SCHEMBL1089077

SCHEMBL1089077

CCN(CC)C12CC3CC(CC(C3)C1)C2

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GRIN2D O15399 5/20 0.52
GRIN3B O60391 5/20 0.52
GRIN1 Q05586 5/20 0.52
GRIN2A Q12879 5/20 0.52
GRIN2B Q13224 5/20 0.52
GRIN2C Q14957 5/20 0.52
GRIN3A Q8TCU5 5/20 0.52
LMNA P02545 2/20 0.39
SLC22A2 O15244 2/20 0.39
SLC47A1 Q96FL8 2/20 0.39
SLC22A1 O15245 1/20 0.39
TSHR P16473 1/20 0.39
NFKB1 P19838 1/20 0.39
STAT6 P42226 1/20 0.39
SIGMAR1 Q99720 1/20 0.39
SMN1; SMN2 Q16637 2/20 0.38
POLB P06746 1/20 0.38
THRB P10828 1/20 0.38
BLM P54132 1/20 0.38
PMP22 Q01453 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL27617730 0.97 GRIN2D (0.50) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B
Phosphine SCHEMBL27873092 0.97 GRIN2D (0.50) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B
SCHEMBL1678727 0.81 GRIN2D (0.40) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B
Hydrochloric Acid SCHEMBL4950314 0.81 GRIN2D (0.40) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B
SCHEMBL23269928 0.77 GRIN2D (0.56) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B
SCHEMBL11150530 0.75 GRIN2D (0.54) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B
SCHEMBL17347047 0.75 GRIN2D (0.48) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B
Hydrochloric Acid SCHEMBL11156628 0.73 GRIN2D (0.52) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B
SCHEMBL1678049 0.73 GRIN2D (0.46) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B
Hydrochloric Acid SCHEMBL5962394 0.71 GRIN2D (0.39) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025106697-A1 BIO-BASED COMPOSITIONS FOR PHOTORESISTS AND PATTERNING HUSTAD PHILLIP DENE (US) 2025-05-22 WO disclosed
US-20250068079-A1 BIO-BASED SOLVENTS FOR NEGATIVE TONE DEVELOPMENT HUSTAD PHILLIP DENE (US) 2025-02-27 US disclosed
CN-119173819-A Bio-based solvent for negative imaging 菲利普·德内·于斯塔德 2024-12-20 CN disclosed
WO-2024107979-A1 BIO-BASED SOLVENTS FOR NEGATIVE TONE DEVELOPMENT HUSTAD PHILLIP DENE (US) 2024-05-23 WO disclosed
EP-2997075-B1 NOVEL POLYMER AND THERMOSETTING COMPOSITION CONTAINING SAME FUJIFILM ELECTRONIC MAT USA INC (US) 2021-12-15 EP disclosed
US-10604628-B2 Polymer and thermosetting composition containing same FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2020-03-31 US disclosed
EP-2387735-B1 NONPOLYMERIC BINDERS FOR SEMICONDUCTOR SUBSTRATE COATINGS FUJIFILM ELECTRONIC MAT USA INC (US) 2019-03-13 EP disclosed
CN-105408399-B Novel polymers and thermosetting compositions containing same 富士胶片电子材料美国有限公司 2019-01-01 CN disclosed
US-20170260330-A1 Novel Polymer and Thermosetting Composition Containing Same FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2017-09-14 US disclosed
US-9695284-B2 Polymer and thermosetting composition containing same FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2017-07-04 US disclosed
WO-2008103776-A2 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-28 WO disclosed
US-20080199805-A1 PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES FUJIFILM ELECTRONIC MATERIALS. U.S.A., INC. 2008-08-21 US disclosed
US-20080199814-A1 Device manufacturing process utilizing a double patterning process FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. 2008-08-21 US disclosed
WO-2008098189-A1 PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-14 WO disclosed
WO-2008070060-A2 DEVICE MANUFACTURING PROCESS UTILIZING A DOUBLE PATTERING PROCESS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-06-12 WO disclosed
US-20060270742-A1 Compositions and methods for the treatment of neurodegenerative diseases COMBINATORX, INC. 2006-11-30 US disclosed
US-7022456-B2 Positive photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 2006-04-04 US disclosed
US-20040048190-A1 Positive photoresist composition FUJI PHOTO FILM CO., LTD. 2004-03-11 US disclosed
US-5395895-A Ethylene-maleic anhydride copolymer with polyhydric alcohol and catalysts SHOWA DENKO K.K. (JP) 1995-03-07 US disclosed
EP-0565734-A1 RESIN COMPOSITION AND MOLDING PRODUCED THEREFROM SHOWA DENKO KABUSHIKI KAISHA (JP) 1993-10-20 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20170260330-A1 Novel Polymer and Thermosetting Composition Containing Same INO80C, INCENP, PUF60 GRIN2D 4798/4885GRIN3B 4591/4885GRIN1 4323/4885
US-20060270742-A1 Compositions and methods for the treatment of neurodegenerative diseases PSEN2, PSEN1, HTT GRIN2D 320/4885GRIN3B 110/4885GRIN1 221/4885
US-10604628-B2 Polymer and thermosetting composition containing same PARG, INO80C, INCENP GRIN2D 4797/4885GRIN3B 4546/4885GRIN1 4367/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.