SCHEMBL10798485

SCHEMBL10798485

CC(CCl)C[Si]1(C)CCCCO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6140728 0.82
SCHEMBL12878731 0.78
SCHEMBL9064718 0.77
SCHEMBL1635149 0.76
SCHEMBL6842421 0.74
SCHEMBL662596 0.73
SCHEMBL12814535 0.73 ALDH1A1 (0.34)
SCHEMBL9128125 0.71
SCHEMBL6298767 0.70
SCHEMBL359200 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0091291-B1 ROOM TEMPERATURE STABLE, HEAT ACTIVATED ORGANOPOLYSILOXANE COMPOSITIONS Toray Silicone Company Limited (JP) 1987-05-13 EP disclosed
US-4465818-A Room temperature stable, heat activated organopolysiloxane compositions TORAY SILICONE COMPANY, LTD. (JP) 1984-08-14 US disclosed
US-4439630-A ENCAPSULATION AND INSULATION DOW CORNING CORPORATION (US) 1984-03-27 US disclosed
EP-0091291-A2 Room temperature stable, heat activated organopolysiloxane compositions Toray Silicone Company Limited (JP) 1983-10-12 EP disclosed
EP-0080704-A1 Silicone compositions for buried electrical splice closures DOW CORNING CORPORATION (US) 1983-06-08 EP disclosed