⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29031899 | 0.65 | — | — | |
| SCHEMBL1463006 | 0.58 | — | — | |
| SCHEMBL20342033 | 0.54 | — | — | |
| SCHEMBL1463009 | 0.54 | — | — | |
| SCHEMBL37265 | 0.54 | — | — | |
| SCHEMBL30917979 | 0.52 | — | — | |
| Lithium SCHEMBL30876778 | 0.52 | — | — | |
| SCHEMBL2179627 | 0.52 | — | — | |
| SCHEMBL9443616 | 0.52 | — | — | |
| SCHEMBL343526 | 0.50 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115394641-A | Nitrogen-containing compounds for etching semiconductor structures | 乔治洛德方法研究和开发液化空气有限公司 | 2022-11-25 | — | — | CN | claimed |
| CN-107924842-B | Nitrogen-containing compounds for etching semiconductor structures | 乔治洛德方法研究和开发液化空气有限公司 | 2022-09-06 | — | — | CN | claimed |
| US-20190326126-A1 | METHODS FOR MINIMIZING SIDEWALL DAMAGE DURING LOW K ETCH PROCESSES | AIR LIQUIDE ELECTRONICS U.S. LP | 2019-10-24 | — | — | US | claimed |
| US-10347498-B2 | Methods of minimizing plasma-induced sidewall damage during low K etch processes | L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE (FR) | 2019-07-09 | — | — | US | claimed |
| US-10256109-B2 | Nitrogen-containing compounds for etching semiconductor structures | AMERICAN AIR LIQUIDE, INC. (US) | 2019-04-09 | — | — | US | claimed |
| US-20180211845-A1 | METHODS OF MINIMIZING PLASMA-INDUCED SIDEWALL DAMAGE DURING LOW K ETCH PROCESSES | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude (FR) | 2018-07-26 | — | — | US | claimed |
| EP-3345211-A1 | NITROGEN-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES | L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude (FR) | 2018-07-11 | — | — | EP | claimed |
| US-20170229316-A1 | NITROGEN-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES | AIR LIQUIDE AMERICAN (US) | 2017-08-10 | — | — | US | claimed |
| US-9659788-B2 | Nitrogen-containing compounds for etching semiconductor structures | AMERICAN AIR LIQUIDE, INC. (US) | 2017-05-23 | — | — | US | claimed |
| US-20170110336-A1 | METHODS FOR MINIMIZING SIDEWALL DAMAGE DURING LOW K ETCH PROCESSES | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude (FR) | 2017-04-20 | — | — | US | claimed |
| WO-2017040518-A1 | NITROGEN-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES | L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE (FR) | 2017-03-09 | — | — | WO | claimed |
| US-20150371869-A1 | NITROGEN-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES | AMERICAN AIR LIQUIDE, INC. | 2015-12-24 | — | — | US | claimed |
| EP-3345211-B1 | NITROGEN-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES | AIR LIQUIDE (FR) | 2025-12-10 | — | — | EP | disclosed |
| US-20250239461-A1 | ETCHING GAS MIXTURE AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2025-07-24 | — | — | US | disclosed |
| US-12327731-B2 | Etching gas mixture and method of manufacturing integrated circuit device using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2025-06-10 | — | — | US | disclosed |
| US-20230274943-A1 | ETCHING GAS MIXTURE AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2023-08-31 | — | — | US | disclosed |
| US-4427693-A | ANTIARTHRITIC AGENTS; ANALGESICS | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1984-01-24 | — | — | US | disclosed |
| EP-0055471-A1 | Antiinflammatory 4,5-diaryl-alpha,alpha-bis(polyhalomethyl)-2-thiophenemethanamines | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1982-07-07 | — | — | EP | disclosed |
| US-4335136-A | Anti-inflammatory 4,5-diaryl-α-(polyfluoroalkyl)-1H-pyrrole-2-methanamines | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1982-06-15 | — | — | US | disclosed |
| EP-0038536-A1 | Antiinflammatory 4,5-diaryl-alpha-(polyfluoroalkyl)-1H-pyrrole-2-methanamines | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1981-10-28 | — | — | EP | disclosed |