SCHEMBL108663

SCHEMBL108663

CC1CNC(c2ccccc2)=N1

nearest known ligand 0.47

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
NISCH Q9Y2I1 6/20 0.47
GAA P10253 2/20 0.40
TSHR P16473 1/20 0.40
P2RX7 Q99572 2/20 0.38
RAB9A P51151 3/20 0.37
ALDH1A1 P00352 2/20 0.37
CHRM1 P11229 1/20 0.37
MAPT P10636 1/20 0.37
MEN1 O00255 2/20 0.36
KMT2A Q03164 2/20 0.36
NPY5R Q15761 1/20 0.34
NPC1 O15118 2/20 0.34
CYP1A2 P05177 1/20 0.34
HPGD P15428 1/20 0.34
CASP1 P29466 1/20 0.34
CASP7 P55210 1/20 0.34
HSD17B10 Q99714 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1627638 0.90 NISCH (0.37) NISCH
SCHEMBL9579786 0.86 NISCH (0.40) NISCHNPC1
SCHEMBL20323167 0.82 NISCH (0.49) NISCHALDH1A1MAPTMEN1KMT2A
SCHEMBL2491843 0.81 CYP3A4 (0.36) NISCHRAB9AALDH1A1MAPTMEN1
SCHEMBL1685395 0.81 NISCH (0.31) NISCH
SCHEMBL11835012 0.81 LMNA (0.44) ALDH1A1NPY5RHPGD
SCHEMBL1884232 0.81 MEN1 (0.38) NISCHRAB9AALDH1A1MAPTMEN1
SCHEMBL5111714 0.79 NISCH (0.51) NISCHGAANPY5R
SCHEMBL3264045 0.77 NISCH (0.36) NISCH
SCHEMBL11826597 0.77 NISCH (0.50) NISCHRAB9ANPY5RNPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 505 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122037138-A Modified epoxy resin, preparation method thereof, epoxy plastic package material and application 深圳先进电子材料国际创新研究院 2026-05-15 CN claimed
CN-111511809-B Curing agent composition and resin composition containing the same 赫克塞尔合成有限公司 2024-08-16 CN claimed
CN-117487309-A Epoxy plastic package material and preparation method and application thereof 深圳先进电子材料国际创新研究院 2024-02-02 CN claimed
CN-116970260-B Epoxy plastic package material and preparation method and application thereof 深圳先进电子材料国际创新研究院 2024-01-23 CN claimed
CN-116970260-A Epoxy plastic package material and preparation method and application thereof 深圳先进电子材料国际创新研究院 2023-10-31 CN claimed
CN-116970256-A High-flame-retardance epoxy plastic package material and preparation method and application thereof 深圳先进电子材料国际创新研究院 2023-10-31 CN claimed
CN-116444942-A Self-repairing epoxy plastic packaging material and preparation method and application thereof 深圳先进电子材料国际创新研究院 2023-07-18 CN claimed
US-20200385536-A1 A CURATIVE COMPOSITION AND A RESIN COMPOSITION CONTAINING THE CURATIVE COMPOSITION HEXCEL COMPOSITES LIMITED (GB) 2020-12-10 US claimed
EP-3728414-A1 A CURATIVE COMPOSITION AND A RESIN COMPOSITION CONTAINING THE CURATIVE COMPOSITION Hexcel Composites Limited (GB) 2020-10-28 EP claimed
CN-111511809-A Curing agent composition and resin composition containing same 赫克塞尔合成有限公司 2020-08-07 CN claimed
US-6063497-A BASED ON EPOXY RESINS HAVING 1,2-EPOXIDE GROUPS AND HYDROXYL GROUP(S) IN THE RESIN, AND CURING AGENTS INCLUDING POLYISOCYANATES BLOCKED WITH INERT AGENTS AND CYCLIC AMIDINE(S) OF GIVEN FORMULA; HEAT STABILITY, SOLVENT RESISTANT HUELS AKTIENGESELLSCHAFT (DE) 2000-05-16 US claimed
US-5874173-A A POLYURETHANE POLYEPOXIDE OR EPOXY RESIN COPOLYMER COMPRISING POLYISOCYANATES AND A POLYISOCYANATES BLOCKED WITH CYCLIC AMIDINES CATALYSTS; STORAGE STABILITY, BONDING STRENGTH, TENSILE STRENGTH, SOLVENT RESISTANCE HUELS AKTIENGESLLSCHAFT (DE) 1999-02-23 US claimed
US-5719240-A HARDENER FOR EPOXY RESIN HUELS AKTIENGESELLSCHAFT (DE) 1998-02-17 US claimed
EP-0818484-A1 Thermosetting one-component adhesives, which do not release any decomposition-products or solvents on the basis of polyurethanes, process for their preparation and their use HÜLS AKTIENGESELLSCHAFT (DE) 1998-01-14 EP claimed
EP-0781771-A1 Compounds containing cyclic amidine and uretedione groups, a method for their preparation and their use HÜLS AKTIENGESELLSCHAFT (DE) 1997-07-02 EP claimed
US-4695613-A EPOXY RESIN, CYCLIC AMIDINE NEUTRALIZED OLIGOESTER HUELS AKTIENGESELLSCHAFT (DE) 1987-09-22 US claimed
US-4246394-A PROMOTER FOR CROSSLINKING VEBA-CHEMIE AKTIENGESELLSCHAFT (DE) 1981-01-20 US claimed
EP-0000418-A1 Process for glueing materials CHEMISCHE WERKE HÜLS AG (DE) 1979-01-24 EP claimed
CN-122037138-A Modified epoxy resin, preparation method thereof, epoxy plastic package material and application 深圳先进电子材料国际创新研究院 2026-05-15 CN disclosed
US-3932450-A Intermediates in the preparation of imidazo(2,1-alpha)isoindoles SANDOZ, INC. (US) 1976-01-13 US disclosed