SCHEMBL1100490

SCHEMBL1100490

Nc1c(F)c(F)c(F)c(-c2c(F)c(N)c(F)c(F)c2F)c1F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7875154 1.00
Water SCHEMBL8081999 0.97
Water SCHEMBL7869935 0.97
SCHEMBL3945315 0.96
SCHEMBL600277 0.93
SCHEMBL7871365 0.93
SCHEMBL9706900 0.90
SCHEMBL7872067 0.89
Water SCHEMBL16566506 0.89
Hydrochloric Acid SCHEMBL8644309 0.89

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8153260-B2 Composite material ADEKA CORPORATION (JP) 2012-04-10 US disclosed
US-7851121-B2 Photosensitive polyimide composition and polyimide precursor composition CENTRAL GLASS CO., LTD. (JP) 2010-12-14 US disclosed
US-20100112323-A1 COMPOSITE MATERIAL ADEKA CORPORATION (JP) 2010-05-06 US disclosed
US-20090176172-A1 PHOTOSENSITIVE POLYIMIDE COMPOSITION AND POLYIMIDE PRECURSOR COMPOSITION CENTRAL GLASS CO., LTD. (JP) 2009-07-09 US disclosed
WO-2007092011-A1 PHOTOSENSITIVE POLYIMIDE COMPOSITION AND POLYIMIDE PRECURSOR COMPOSITION CENTRAL GLASS CO., LTD. (JP) 2007-08-16 WO disclosed
US-6316170-B2 COATING, EXPOSURE, DEVELOPMENT AND HEAT TREATMENT KABUSHIKI KAISHA TOSHIBA (JP) 2001-11-13 US disclosed
US-6303743-B1 Polyimide for optical communications, method of preparing the same, and method of forming multiple polyimide film using the polyimide SAMSUNG ELECTRONICS CO., LTD. (KR) 2001-10-16 US disclosed
US-20010006767-A1 Developing solution and method of forming polyimide pattern by using the developing solution YOSHIAKI KAWAMONZEN 2001-07-05 US disclosed
US-6183934-B1 FOE USE IN FORMATION OF PATTERN OF INSULATION FILM, PASSIVATION FILM, .ALPHA.-RAY SHIELDING FILM, OPTICAL WAVEGUIDE KABUSHIKI KAISHA TOSHIBA (JP) 2001-02-06 US disclosed
US-6159654-A Negative photosensitive polymer composition of a thermosetting polymer precursor curable by cyclodehydration upon heating KABUSHIKI KAISHA TOSHIBA (JP) 2000-12-12 US disclosed
US-5901259-A Optical waveplate, method of manufacturing the same, and waveguide device using the same NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1999-05-04 US disclosed
US-5849934-A Method for preparing aromatic compounds NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1998-12-15 US disclosed
US-5756650-A COMPOSITION COMPRISING POLYAMIC ACID, CURE ACCELERATOR SELECTED FROM GROUP CONSISTING OF NITROGEN-CONTAINING HETEROCYCLIC COMPOUND, AMINO ACID COMPOUND, AROMATIC COMPOUND HAVING TWO OR MORE HYDROXYL GROUPS KABUSHIKI KAISHA TOSHIBA (JP) 1998-05-26 US disclosed
US-5750731-A POLYIMIDE ANHYDRIDE MONOMERS NIPPON TELEGRAPH & TELEPHONE CORPORATION (JP) 1998-05-12 US disclosed
US-5694496-A WAVEGUIDE COMPRISING AN AROMATIC FLUORO-POLYIMIDE; HEAT RESISTANCE, FLEXIBILITY, WATERPROOFING, STRENGTH NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1997-12-02 US disclosed
EP-0480266-B1 Perfluorinated polyimide, perfluorinated poly(amic acid), starting compounds therefor, and methods for preparing them NIPPON TELEGRAPH & TELEPHONE (JP) 1996-06-26 EP disclosed
EP-0623830-A1 Optical waveplate, method of manufacturing the same, and waveguide device using the same NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1994-11-09 EP disclosed
US-5233018-A Heat resistance and low optical transmission loss in the near-infrared region; integrated circuits NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1993-08-03 US disclosed
EP-0480266-A2 Perfluorinated polyimide, perfluorinated poly(amic acid), starting compounds therefor, and methods for preparing them NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1992-04-15 EP disclosed
US-4271288-A TETRACARBOXYLIC ACID BONDED TO ARYLENE MOIETY VIA METHYLENE GROUPS THE DOW CHEMICAL COMPANY (US) 1981-06-02 US disclosed