Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.40 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.40 |
| ▸ | TSHR | P16473 | 2/20 | 0.40 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.40 |
| ▸ | LMNA | P02545 | 1/20 | 0.37 |
| ▸ | RAB9A | P51151 | 1/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.37 |
| ▸ | ACE2 | Q9BYF1 | 1/20 | 0.36 |
| ▸ | HRH3 | Q9Y5N1 | 1/20 | 0.36 |
| ▸ | PTPN11 | Q06124 | 2/20 | 0.36 |
| ▸ | CDC25A | P30304 | 1/20 | 0.36 |
| ▸ | CDC25B | P30305 | 1/20 | 0.36 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.36 |
| ▸ | MYC | P01106 | 1/20 | 0.35 |
| ▸ | POLB | P06746 | 1/20 | 0.35 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.35 |
| ▸ | MAPT | P10636 | 1/20 | 0.35 |
| ▸ | RXRA | P19793 | 1/20 | 0.34 |
| ▸ | RXRB | P28702 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1121795 | 0.90 | MAPK1 (0.44) | KDM4EALDH1A1MAPK1TSHRHIF1A | |
| SCHEMBL5936377 | 0.84 | KDM4E (0.49) | KDM4EALDH1A1TSHRLMNARAB9A | |
| SCHEMBL29362222 | 0.84 | KDM4E (0.49) | KDM4EALDH1A1TSHRLMNARAB9A | |
| SCHEMBL1104259 | 0.83 | KDM4E (0.43) | KDM4EALDH1A1MAPK1TSHRHIF1A | |
| SCHEMBL11372672 | 0.83 | KDM4E (0.43) | KDM4EALDH1A1MAPK1TSHRHIF1A | |
| SCHEMBL16248492 | 0.83 | ALDH1A1 (0.51) | ALDH1A1MAPK1TSHRHIF1ALMNA | |
| SCHEMBL11517150 | 0.83 | MAPK1 (0.54) | ALDH1A1MAPK1TSHRHIF1ALMNA | |
| SCHEMBL21561621 | 0.81 | MAPT (0.44) | KDM4EALDH1A1MAPK1TSHRHIF1A | |
| Ethylene Glycol SCHEMBL5687572 | 0.81 | KDM4E (0.43) | KDM4EALDH1A1MAPK1TSHRHIF1A | |
| SCHEMBL11853878 | 0.81 | MAPK1 (0.53) | ALDH1A1MAPK1HIF1ALMNARAB9A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 107 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10035910-B2 | Polymer composition and heat-shrinkable article | TYCO ELECTRONICS UK LTD (GB) | 2018-07-31 | — | — | US | claimed |
| EP-3149076-B1 | POLYMER COMPOSITION AND HEAT-SHRINKABLE ARTICLE | TYCO ELECTRONICS LTD UK (GB) | 2018-03-14 | — | — | EP | claimed |
| EP-3149076-A1 | POLYMER COMPOSITION AND HEAT-SHRINKABLE ARTICLE | Tyco Electronics UK Ltd. (GB) | 2017-04-05 | — | — | EP | claimed |
| US-20170073514-A1 | Polymer Composition and Heat-Shrinkable Article | TYCO ELECTRONICS UK LTD (GB) | 2017-03-16 | — | — | US | claimed |
| WO-2015180899-A1 | POLYMER COMPOSITION AND HEAT-SHRINKABLE ARTICLE | TYCO ELECTRONICS UK LTD (GB) | 2015-12-03 | — | — | WO | claimed |
| US-7786205-B2 | Foamable adhesive composition | TYCO ELECTRONICS CORPORATION (US) | 2010-08-31 | — | — | US | claimed |
| US-20070185278-A1 | Foamable coupling for lamp assembly and methods for using the coupling | TYCO ELECTRONICS CORPORATION (US) | 2007-08-09 | — | — | US | claimed |
| EP-1656419-A1 | COMPOSITIONS FOR HEAT-RECOVERABLE FOAM TUBING | Tyco Electronics Corporation (US) | 2006-05-17 | — | — | EP | claimed |
| WO-2005017027-A1 | COMPOSITIONS FOR HEAT-RECOVERABLE FOAM TUBING | TYCO ELECTRONICS CORPORATION (US) | 2005-02-24 | — | — | WO | claimed |
| US-20050031811-A1 | Heat shrinkage mixture of polymer and blowing agent; heat activation encapsulated in shell | TE CONNECTIVITY SOLUTIONS GMBH (CH) | 2005-02-10 | — | — | US | claimed |
| US-12215246-B2 | Composition comprising a light-weight filler | HENKEL AG & CO. KGAA (DE) | 2025-02-04 | — | — | US | disclosed |
| US-20240132687-A1 | Thermally expandable compositions comprising wax | HENKEL AG & CO KGAA (DE) | 2024-04-25 | — | — | US | disclosed |
| CN-113692421-B | Pumpable, thermally curable and expandable formulation | 汉高股份有限及两合公司 | 2024-03-08 | — | — | CN | disclosed |
| CN-117616074-A | Thermally expandable composition comprising wax | 汉高股份有限及两合公司 | 2024-02-27 | — | — | CN | disclosed |
| US-11834565-B2 | Shape memory products and method for making them | TYCO ELECTRONICS UK LTD. (GB) | 2023-12-05 | — | — | US | disclosed |
| WO-1999037506-A1 | CAVITY SEALING ARTICLE AND METHOD | TYCO ELECTRONICS CORPORATION (US) | 1999-07-29 | — | — | WO | disclosed |
| WO-1999006479-A1 | HIGH VOLTAGE ELECTRICAL INSULATION MATERIAL | RAYCHEM LIMITED (GB) | 1999-02-11 | — | — | WO | disclosed |
| WO-1998036944-A1 | CAVITY SEALING ARTICLE AND METHOD | RAYCHEM CORPORATION (US) | 1998-08-27 | — | — | WO | disclosed |
| EP-0627463-A2 | Flame retardant resin composition | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 1994-12-07 | — | — | EP | disclosed |
| US-4160753-A | FROM POLYAMINES AND POLYISOCYANATES | BAYER AKTIENGESELLSCHAFT (DE) | 1979-07-10 | — | — | US | disclosed |