Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.32 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
| ▸ | TP53 | P04637 | 1/20 | 0.31 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.31 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17449255 | 0.80 | CTSL (0.35) | — | |
| SCHEMBL733109 | 0.79 | TSHR (0.50) | TSHRSMN1; SMN2ALDH1A1TDP1TP53 | |
| SCHEMBL7879739 | 0.77 | NPC1 (0.30) | SMN1; SMN2TDP1TP53 | |
| SCHEMBL11790443 | 0.75 | PPM1B (0.35) | — | |
| SCHEMBL730238 | 0.75 | TSHR (0.43) | TSHRSMN1; SMN2ALDH1A1TDP1TP53 | |
| SCHEMBL5383725 | 0.75 | — | — | |
| SCHEMBL23135367 | 0.74 | TSHR (0.39) | TSHRSMN1; SMN2ALDH1A1TDP1TP53 | |
| SCHEMBL17085515 | 0.74 | TSHR (0.44) | TSHRSMN1; SMN2ALDH1A1TDP1TP53 | |
| SCHEMBL11761049 | 0.74 | — | — | |
| SCHEMBL14062955 | 0.73 | TSHR (0.44) | TSHRSMN1; SMN2ALDH1A1TDP1TP53 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 105 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12434427-B2 | Microstructured surface with increased microorganism removal when cleaned, articles and methods | SOLVENTUM INTELLECTUAL PROPERTIES COMPANY (US) | 2025-10-07 | — | — | US | disclosed |
| US-12404386-B2 | Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2025-09-02 | — | — | US | disclosed |
| US-20250179293-A1 | POLYETHYLENE TEREPHTHALATE RESIN COMPOSITION AND MOLDED ARTICLE | MITSUBISHI CHEMICAL CORPORATION (JP) | 2025-06-05 | — | — | US | disclosed |
| US-12290991-B2 | Thermoplastic resin composition for millimeter-wave radar member, molded article, and method for producing resin composition | MITSUBISHI CHEMICAL CORPORATION (JP) | 2025-05-06 | — | — | US | disclosed |
| EP-4491670-A1 | POLYETHYLENE TEREPHTHALATE RESIN COMPOSITION AND MOLDED ARTICLE | Mitsubishi Chemical Corporation (JP) | 2025-01-15 | — | — | EP | disclosed |
| CN-118829690-A | Polyethylene terephthalate resin composition and molded article | 三菱化学株式会社 | 2024-10-22 | — | — | CN | disclosed |
| US-20240343897-A1 | RESIN COMPOSITION | MITSUBISHI CHEMICAL CORPORATION (JP) | 2024-10-17 | — | — | US | disclosed |
| US-12110388-B2 | Polybutylene terephthalate resin composition and molded article | MITSUBISHI CHEMICAL CORPORATION (JP) | 2024-10-08 | — | — | US | disclosed |
| US-12098273-B2 | Polybutylene terephthalate resin composition | MITSUBISHI CHEMICAL CORPORATION (JP) | 2024-09-24 | — | — | US | disclosed |
| EP-4397485-A1 | MULTI-LAYER BODY AND MOLDED ARTICLE | Mitsubishi Chemical Corporation (JP) | 2024-07-10 | — | — | EP | disclosed |
| US-5241082-A | AROMATIC TRISANHYDRIDES | CIBA-GEIGY CORPORATION (US) | 1993-08-31 | — | — | US | disclosed |
| US-5202390-A | Adhesives, seals | CIBA-GEIGY CORPORATION (US) | 1993-04-13 | — | — | US | disclosed |
| EP-0527706-A1 | High performance epoxy adhesive composition with high flexibility and toughness | CIBA-GEIGY AG (CH) | 1993-02-17 | — | — | EP | disclosed |
| EP-0504108-A2 | Aromatic trisanhydrides | CIBA-GEIGY AG (CH) | 1992-09-16 | — | — | EP | disclosed |
| US-5140069-A | Including an anhydride; high impact strength; toughness; glass transition temperatures; adhesives; coatings | CIBA-GEIGY CORPORATION (US) | 1992-08-18 | — | — | US | disclosed |
| EP-0488949-A2 | High performance epoxy adhesive | CIBA-GEIGY AG (CH) | 1992-06-03 | — | — | EP | disclosed |
| US-5073601-A | Adhesives, sealing compounds | CIBA-GEIGY CORPORATION (US) | 1991-12-17 | — | — | US | disclosed |
| EP-0417043-A2 | Curing agents and accelerators for epoxy- and isocyanate resins | CIBA-GEIGY AG (CH) | 1991-03-13 | — | — | EP | disclosed |
| EP-0353190-A2 | Flexibiliser combinations for epoxy resins | CIBA-GEIGY AG (CH) | 1990-01-31 | — | — | EP | disclosed |
| US-4038338-A | NEW POLYEPOXIDE-POLYSILOXANE COMPOUNDS | CIBA-GEIGY CORPORATION (US) | 1977-07-26 | — | — | US | disclosed |