SCHEMBL1097600

SCHEMBL1097600

[Bi].[Bi].[O-2].[O-2].[O-2].[O-2].[O-2].[SrH2].[SrH2].[Ta+5].[Ta+5]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL472237 0.75
SCHEMBL2524722 0.75
SCHEMBL6854870 0.75
SCHEMBL29929445 0.71
SCHEMBL34398 0.71
SCHEMBL29382254 0.71
SCHEMBL11654272 0.71
SCHEMBL1902881 0.71
SCHEMBL29833055 0.71
SCHEMBL1394687 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6962840-B2 Method of forming MOS transistor SAMSUNG ELECTRONICS CO., LTD. (KR) 2005-11-08 US claimed
US-6869835-B2 Method of forming MOS transistor SAMSUNG ELECTRONICS, CO., LTD (KR) 2005-03-22 US claimed
US-6765255-B2 Semiconductor device having metal-insulator-metal capacitor and fabrication method thereof SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-07-20 US claimed
US-20040048427-A1 Method of forming MOS transistor SAMSUNG ELECTRONICS CO., INC. 2004-03-11 US claimed
US-20040048435-A1 Method of forming MOS transistor SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-03-11 US claimed
US-20030183862-A1 Semiconductor device having metal-insulator-metal capacitor and fabrication method thereof SAMSUNG ELECTRONICS CO., LTD. 2003-10-02 US claimed
US-6417012-B1 Method of forming ferroelectric capacitor in semiconductor device HYNIX SEMICONDUCTOR INC. (KR) 2002-07-09 US claimed
US-20020072192-A1 Method of forming ferroelectric capacitor in semiconductor device HYNIX SEMICONDUCTOR INC. (KR) 2002-06-13 US claimed
US-5683614-A FORMING A LAYERED PEROVSKITE BISMUTH-STRONTIUM-TANTALUM OXIDE FERROELECTRIC MATERIAL SANDIA CORPORATION (US) 1997-11-04 US claimed
US-11121139-B2 Hafnium oxide and zirconium oxide based ferroelectric devices with textured iridium bottom electrodes INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2021-09-14 US disclosed
US-9842984-B2 Piezoelectric element Konica Minolta, Inc. (JP) 2017-12-12 US disclosed
EP-2264795-B1 Light emitting diode and manufacturing method thereof LG ELECTRONICS INC (KR) 2015-04-22 EP disclosed
US-20150084486-A1 PIEZOELECTRIC ELEMENT Konica Minolta, Inc. (JP) 2015-03-26 US disclosed
US-8153527-B2 Method for reducing sidewall etch residue GLOBALFOUNDRIES SINGAPORE PTE. LTD. (SG) 2012-04-10 US disclosed
US-20020024140-A1 Semiconductor device HITACHI, LTD. (JP) 2002-02-28 US disclosed
US-20010051414-A1 Semiconductor integrated circuit and method for manufacturing the same TOSHIBA MEMORY CORPORATION (JP) 2001-12-13 US disclosed
US-6210752-B1 All-alkoxide synthesis of strontium-containing metal oxides SANDIA CORPORATION 2001-04-03 US disclosed
US-6153317-A Perovskite phase thin films and method of making SANDIA CORPORATION (US) 2000-11-28 US disclosed
US-5683614-A FORMING A LAYERED PEROVSKITE BISMUTH-STRONTIUM-TANTALUM OXIDE FERROELECTRIC MATERIAL SANDIA CORPORATION (US) 1997-11-04 US disclosed
US-5683614-A FORMING A LAYERED PEROVSKITE BISMUTH-STRONTIUM-TANTALUM OXIDE FERROELECTRIC MATERIAL SANDIA CORPORATION (US) 1997-11-04 US disclosed