SCHEMBL11052149

SCHEMBL11052149

CC1C(N)CC(N)C1C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16132689 0.96 FUCA1 (0.35) —
SCHEMBL11047753 0.92 — —
SCHEMBL11839200 0.77 FUCA1 (0.33) —
SCHEMBL11264286 0.77 — —
SCHEMBL18843781 0.77 — —
SCHEMBL22879198 0.77 — —
Ammonia Solution, Strong SCHEMBL27921386 0.77 FUCA1 (0.40) —
SCHEMBL16800325 0.77 — —
SCHEMBL18843794 0.77 — —
SCHEMBL11050196 0.77 FUCA1 (0.40) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2019011826-A1 RING CLOSURE REACTION MERCK PATENT GMBH (DE) 2019-01-17 — — WO disclosed
US-4467100-A Epoxy resin compositions cured with imide-amine at ambient temperatures to afford products having useful properties at high temperatures LORD CORPORATION (US) 1984-08-21 — — US disclosed
US-4366302-A HEAT RESISTANCE CURING AGENTS LORD CORPORATION (US) 1982-12-28 — — US disclosed
US-4340715-A Epoxy resin compositions cured with imide-amines LORD CORPORATION (US) 1982-07-20 — — US disclosed
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