SCHEMBL1100490

SCHEMBL1100490

Nc1c(F)c(F)c(F)c(-c2c(F)c(N)c(F)c(F)c2F)c1F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7875154 1.00 — —
Water SCHEMBL8081999 0.97 — —
Water SCHEMBL7869935 0.97 — —
SCHEMBL3945315 0.96 — —
SCHEMBL7871365 0.93 — —
SCHEMBL600277 0.93 — —
SCHEMBL9706900 0.90 — —
SCHEMBL7872067 0.89 — —
Water SCHEMBL16566506 0.89 — —
Hydrochloric Acid SCHEMBL8644309 0.89 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8153260-B2 Composite material ADEKA CORPORATION (JP) 2012-04-10 — — US disclosed
US-7851121-B2 Photosensitive polyimide composition and polyimide precursor composition CENTRAL GLASS CO., LTD. (JP) 2010-12-14 — — US disclosed
US-20100112323-A1 COMPOSITE MATERIAL ADEKA CORPORATION (JP) 2010-05-06 — — US disclosed
US-20090176172-A1 PHOTOSENSITIVE POLYIMIDE COMPOSITION AND POLYIMIDE PRECURSOR COMPOSITION CENTRAL GLASS CO., LTD. (JP) 2009-07-09 — — US disclosed
WO-2007092011-A1 PHOTOSENSITIVE POLYIMIDE COMPOSITION AND POLYIMIDE PRECURSOR COMPOSITION CENTRAL GLASS CO., LTD. (JP) 2007-08-16 — — WO disclosed
US-6316170-B2 COATING, EXPOSURE, DEVELOPMENT AND HEAT TREATMENT KABUSHIKI KAISHA TOSHIBA (JP) 2001-11-13 — — US disclosed
US-6303743-B1 Polyimide for optical communications, method of preparing the same, and method of forming multiple polyimide film using the polyimide SAMSUNG ELECTRONICS CO., LTD. (KR) 2001-10-16 — — US disclosed
US-20010006767-A1 Developing solution and method of forming polyimide pattern by using the developing solution YOSHIAKI KAWAMONZEN 2001-07-05 — — US disclosed
US-6183934-B1 FOE USE IN FORMATION OF PATTERN OF INSULATION FILM, PASSIVATION FILM, .ALPHA.-RAY SHIELDING FILM, OPTICAL WAVEGUIDE KABUSHIKI KAISHA TOSHIBA (JP) 2001-02-06 — — US disclosed
US-6159654-A Negative photosensitive polymer composition of a thermosetting polymer precursor curable by cyclodehydration upon heating KABUSHIKI KAISHA TOSHIBA (JP) 2000-12-12 — — US disclosed
US-5901259-A Optical waveplate, method of manufacturing the same, and waveguide device using the same NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1999-05-04 — — US disclosed
US-5849934-A Method for preparing aromatic compounds NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1998-12-15 — — US disclosed
US-5756650-A COMPOSITION COMPRISING POLYAMIC ACID, CURE ACCELERATOR SELECTED FROM GROUP CONSISTING OF NITROGEN-CONTAINING HETEROCYCLIC COMPOUND, AMINO ACID COMPOUND, AROMATIC COMPOUND HAVING TWO OR MORE HYDROXYL GROUPS KABUSHIKI KAISHA TOSHIBA (JP) 1998-05-26 — — US disclosed
US-5750731-A POLYIMIDE ANHYDRIDE MONOMERS NIPPON TELEGRAPH & TELEPHONE CORPORATION (JP) 1998-05-12 — — US disclosed
US-5694496-A WAVEGUIDE COMPRISING AN AROMATIC FLUORO-POLYIMIDE; HEAT RESISTANCE, FLEXIBILITY, WATERPROOFING, STRENGTH NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1997-12-02 — — US disclosed
EP-0480266-B1 Perfluorinated polyimide, perfluorinated poly(amic acid), starting compounds therefor, and methods for preparing them NIPPON TELEGRAPH & TELEPHONE (JP) 1996-06-26 — — EP disclosed
EP-0623830-A1 Optical waveplate, method of manufacturing the same, and waveguide device using the same NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1994-11-09 — — EP disclosed
US-5233018-A Heat resistance and low optical transmission loss in the near-infrared region; integrated circuits NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1993-08-03 — — US disclosed
EP-0480266-A2 Perfluorinated polyimide, perfluorinated poly(amic acid), starting compounds therefor, and methods for preparing them NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1992-04-15 — — EP disclosed
US-4271288-A TETRACARBOXYLIC ACID BONDED TO ARYLENE MOIETY VIA METHYLENE GROUPS THE DOW CHEMICAL COMPANY (US) 1981-06-02 — — US disclosed
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