⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3790626 | 0.65 | — | — | |
| SCHEMBL1858208 | 0.65 | — | — | |
| SCHEMBL9865874 | 0.65 | — | — | |
| SCHEMBL16921956 | 0.60 | — | — | |
| SCHEMBL12310556 | 0.59 | — | — | |
| SCHEMBL278437 | 0.56 | — | — | |
| SCHEMBL7997873 | 0.55 | — | — | |
| SCHEMBL2904246 | 0.53 | — | — | |
| Ammonia Solution, Strong SCHEMBL8743497 | 0.48 | — | — | |
| SCHEMBL7543910 | 0.48 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10224259-B2 | Resin composition for sealing semiconductor and semiconductor device | SUMITOMO BAKELITE CO., LTD. (JP) | 2019-03-05 | — | — | US | claimed |
| US-20250197628-A1 | RESIN COMPOSITION FOR ENCAPSULATION AND METHOD FOR PRODUCING SINGLE-SIDED ENCAPSULATION STRUCTURE | SUMITOMO BAKELITE CO., LTD. (JP) | 2025-06-19 | — | — | US | disclosed |
| EP-4503118-A1 | RESIN COMPOSITION FOR ENCAPSULATION AND METHOD FOR PRODUCING SINGLE-SIDED-ENCAPSULATION STRUCTURE | Sumitomo Bakelite Co., Ltd. (JP) | 2025-02-05 | — | — | EP | disclosed |
| CN-118946963-A | Sealing resin composition and method for producing single-sided sealing structure | 住友电木株式会社 | 2024-11-12 | — | — | CN | disclosed |
| CN-118872047-A | Resin composition for molding, method for producing sealing structure, and sealing structure | 住友电木株式会社 | 2024-10-29 | — | — | CN | disclosed |
| WO-2023189996-A1 | RESIN COMPOSITION FOR MOLDING, MANUFACTURING METHOD FOR SEALING STRUCTURE, AND SEALING STRUCTURE | 住友ベークライト株式会社 | 2023-10-05 | — | — | WO | disclosed |
| WO-2023182485-A1 | RESIN COMPOSITION FOR ENCAPSULATION AND METHOD FOR PRODUCING SINGLE-SIDED-ENCAPSULATION STRUCTURE | 住友ベークライト株式会社 | 2023-09-28 | — | — | WO | disclosed |
| CN-113735842-B | 1,2, 4-triazole Schiff base thioether derivatives, and preparation method and application thereof | 河北农业大学 | 2023-01-31 | — | — | CN | disclosed |
| CN-113735842-A | 1,2, 4-triazole Schiff base thioether derivatives, and preparation method and application thereof | 河北农业大学 | 2021-12-03 | — | — | CN | disclosed |
| US-10224259-B2 | Resin composition for sealing semiconductor and semiconductor device | SUMITOMO BAKELITE CO., LTD. (JP) | 2019-03-05 | — | — | US | disclosed |
| EP-3012295-B1 | RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO (JP) | 2017-11-22 | — | — | EP | disclosed |
| US-20160372394-A1 | RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2016-12-22 | — | — | US | disclosed |
| EP-3012295-A1 | RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Co.,Ltd. (JP) | 2016-04-27 | — | — | EP | disclosed |
| US-4357396-A | MIRRORS | PPG INDUSTRIES, INC. (US) | 1982-11-02 | — | — | US | disclosed |