SCHEMBL600277

SCHEMBL600277

Nc1c(F)c(F)c(-c2c(F)c(F)c(N)c(F)c2F)c(F)c1F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7871365 1.00 — —
Water SCHEMBL16566506 0.96 — —
SCHEMBL3945315 0.96 — —
Hydrochloric Acid SCHEMBL8644309 0.96 — —
SCHEMBL1100490 0.93 — —
SCHEMBL7875154 0.93 — —
Water SCHEMBL7869935 0.89 — —
Water SCHEMBL8081999 0.89 — —
SCHEMBL7872067 0.88 — —
SCHEMBL1378109 0.87 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1680 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4579818-A1 BATTERY ADHESIVE, PREPARATION METHOD THEREFOR, AND LITHIUM-ION BATTERY Shenzhen Yanyi New Materials Co., Ltd. (CN) 2025-07-02 — — EP claimed
CN-120040699-A Covalent organic framework material and preparation method and application thereof 贵州师范学院 2025-05-27 — — CN claimed
CN-119401058-A Polyimide microsphere coated modified battery diaphragm and lithium ion battery 浙江中科玖源新材料有限公司 2025-02-07 — — CN claimed
CN-116217929-B Polyimide resin, film and preparation method thereof, flexible copper-clad plate and electronic device 杭州福斯特应用材料股份有限公司 2024-12-31 — — CN claimed
CN-118772555-A Scratch-resistant injection molding plate for silicon wafer flower basket and preparation process thereof 无锡市世通模塑有限公司 2024-10-15 — — CN claimed
CN-117304036-B Preparation method of octafluoro- [1,1 '-biphenyl ] -4,4' -diamine 奥盖尼克材料(苏州)有限公司 2024-08-06 — — CN claimed
CN-118387865-A One-step preparation process of fluorine functional intercalation graphene material with adjustable interlayer spacing, product and application thereof 深圳北理莫斯科大学 2024-07-26 — — CN claimed
CN-114702646-B Fluorenyl-biphenyl type epoxy material with high insulating property and preparation method thereof 合肥工业大学 2024-05-31 — — CN claimed
WO-2024087896-A1 BATTERY ADHESIVE, PREPARATION METHOD THEREFOR, AND LITHIUM-ION BATTERY 深圳市研一新材料有限责任公司 2024-05-02 — — WO claimed
CN-115583834-B High-performance aramid-based graphite film and preparation method thereof 浙江中科玖源新材料有限公司 2024-02-20 — — CN claimed
US-20040013953-A1 Photosensitive polyimide resin precursor composition, optical polyimide obtained from the composition, optical waveguide using the polyimide, and process for producing the optical waveguide NITTO DENKO CORPORATION 2004-01-22 — — US claimed
EP-1382644-A1 Photosensitive polyimide resin precursor composition, optical waveguide using the polyimide and process for producing the optical waveguide NITTO DENKO CORPORATION (JP) 2004-01-21 — — EP claimed
US-6397034-B1 CONTROLLING CONDUCTIVITY XEROX CORPORATION 2002-05-28 — — US claimed
US-6066400-A Polyimide biasable components XEROX CORPORATION (US) 2000-05-23 — — US claimed
US-6013759-A Polyamideimide for optical communications and method for preparing the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-01-11 — — US claimed
EP-0675915-B1 PHOTODEFINABLE OPTICAL WAVEGUIDES AMOCO CORP (US) 1998-02-25 — — EP claimed
US-5478914-A Polyimides and processes for preparaing the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 1995-12-26 — — US claimed
US-5399655-A Acid-labile poly(amic acetal ester) E. I. DU PONT DE NEMOURS AND COMPANY (US) 1995-03-21 — — US claimed
EP-0177122-B1 ACRYLAMIDE DERIVATIVES Nippon Paint Co., Ltd. (JP) 1992-04-01 — — EP claimed
US-5075378-A Coating of an epoxy resin, fluorocarbon polymer fluorinated curing agent THE STANDARD OIL COMPANY (US) 1991-12-24 — — US claimed
Send feedback