SCHEMBL11050196

SCHEMBL11050196

CC1CC(N)C(C)C(C)C1N

nearest known ligand 0.40

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
▸ FUCA1 P04066 3/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24168463 0.91 — —
SCHEMBL26607925 0.79 FUCA1 (0.31) FUCA1
SCHEMBL24761752 0.79 FUCA1 (0.31) FUCA1
SCHEMBL21098996 0.78 FUCA1 (0.37) FUCA1
SCHEMBL11264286 0.78 — —
SCHEMBL11364468 0.78 — —
SCHEMBL11364472 0.78 — —
SCHEMBL21030075 0.78 — —
SCHEMBL11052149 0.77 — —
Ammonia Solution, Strong SCHEMBL27921386 0.77 FUCA1 (0.40) FUCA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4467100-A Epoxy resin compositions cured with imide-amine at ambient temperatures to afford products having useful properties at high temperatures LORD CORPORATION (US) 1984-08-21 — — US disclosed
US-4366302-A HEAT RESISTANCE CURING AGENTS LORD CORPORATION (US) 1982-12-28 — — US disclosed
US-4340715-A Epoxy resin compositions cured with imide-amines LORD CORPORATION (US) 1982-07-20 — — US disclosed
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