⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11052149 | 0.92 | — | — | |
| SCHEMBL16132689 | 0.88 | FUCA1 (0.35) | — | |
| SCHEMBL11839200 | 0.85 | FUCA1 (0.33) | — | |
| SCHEMBL11264286 | 0.77 | — | — | |
| SCHEMBL14872062 | 0.75 | FUCA1 (0.56) | — | |
| SCHEMBL10050297 | 0.73 | — | — | |
| SCHEMBL14094624 | 0.73 | — | — | |
| SCHEMBL13576467 | 0.73 | — | — | |
| SCHEMBL15107903 | 0.73 | — | — | |
| SCHEMBL12855703 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-4467100-A | Epoxy resin compositions cured with imide-amine at ambient temperatures to afford products having useful properties at high temperatures | LORD CORPORATION (US) | 1984-08-21 | — | — | US | disclosed |
| US-4366302-A | HEAT RESISTANCE CURING AGENTS | LORD CORPORATION (US) | 1982-12-28 | — | — | US | disclosed |
| US-4340715-A | Epoxy resin compositions cured with imide-amines | LORD CORPORATION (US) | 1982-07-20 | — | — | US | disclosed |