SCHEMBL1108324

SCHEMBL1108324

Cc1cc(-c2cc(C)c(OCC3CO3)c(C)c2)cc(C)c1OCC1CC1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.44
GLA P06280 1/20 0.44
TSHR P16473 4/20 0.42
TP53 P04637 3/20 0.42
HIF1A Q16665 2/20 0.42
SMN1; SMN2 Q16637 2/20 0.42
CYP3A4 P08684 1/20 0.42
TDP1 Q9NUW8 2/20 0.40
MAPT P10636 2/20 0.38
HPGD P15428 2/20 0.38
MEN1 O00255 2/20 0.38
KMT2A Q03164 2/20 0.38
PPARG P37231 2/20 0.38
CYP1A2 P05177 1/20 0.38
PKM P14618 2/20 0.35
LMNA P02545 1/20 0.35
GAA P10253 1/20 0.35
BRD4 O60885 2/20 0.33
XDH P47989 1/20 0.33
PPARD Q03181 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL49658 0.91 ALDH1A1 (0.50) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL13117147 0.91 ALDH1A1 (0.50) ALDH1A1GLATSHRTP53HIF1A
Water SCHEMBL7640555 0.90 ALDH1A1 (0.49) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL24842054 0.86 ALDH1A1 (0.46) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL13931284 0.85 ALDH1A1 (0.45) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL1235711 0.83 CA1 (0.47) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL12464752 0.82 ALDH1A1 (0.42) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL20851113 0.82 ALDH1A1 (0.42) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL18615413 0.81 ALDH1A1 (0.40) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL21909217 0.81 ALDH1A1 (0.41) ALDH1A1GLATSHRTP53HIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11820875-B2 Polymer compositions and their uses Thintronics, Inc. (US) 2023-11-21 US disclosed
US-20230203238-A1 COPOLYMER, RESIN, AND COMPOSITE MATERIAL INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2023-06-29 US disclosed
US-9376560-B2 Matrix material HONDA MOTOR CO., LTD. (JP) 2016-06-28 US disclosed
US-9200184-B2 Chain extended epoxy to improve adhesion of conductive die attach film Henkel IP & Holding GmbH (DE) 2015-12-01 US disclosed
US-20150148450-A1 HALOGEN-FREE LOW-EXPANSION RESIN COMPOSITION ITEQ CORPORATION (TW) 2015-05-28 US disclosed
US-20150005458-A1 MATRIX MATERIAL HONDA MOTOR CO., LTD. (JP) 2015-01-01 US disclosed
US-20130306916-A1 Chain Extended Epoxy to Improve Adhesion of Conductive Die Attach Film HENKEL CORPORATION (US) 2013-11-21 US disclosed
US-8153260-B2 Composite material ADEKA CORPORATION (JP) 2012-04-10 US disclosed