Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FFAR1 | O14842 | 3/20 | 0.44 |
| ▸ | FFAR4 | Q5NUL3 | 3/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.38 |
| ▸ | F7 | P08709 | 3/20 | 0.38 |
| ▸ | CYP19A1 | P11511 | 3/20 | 0.38 |
| ▸ | F3 | P13726 | 3/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.38 |
| ▸ | PTGS1 | P23219 | 2/20 | 0.38 |
| ▸ | PPARG | P37231 | 2/20 | 0.38 |
| ▸ | PPARD | Q03181 | 2/20 | 0.38 |
| ▸ | PPARA | Q07869 | 2/20 | 0.38 |
| ▸ | OXER1 | Q8TDS5 | 2/20 | 0.38 |
| ▸ | ADORA3 | P0DMS8 | 1/20 | 0.38 |
| ▸ | RXRA | P19793 | 1/20 | 0.38 |
| ▸ | NFKB1 | P19838 | 2/20 | 0.38 |
| ▸ | NFKB2 | Q00653 | 1/20 | 0.38 |
| ▸ | RELA | Q04206 | 1/20 | 0.38 |
| ▸ | FAAH | O00519 | 2/20 | 0.38 |
| ▸ | MEN1 | O00255 | 2/20 | 0.36 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL832707 | 1.00 | FFAR1 (0.44) | FFAR1FFAR4ALDH1A1F7CYP19A1 | |
| SCHEMBL11293067 | 0.94 | ALDH1A1 (0.47) | FFAR1FFAR4ALDH1A1F7CYP19A1 | |
| SCHEMBL31436976 | 0.93 | ALDH1A1 (0.42) | FFAR1FFAR4ALDH1A1F7CYP19A1 | |
| SCHEMBL832638 | 0.92 | FFAR1 (0.53) | FFAR1FFAR4ALDH1A1F7CYP19A1 | |
| SCHEMBL831059 | 0.91 | FFAR1 (0.46) | FFAR1FFAR4F7F3KMT2A | |
| SCHEMBL6135545 | 0.88 | PPARG (0.41) | FFAR1FFAR4ALDH1A1PPARGNFKB1 | |
| SCHEMBL832347 | 0.88 | PPARG (0.41) | FFAR1FFAR4ALDH1A1PPARGNFKB1 | |
| SCHEMBL15226796 | 0.88 | FFAR1 (0.57) | FFAR1FFAR4KMT2AFAAHMEN1 | |
| SCHEMBL8667764 | 0.87 | FFAR1 (0.56) | FFAR1FFAR4F7CYP19A1F3 | |
| SCHEMBL2576534 | 0.87 | FFAR1 (0.56) | FFAR1FFAR4F7CYP19A1F3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7727705-B2 | High etch resistant underlayer compositions for multilayer lithographic processes | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2010-06-01 | — | — | US | claimed |
| WO-2008140846-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-11-20 | — | — | WO | claimed |
| US-20080206667-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. | 2008-08-28 | — | — | US | claimed |
| US-8535872-B2 | Thermally cured underlayer for lithographic application | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2013-09-17 | — | — | US | disclosed |
| US-20120178871-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | DE BINOD B (US) | 2012-07-12 | — | — | US | disclosed |
| US-8153346-B2 | Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2012-04-10 | — | — | US | disclosed |
| US-7727705-B2 | High etch resistant underlayer compositions for multilayer lithographic processes | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2010-06-01 | — | — | US | disclosed |
| WO-2008140846-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-11-20 | — | — | WO | disclosed |
| US-20080206667-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. | 2008-08-28 | — | — | US | disclosed |
| US-20080206676-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC | 2008-08-28 | — | — | US | disclosed |
| WO-2008103776-A2 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-08-28 | — | — | WO | disclosed |