SCHEMBL1107768

SCHEMBL1107768

CC(C)[Si](C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Fluoride SCHEMBL15321052 0.94
SCHEMBL13017484 0.71
SCHEMBL301273 0.71
SCHEMBL1107772 0.71
SCHEMBL5163712 0.71
SCHEMBL4731857 0.71
SCHEMBL23706776 0.67
SCHEMBL524075 0.67
SCHEMBL1494512 0.67
SCHEMBL23364928 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 841 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119638887-A Expandable microsphere with temperature resistance and preparation method thereof 快思瑞科技(上海)有限公司 2025-03-18 CN claimed
CN-119638907-A Expandable microsphere with improved water resistance and preparation method thereof 快思瑞科技(上海)有限公司 2025-03-18 CN claimed
CN-118179391-A Expandable microsphere and preparation method thereof 快思瑞科技(上海)有限公司 2024-06-14 CN claimed
CN-116585994-A High-temperature-resistant thermal expansion microsphere as well as preparation method and application thereof 高化学株式会社 2023-08-15 CN claimed
CN-116199933-A Expandable microsphere with excellent temperature resistance and preparation method thereof 快思瑞科技(上海)有限公司 2023-06-02 CN claimed
CN-115558228-A Boron-free ultra-light clay and preparation method thereof 快思瑞科技(上海)有限公司 2023-01-03 CN claimed
CN-108384112-A A kind of micro-porous permeable plastic foil and preparation method for urea fertilizer packaging 成都新柯力化工科技有限公司 2018-08-10 CN claimed
US-8952090-B2 Method for producing polydienes and polydiene copolymers with reduced cold flow BRIDGESTONE CORPORATION (JP) 2015-02-10 US claimed
CN-103739968-A Oil-expansion flame retardant, super-soft halogen-free flame-retarded ethylene propylene terpolymer cable material and preparation method thereof ORIGIANL DOW ADVANCED COMPOUNDS SHANGHAI CO LTD 2014-04-23 CN claimed
US-6436824-B1 Low dielectric constant materials for copper damascene CHARTERED SEMICONDUCTOR MANUFACTURING LTD. (SG) 2002-08-20 US claimed
EP-0376870-A1 A new organosilylpolyphosphoric reagent, its preparation and application to the process of synthesis of 3-carboxyquinolones or azaquinolones and their salts CENTRO MARGA PARA LA INVESTIGACION S.A. (ES) 1990-07-04 EP claimed
WO-2026101045-A1 ENVIRONMENTALLY FRIENDLY POLISHING PAD AND MANUFACTURING METHOD THEREOF 엔펄스 주식회사 2026-05-15 WO disclosed
US-12622232-B2 Advanced self aligned multiple patterning using tin oxide LAM RESEARCH CORPORATION (US) 2026-05-05 US disclosed
EP-4098400-B1 POLISHING PAD AND METHOD FOR PREPARING A SEMICONDUCTOR DEVICE USING THE SAME ENPULSE CO LTD (KR) 2026-04-22 EP disclosed
US-20260098763-A1 ACTIVATABLE THERMAL INDICATORS WITH THERMALLY EXPANSIVE MATERIALS TEMPTIME CORPORATION (US) 2026-04-09 US disclosed
US-4753831-A FILM CONTAINING FILLED HOLLOW RESIN PARTICLES AND BINDER OTSUKA FOODS CO., LTD. (JP) 1988-06-28 US disclosed
US-4075134-A EMULSION POLYMERIZATION METHOD FOR PREPARING MICROSPHERES HAVING LIQUID CENTER AND SEAMLESS RIGID WALLS THE DOW CHEMICAL COMPANY (US) 1978-02-21 US disclosed
US-4049604-A Emulsion polymerization method for preparing aqueous dispersions of organic polymer particles THE DOW CHEMICAL COMPANY (US) 1977-09-20 US disclosed
US-3960792-A POLYSTYRENE THE DOW CHEMICAL COMPANY (US) 1976-06-01 US disclosed
US-3945956-A Polymerization of styrene acrylonitrile expandable microspheres THE DOW CHEMICAL COMPANY (US) 1976-03-23 US disclosed