Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.38 |
| ▸ | LMNA | P02545 | 1/20 | 0.38 |
| ▸ | POLB | P06746 | 1/20 | 0.38 |
| ▸ | GRM4 | Q14833 | 4/20 | 0.32 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.32 |
| ▸ | MEN1 | O00255 | 1/20 | 0.32 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.32 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
| ▸ | GRM8 | O00222 | 1/20 | 0.32 |
| ▸ | GRM6 | O15303 | 1/20 | 0.32 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.32 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.32 |
| ▸ | GABRR1 | P24046 | 1/20 | 0.32 |
| ▸ | APLNR | P35414 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7893064 | 0.89 | ALDH1A1 (0.33) | ALDH1A1LMNAPOLB | |
| SCHEMBL27709934 | 0.82 | ALDH1A1 (0.38) | ALDH1A1LMNAPOLBGRM4CYP2C19 | |
| SCHEMBL7893065 | 0.79 | POLB (0.31) | POLB | |
| SCHEMBL126022 | 0.73 | ALDH1A1 (0.38) | ALDH1A1LMNAPOLBGRM4CYP2C19 | |
| SCHEMBL9004827 | 0.67 | TAAR1 (0.49) | ALDH1A1LMNAPOLBKMT2ATDP1 | |
| SCHEMBL7489573 | 0.67 | TAAR1 (0.49) | ALDH1A1LMNAPOLBKMT2ATDP1 | |
| SCHEMBL9004833 | 0.67 | TAAR1 (0.49) | ALDH1A1LMNAPOLBKMT2ATDP1 | |
| SCHEMBL5477340 | 0.67 | GABRR1 (0.35) | ALDH1A1LMNAPOLBGRM4CYP2C19 | |
| SCHEMBL10422988 | 0.67 | GABRR1 (0.35) | ALDH1A1LMNAPOLBGRM4CYP2C19 | |
| SCHEMBL9470884 | 0.67 | GABRR1 (0.35) | ALDH1A1LMNAPOLBGRM4CYP2C19 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 86 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20210179800-A1 | DISPENSABLE POLYIMIDE AEROGEL PREPOLYMER, METHOD OF MAKING THE SAME, METHOD OF USING THE SAME, AND SUBSTRATE COMPRISING PATTERNED POLYIMIDE AEROGEL | RAYTHEON COMPANY | 2021-06-17 | — | — | US | claimed |
| WO-2024071066-A1 | METAL-CLAD LAMINATED PLATE | 日鉄ケミカル＆マテリアル株式会社 | 2024-04-04 | — | — | WO | disclosed |
| CN-109679094-B | Polyimide precursor, polyimide, laminate, and flexible device | 日铁化学材料株式会社 | 2023-10-24 | — | — | CN | disclosed |
| CN-113874420-B | Resin film and metal-clad laminate | 日铁化学材料株式会社 | 2023-09-26 | — | — | CN | disclosed |
| US-11753517-B2 | Dispensable polyimide aerogel prepolymer, method of making the same, method of using the same, and substrate comprising patterned polyimide aerogel | RAYTHEON COMPANY (US) | 2023-09-12 | — | — | US | disclosed |
| CN-116367413-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2023-06-30 | — | — | CN | disclosed |
| CN-116353168-A | Resin laminate, circuit board, electronic component, and electronic device | 日铁化学材料株式会社 | 2023-06-30 | — | — | CN | disclosed |
| WO-2023106369-A1 | POLYIMIDE FOR SPACECRAFT, POLYIMIDE FILM FOR SPACECRAFT, AND SPACECRAFT MEMBER INCLUDING SAME | 日鉄ケミカル＆マテリアル株式会社 | 2023-06-15 | — | — | WO | disclosed |
| CN-114945645-A | Adhesive tape | 株式会社有泽制作所 | 2022-08-26 | — | — | CN | disclosed |
| CN-114806395-A | Polyimide precursor varnish and method for producing same, polyimide and method for producing same, flexible device, and laminate for wiring board | 日铁化学材料株式会社 | 2022-07-29 | — | — | CN | disclosed |
| EP-0571899-B1 | Radiation-curable mixture and its' use for producing high temperature-resistant relief structures | BASF LACKE & FARBEN (DE) | 1994-11-02 | — | — | EP | disclosed |
| EP-0573866-B1 | Method for forming patterned layers of heat-resistant polycondensates | BASF LACKE & FARBEN (DE) | 1994-11-02 | — | — | EP | disclosed |
| US-5350663-A | Construction of electrical circuits and protective or insulating layers for electronic components | BASF LACKE+ FARBEN AKTIENGESELLSCHAFT (DE) | 1994-09-27 | — | — | US | disclosed |
| EP-0573866-A1 | Method for forming patterned layers of heat-resistant polycondensates | BASF Lacke + Farben Aktiengesellschaft (DE) | 1993-12-15 | — | — | EP | disclosed |
| EP-0571899-A1 | Radiation-curable mixture and its' use for producing high temperature-resistant relief structures | BASF Lacke + Farben Aktiengesellschaft (DE) | 1993-12-01 | — | — | EP | disclosed |
| US-5238784-A | PHOTOSENSITIVE RESIN COMPOSITION WITH POLYAMIC ACID POLYMER | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1993-08-24 | — | — | US | disclosed |
| US-5206337-A | Heat resistance, moldability, workability | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1993-04-27 | — | — | US | disclosed |
| EP-0456512-A2 | Polyimidesiloxane oligomer | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1991-11-13 | — | — | EP | disclosed |
| EP-0430220-A2 | Photosensitive resin composition and semiconductor apparatus using it | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1991-06-05 | — | — | EP | disclosed |
| EP-0430221-A2 | Photosensitive resin composition | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1991-06-05 | — | — | EP | disclosed |