SCHEMBL1088940

SCHEMBL1088940

C=Cc1ccc(C(=O)Oc2ccc(OC(C)=O)cc2)cc1

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 7/20 0.51
MAPT P10636 7/20 0.51
GFER P55789 1/20 0.51
MEN1 O00255 4/20 0.50
KDM4E B2RXH2 3/20 0.50
LMNA P02545 2/20 0.50
SMN1; SMN2 Q16637 2/20 0.50
ELANE P08246 1/20 0.50
TTR P02766 1/20 0.50
TP53 P04637 1/20 0.50
CYP3A4 P08684 1/20 0.50
HSD17B10 Q99714 2/20 0.49
RAB9A P51151 1/20 0.46
TDP1 Q9NUW8 1/20 0.46
ESR1 P03372 1/20 0.44
PGR P06401 1/20 0.44
CHRM2 P08172 1/20 0.44
ADORA3 P0DMS8 1/20 0.44
AR P10275 1/20 0.44
CHRM1 P11229 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1088035 1.00 KMT2A (0.51) KMT2AMAPTGFERMEN1KDM4E
SCHEMBL103296 0.91 KMT2A (0.54) KMT2AMAPTGFERMEN1KDM4E
SCHEMBL16812851 0.91 KMT2A (0.54) KMT2AMAPTGFERMEN1KDM4E
SCHEMBL1089254 0.90 ELANE (0.62) KMT2AMAPTMEN1KDM4ELMNA
SCHEMBL72231 0.89 MAPT (0.59) KMT2AMAPTMEN1KDM4ELMNA
Hydrochloric Acid SCHEMBL31143691 0.88 MAPT (0.58) KMT2AMAPTMEN1KDM4ELMNA
Bromide SCHEMBL31143723 0.88 MAPT (0.58) KMT2AMAPTMEN1KDM4ELMNA
Fluoride SCHEMBL31143711 0.88 MAPT (0.58) KMT2AMAPTMEN1KDM4ELMNA
Ethylene SCHEMBL28137622 0.88 MAPT (0.58) KMT2AMAPTMEN1KDM4ELMNA
SCHEMBL28924617 0.87 MAPT (0.68) KMT2AMAPTGFERMEN1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8535872-B2 Thermally cured underlayer for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2013-09-17 US disclosed
US-20120178871-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION DE BINOD B (US) 2012-07-12 US disclosed
US-8153346-B2 Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2012-04-10 US disclosed
WO-2008103776-A2 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-28 WO disclosed
US-20080206676-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC 2008-08-28 US disclosed