⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1103757 | 0.75 | — | — | |
| SCHEMBL1143073 | 0.75 | — | — | |
| SCHEMBL555378 | 0.70 | — | — | |
| SCHEMBL11015385 | 0.69 | — | — | |
| SCHEMBL724457 | 0.67 | — | — | |
| SCHEMBL17797138 | 0.67 | — | — | |
| SCHEMBL31742440 | 0.65 | — | — | |
| SCHEMBL1585526 | 0.64 | — | — | |
| SCHEMBL1103751 | 0.64 | — | — | |
| SCHEMBL9463582 | 0.64 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 229 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122071548-A | Impact-resistant polypropylene and preparation method thereof | 中国石油化工股份有限公司 | 2026-05-22 | — | — | CN | claimed |
| US-20250376758-A1 | SELECTIVE DEPOSITION OF METAL-CONTAINING MATERIAL | ASM IP HOLDING BV (NL) | 2025-12-11 | — | — | US | claimed |
| US-20250336667-A1 | AREA SELECTIVE DEPOSITION | ASM IP HOLDING BV (NL) | 2025-10-30 | — | — | US | claimed |
| US-20250333837-A1 | METHODS OF FILLING A RECESSED FEATURE ON A SUBSTRATE EMPLOYING METAL SEQUENTIAL INFILTRATION SYNTHESIS PROCESSES | ASM IP HOLDING BV (NL) | 2025-10-30 | — | — | US | claimed |
| US-20250320604-A1 | LOW TEMPERATURE PLASMA DEPOSITION OF SILICON-CONTAINING FILMS USING HYDROGEN PEROXIDE | GELEST INC (US) | 2025-10-16 | — | — | US | claimed |
| US-20250305131-A1 | LOW TEMPERATURE THERMAL DEPOSITION OF SILICON-CONTAINING FILMS USING LOW WATER CONTENT HYDROGEN PEROXIDE | GELEST, INC. | 2025-10-02 | — | — | US | claimed |
| US-20250197991-A1 | AREA SELECTIVE DEPOSITION | ASM IP HOLDING B.V. (NL) | 2025-06-19 | — | — | US | claimed |
| CN-109439269-B | High-thermal-conductivity ultraviolet curing adhesive for potting optical fiber coil and preparation method thereof | 中国船舶重工集团公司第七0七研究所 | 2020-04-24 | — | — | CN | claimed |
| US-10487169-B2 | Manufacturing method for propylene block copolymer | TOHO TITANIUM CO., LTD. (JP) | 2019-11-26 | — | — | US | claimed |
| US-10479856-B2 | Manufacturing method for propylene block copolymer | TOHO TITANIUM CO., LTD. (JP) | 2019-11-19 | — | — | US | claimed |
| CN-106008303-A | Preparation method of 1-Boc-3-hydroxyl azetidine medical intermediate | 苏州艾缇克药物化学有限公司 | 2016-10-12 | — | — | CN | claimed |
| CN-105419701-A | Environment-friendly phenolic resin adhesive and preparation method thereof | SUZHOU GAIDE FINE MAT CO LTD | 2016-03-23 | — | — | CN | claimed |
| CN-105315954-A | Novel UV photo-curing adhesive and preparation method thereof | GUIDE SUZHOU FINE CHEMICAL CO LTD | 2016-02-10 | — | — | CN | claimed |
| CN-1222063-C | Lithium ion cell, electrode of lithium ion cell and its preparation method | PULEAD TECHNOLOGY INDUSTRY CO (CN) | 2005-10-05 | — | — | CN | claimed |
| US-6743737-B2 | FORMING INTEGRATED CIRCUITS; PLASMA VAPOR DEPOSITION | APPLIED MATERIALS, INC. | 2004-06-01 | — | — | US | claimed |
| CN-1485940-A | Lithium ion cell, electrode of lithium ion cell and its preparation method | 北大先行科技产业有限公司 | 2004-03-31 | — | — | CN | claimed |
| US-20030054667-A1 | Method of improving moisture resistance of low dielectric constant films | APPLIED MATERIALS, INC. | 2003-03-20 | — | — | US | claimed |
| US-6448187-B2 | DEPOSITING A SILICON OXIDE FILM BY OXIDATION OF SILICON COMPOUND, EXPOSING TO WATER OR A HYDROPHOBIC-IMPARTING SURFACTANT SUCH AS HEXAMETHYLDISILAZANE AND CURING | APPLIED MATERIALS, INC. | 2002-09-10 | — | — | US | claimed |
| US-20010026849-A1 | Method of improving moisture resistance of low dielectric constant films | APPLIED MATERIALS, INC. | 2001-10-04 | — | — | US | claimed |
| US-6245690-B1 | EXPOSING PLASMA ENHANCED CHEMICAL VAPOR DEPOSITED FILM OF OXIDIZED ORGANOSILICON COMPOUND TO A HYDROPHOBIC-IMPARTING SURFACTANT SUCH AS HEXAMETHYLDISILAZANE PRIOR TO THERMALLY CURING TO CONTROL CARBON CONTENT IN DEPOSITED FILM | APPLIED MATERIALS, INC. | 2001-06-12 | — | — | US | claimed |