Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 7/20 | 0.50 |
| ▸ | LMNA | P02545 | 5/20 | 0.50 |
| ▸ | MAPT | P10636 | 5/20 | 0.50 |
| ▸ | HPGD | P15428 | 4/20 | 0.49 |
| ▸ | HTT | P42858 | 4/20 | 0.49 |
| ▸ | MEN1 | O00255 | 3/20 | 0.45 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.45 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.45 |
| ▸ | GFER | P55789 | 1/20 | 0.39 |
| ▸ | MAPK1 | P28482 | 3/20 | 0.39 |
| ▸ | POLB | P06746 | 2/20 | 0.39 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.39 |
| ▸ | CNR2 | P34972 | 1/20 | 0.39 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.38 |
| ▸ | BLM | P54132 | 1/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.38 |
| ▸ | TUBB4A | P04350 | 1/20 | 0.38 |
| ▸ | TUBB | P07437 | 1/20 | 0.38 |
| ▸ | TUBA3C | P0DPH7 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31346592 | 1.00 | KDM4E (0.50) | KDM4ELMNAMAPTHPGDHTT | |
| SCHEMBL514041 | 1.00 | KDM4E (0.50) | KDM4ELMNAMAPTHPGDHTT | |
| SCHEMBL29350853 | 1.00 | KDM4E (0.50) | KDM4ELMNAMAPTHPGDHTT | |
| SCHEMBL2735115 | 1.00 | KDM4E (0.50) | KDM4ELMNAMAPTHPGDHTT | |
| SCHEMBL29056369 | 0.97 | MAPT (0.47) | KDM4ELMNAMAPTHPGDHTT | |
| SCHEMBL30355181 | 0.94 | KDM4E (0.47) | KDM4ELMNAMAPTHPGDHTT | |
| SCHEMBL29557410 | 0.92 | KDM4E (0.43) | KDM4ELMNAMAPTHPGDHTT | |
| SCHEMBL23346983 | 0.92 | HPGD (0.51) | KDM4ELMNAMAPTHPGDHTT | |
| SCHEMBL15996476 | 0.92 | KDM4E (0.48) | KDM4ELMNAMAPTHPGDHTT | |
| SCHEMBL25629805 | 0.92 | KDM4E (0.48) | KDM4ELMNAMAPTHPGDHTT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 2198 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260035490-A1 | PHOTOPOLYMERIZATION SYNERGIST | Piedmont Chemical Industries I, LLC | 2026-02-05 | — | — | US | claimed |
| EP-4661057-A1 | METHOD FOR MANUFACTURING PLURALITY OF THIN WAFERS | Denka Company Limited (JP) | 2025-12-10 | — | — | EP | claimed |
| EP-4660266-A1 | COMPOSITION FOR TEMPORARY FIXING, ADHESIVE FOR TEMPORARY FIXING, AND THIN WAFER PRODUCTION METHOD | Denka Company Limited (JP) | 2025-12-10 | — | — | EP | claimed |
| US-20250311495-A1 | TRANSFER SUBSTRATE STRUCTURE, TRANSFER ASSEMBLY AND MICRODEVICE TRANSFER METHOD | Xiamen Extremely PQ Display Technology Co., Ltd. (CN) | 2025-10-02 | — | — | US | claimed |
| US-12221534-B2 | Composition | DENKA COMPANY LIMITED (JP) | 2025-02-11 | — | — | US | claimed |
| EP-4148096-B1 | COMPOSITION | DENKA COMPANY LTD (JP) | 2024-12-18 | — | — | EP | claimed |
| WO-2024162058-A1 | COMPOSITION FOR TEMPORARY FIXING, ADHESIVE FOR TEMPORARY FIXING, AND THIN WAFER PRODUCTION METHOD | デンカ株式会社 | 2024-08-08 | — | — | WO | claimed |
| WO-2024162054-A1 | METHOD FOR MANUFACTURING PLURALITY OF THIN WAFERS | デンカ株式会社 | 2024-08-08 | — | — | WO | claimed |
| WO-2024162057-A1 | COMPOSITION | デンカ株式会社 | 2024-08-08 | — | — | WO | claimed |
| WO-2024162053-A1 | COMPOSITION FOR TEMPORARY FIXATION, ADHESIVE FOR TEMPORARY FIXATION, AND METHOD FOR PRODUCING THIN WAFER | デンカ株式会社 | 2024-08-08 | — | — | WO | claimed |
| US-10774424-B2 | Metalization of surfaces | CUPTRONIC TECHNOLOGY LTD. (CY) | 2020-09-15 | — | — | US | claimed |
| US-10752719-B2 | Composition for soft mold and soft mold manufactured by using the composition | SAMSUNG DISPLAY CO., LTD. (KR) | 2020-08-25 | — | — | US | claimed |
| EP-3632941-A1 | RESIN COMPOSITION | Cubicure GmbH (AT) | 2020-04-08 | — | — | EP | claimed |
| CN-110791150-A | Curable resin composition for inkjet, printed wiring board, and method for producing printed wiring board | 株式会社田村制作所 | 2020-02-14 | — | — | CN | claimed |
| US-10385240-B2 | Acrylate-terminated urethane polybutadienes from low-monomer 1:1 monoadducts from reactive olefinic compounds and diisocyanates and hydroxy-terminated polybutadienes for liquid optically clear adhesives (LOCAs) | EVONIK DEGUSSA GMBH (DE) | 2019-08-20 | — | — | US | claimed |
| US-20180298134-A1 | COMPOSITION FOR SOFT MOLD AND SOFT MOLD MANUFACTURED BY USING THE COMPOSITION | SAMSUNG DISPLAY CO., LTD. (KR) | 2018-10-18 | — | — | US | claimed |
| EP-2738226-B1 | PHOTOCURABLE INK JET INK AND ELECTRONIC CIRCUIT BOARD | JNC CORP (JP) | 2018-09-05 | — | — | EP | claimed |
| US-20170176811-A1 | COLOR PHOTORESIST AND ITS USE, COLOR FILM SUBSTRATE, DISPLAY PANEL AND LIQUID CRYSTAL DISPLAY | BOE TECHNOLOGY GROUP CO., LTD. (CN) | 2017-06-22 | — | — | US | claimed |
| US-20170174956-A1 | Acrylate-Terminated Urethane Polybutadienes From Low-Monomer 1:1 Monoadducts From Reactive Olefinic Compounds and Diisocyanates and Hydroxy-Terminated Polybutadienes for Liquid Optically Clear Adhesives (LOCAs) | EVONIK OPERATIONS GMBH (DE) | 2017-06-22 | — | — | US | claimed |
| EP-2738226-A1 | PHOTOCURABLE INK JET INK AND ELECTRONIC CIRCUIT BOARD | JNC Corporation (JP) | 2014-06-04 | — | — | EP | claimed |