SCHEMBL1089121

SCHEMBL1089121

CC(=Cc1ccc(C2CCCC(C)C2)cc1)C(=O)O

nearest known ligand 0.46

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
AKR1C3 P42330 2/20 0.46
TBXAS1 P24557 5/20 0.38
KDM4E B2RXH2 2/20 0.36
MEN1 O00255 1/20 0.36
KMT2A Q03164 1/20 0.36
RARG P13631 2/20 0.35
RARB P10826 1/20 0.35
PKM P14618 1/20 0.35
MAPK1 P28482 1/20 0.35
HPGD P15428 2/20 0.34
HAO1 Q9UJM8 1/20 0.34
ALDH1A1 P00352 3/20 0.33
FFAR4 Q5NUL3 1/20 0.33
HSD17B10 Q99714 1/20 0.33
CNR2 P34972 2/20 0.33
NPC1 O15118 1/20 0.33
RAB9A P51151 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
AKR1C1 Q04828 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1088772 0.85 AKR1C3 (0.55) AKR1C3TBXAS1KDM4EMEN1KMT2A
SCHEMBL1088771 0.85 AKR1C3 (0.55) AKR1C3TBXAS1KDM4EMEN1KMT2A
SCHEMBL1089451 0.84 AKR1C3 (0.53) AKR1C3TBXAS1KDM4EMEN1KMT2A
SCHEMBL1088970 0.84 AKR1C3 (0.53) AKR1C3TBXAS1KDM4EMEN1KMT2A
SCHEMBL1089453 0.84 AKR1C3 (0.53) AKR1C3TBXAS1KDM4EMEN1KMT2A
SCHEMBL1088972 0.84 AKR1C3 (0.53) AKR1C3TBXAS1KDM4EMEN1KMT2A
SCHEMBL1089129 0.82 AKR1C3 (0.51) AKR1C3TBXAS1KDM4EMEN1KMT2A
SCHEMBL1088832 0.79 ESR1 (0.44) KDM4EMEN1KMT2ARARBPKM
SCHEMBL1088631 0.77 AKR1C3 (0.51) AKR1C3TBXAS1MEN1KMT2ARARG
SCHEMBL4797936 0.77 AKR1C3 (0.51) AKR1C3TBXAS1MEN1KMT2ARARG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8535872-B2 Thermally cured underlayer for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2013-09-17 US disclosed
US-20120178871-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION DE BINOD B (US) 2012-07-12 US disclosed
US-8153346-B2 Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2012-04-10 US disclosed
US-20080206676-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC 2008-08-28 US disclosed
WO-2008103776-A2 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-28 WO disclosed
US-7416821-B2 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2008-08-26 US disclosed
EP-1743363-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FujiFilm Electronic Materials USA, Inc. (US) 2007-01-17 EP disclosed
US-20050238997-A1 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. 2005-10-27 US disclosed
WO-2005089150-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS USA INC. (US) 2005-09-29 WO disclosed