SCHEMBL1103751

SCHEMBL1103751

CO[Si](OC)(OC)N(Cl)[Si](OC)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL555378 0.67
SCHEMBL1103757 0.64
SCHEMBL495810 0.64
SCHEMBL20240781 0.59
SCHEMBL11015385 0.59
SCHEMBL28366335 0.59
SCHEMBL723226 0.57
SCHEMBL129384 0.56
SCHEMBL31337066 0.56
SCHEMBL130354 0.53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113314502-B Integrated circuit device and method of forming the same 台湾积体电路制造股份有限公司 2024-08-23 CN disclosed
US-8153348-B2 Process sequence for formation of patterned hard mask film (RFP) without need for photoresist or dry etch APPLIED MATERIALS, INC. (US) 2012-04-10 US disclosed
US-7943531-B2 Methods for forming a silicon oxide layer over a substrate APPLIED MATERIALS, INC. (US) 2011-05-17 US disclosed
US-20090208880-A1 PROCESS SEQUENCE FOR FORMATION OF PATTERNED HARD MASK FILM (RFP) WITHOUT NEED FOR PHOTORESIST OR DRY ETCH APPLIED MATERIALS, INC. (US) 2009-08-20 US disclosed
US-20090104791-A1 Methods for Forming a Silicon Oxide Layer Over a Substrate APPLIED MATERIALS, INC. A DELAWARE CORPORATION (US) 2009-04-23 US disclosed
US-7498273-B2 Formation of high quality dielectric films of silicon dioxide for STI: usage of different siloxane-based precursors for harp II—remote plasma enhanced deposition processes APPLIED MATERIALS, INC. (US) 2009-03-03 US disclosed
US-20070281495-A1 FORMATION OF HIGH QUALITY DIELECTRIC FILMS OF SILICON DIOXIDE FOR STI: USAGE OF DIFFERENT SILOXANE-BASED PRECURSORS FOR HARP II - REMOTE PLASMA ENHANCED DEPOSITION PROCESSES APPLIED MATERIALS, INC. (US) 2007-12-06 US disclosed