂料股份有限公司 | 2021-03-23 | — | — | CN | disclosed |
| CN-105392845-B | Photocurable composition | 思美定株式会社 | 2020-10-20 | — | — | CN | disclosed |
| EP-3077468-B1 | A METHOD FOR COATING AN AGED COATING LAYER ON A SUBSTRATE, AND A COATING COMPOSITION SUITABLE FOR USE IN THIS METHOD | AKZO NOBEL COATINGS INT BV (NL) | 2018-02-28 | — | — | EP | disclosed |
| US-9718999-B2 | Photocurable composition having adhesive properties | CEMEDINE CO., LTD (JP) | 2017-08-01 | — | — | US | disclosed |
| US-20160312089-A1 | PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES | CEMEDINE CO., LTD. (JP) | 2016-10-27 | — | — | US | disclosed |
| EP-3081612-A1 | PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES | Cemedine Co., Ltd. (JP) | 2016-10-19 | — | — | EP | disclosed |
| EP-3077468-A2 | A METHOD FOR COATING AN AGED COATING LAYER ON A SUBSTRATE, AND A COATING COMPOSITION SUITABLE FOR USE IN THIS METHOD | Akzo Nobel Coatings International B.V. (NL) | 2016-10-12 | — | — | EP | disclosed |
| US-20160152783-A1 | PHOTOCURABLE COMPOSITION | CEMEDINE CO., LTD. (JP) | 2016-06-02 | — | — | US | disclosed |
| US-8235504-B2 | Inkjet head, inkjet apparatus, and inkjet apparatus production method | CANON KABUSHIKI KAISHA (JP) | 2012-08-07 | — | — | US | disclosed |
| EP-1652891-B1 | CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE | KONISHI CO LTD (JP) | 2012-06-13 | — | — | EP | disclosed |
| US-8197896-B2 | Method for producing a pressure-sensitive adhesive tape or sheet | KONISHI CO., LTD. (JP) | 2012-06-12 | — | — | US | disclosed |
| US-20110181665-A1 | INKJET HEAD, INKJET APPARATUS, AND INKJET APPARATUS PRODUCTION METHOD | CANON KABUSHIKI KAISHA (JP) | 2011-07-28 | — | — | US | disclosed |
| EP-1788035-B1 | REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE | KONISHI CO LTD (JP) | 2011-01-19 | — | — | EP | disclosed |
| US-7576167-B2 | Curable resin composition | KONISHI CO., LTD. (JP) | 2009-08-18 | — | — | US | disclosed |
| US-20080312401-A1 | Reactive Hot-Melt Resin Composition and Reactive Hot-Melt Adhesive | SATO SHINICHI | 2008-12-18 | — | — | US | disclosed |
| EP-1788035-A1 | REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE | Konishi Co., Ltd. (JP) | 2007-05-23 | — | — | EP | disclosed |
| US-20060189736-A1 | Curable resin composition and cold-setting adhesive | KONISHI CO., LTD. (JP) | 2006-08-24 | — | — | US | disclosed |
| EP-1652891-A1 | CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE | KONISHI CO., LTD. (JP) | 2006-05-03 | — | — | EP | disclosed |