SCHEMBL600277

SCHEMBL600277

Nc1c(F)c(F)c(-c2c(F)c(F)c(N)c(F)c2F)c(F)c1F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7871365 1.00
Hydrochloric Acid SCHEMBL8644309 0.96
Water SCHEMBL16566506 0.96
SCHEMBL3945315 0.96
SCHEMBL1100490 0.93
SCHEMBL7875154 0.93
Water SCHEMBL8081999 0.89
Water SCHEMBL7869935 0.89
SCHEMBL7872067 0.88
SCHEMBL1378109 0.87

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1680 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4579818-A1 BATTERY ADHESIVE, PREPARATION METHOD THEREFOR, AND LITHIUM-ION BATTERY Shenzhen Yanyi New Materials Co., Ltd. (CN) 2025-07-02 EP claimed
CN-120040699-A Covalent organic framework material and preparation method and application thereof 贵州师范学院 2025-05-27 CN claimed
CN-119401058-A Polyimide microsphere coated modified battery diaphragm and lithium ion battery 浙江中科玖源新材料有限公司 2025-02-07 CN claimed
CN-116217929-B Polyimide resin, film and preparation method thereof, flexible copper-clad plate and electronic device 杭州福斯特应用材料股份有限公司 2024-12-31 CN claimed
CN-118772555-A Scratch-resistant injection molding plate for silicon wafer flower basket and preparation process thereof 无锡市世通模塑有限公司 2024-10-15 CN claimed
CN-117304036-B Preparation method of octafluoro- [1,1 '-biphenyl ] -4,4' -diamine 奥盖尼克材料(苏州)有限公司 2024-08-06 CN claimed
CN-118387865-A One-step preparation process of fluorine functional intercalation graphene material with adjustable interlayer spacing, product and application thereof 深圳北理莫斯科大学 2024-07-26 CN claimed
CN-114702646-B Fluorenyl-biphenyl type epoxy material with high insulating property and preparation method thereof 合肥工业大学 2024-05-31 CN claimed
WO-2024087896-A1 BATTERY ADHESIVE, PREPARATION METHOD THEREFOR, AND LITHIUM-ION BATTERY 深圳市研一新材料有限责任公司 2024-05-02 WO claimed
CN-115583834-B High-performance aramid-based graphite film and preparation method thereof 浙江中科玖源新材料有限公司 2024-02-20 CN claimed
US-20040013953-A1 Photosensitive polyimide resin precursor composition, optical polyimide obtained from the composition, optical waveguide using the polyimide, and process for producing the optical waveguide NITTO DENKO CORPORATION 2004-01-22 US claimed
EP-1382644-A1 Photosensitive polyimide resin precursor composition, optical waveguide using the polyimide and process for producing the optical waveguide NITTO DENKO CORPORATION (JP) 2004-01-21 EP claimed
US-6397034-B1 CONTROLLING CONDUCTIVITY XEROX CORPORATION 2002-05-28 US claimed
US-6066400-A Polyimide biasable components XEROX CORPORATION (US) 2000-05-23 US claimed
US-6013759-A Polyamideimide for optical communications and method for preparing the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-01-11 US claimed
EP-0675915-B1 PHOTODEFINABLE OPTICAL WAVEGUIDES AMOCO CORP (US) 1998-02-25 EP claimed
US-5478914-A Polyimides and processes for preparaing the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 1995-12-26 US claimed
US-5399655-A Acid-labile poly(amic acetal ester) E. I. DU PONT DE NEMOURS AND COMPANY (US) 1995-03-21 US claimed
EP-0177122-B1 ACRYLAMIDE DERIVATIVES Nippon Paint Co., Ltd. (JP) 1992-04-01 EP claimed
US-5075378-A Coating of an epoxy resin, fluorocarbon polymer fluorinated curing agent THE STANDARD OIL COMPANY (US) 1991-12-24 US claimed