⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL416907 | 0.69 | — | — | |
| SCHEMBL15858201 | 0.65 | — | — | |
| SCHEMBL5281202 | 0.65 | — | — | |
| SCHEMBL2904246 | 0.65 | — | — | |
| SCHEMBL9479118 | 0.61 | — | — | |
| SCHEMBL5610414 | 0.60 | — | — | |
| SCHEMBL600381 | 0.59 | — | — | |
| Hydrochloric Acid SCHEMBL15550505 | 0.57 | — | — | |
| Hydrochloric Acid SCHEMBL8131541 | 0.57 | KMT2A (0.43) | — | |
| SCHEMBL5334854 | 0.53 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023069409-A1 | SELECTIVE WET ETCH COMPOSITION AND METHOD | ENTEGRIS, INC. (US) | 2023-04-27 | — | — | WO | claimed |
| EP-1949424-A2 | COMPOSITION AND METHOD FOR SELECTIVELY ETCHING GATE SPACER OXIDE MATERIAL | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2008-07-30 | — | — | EP | claimed |
| WO-2007120259-A2 | FORMULATIONS FOR REMOVING COPPER-CONTAINING POST-ETCH RESIDUE FROM MICROELECTRONIC DEVICES | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2007-10-25 | — | — | WO | claimed |
| WO-2007044447-A2 | COMPOSITION AND METHOD FOR SELECTIVELY ETCHING GATE SPACER OXIDE MATERIAL | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2007-04-19 | — | — | WO | claimed |
| EP-4136273-A1 | METHOD AND COMPOSITION FOR ETCHING MOLYBDENUM | Entegris, Inc. (US) | 2023-02-22 | — | — | EP | disclosed |
| US-20210323960-A1 | FUSED TRI-CYCLIC COMPOUND AS PDE3/PDE4 DUAL INHIBITOR | CHIA TAI TIANQING PHARMACEUTICAL GROUP CO., LTD. (CN) | 2021-10-21 | — | — | US | disclosed |
| WO-2021211708-A1 | METHOD AND COMPOSITION FOR ETCHING MOLYBDENUM | ENTEGRIS, INC. (US) | 2021-10-21 | — | — | WO | disclosed |
| EP-3822272-A1 | FUSED TRI-CYCLIC COMPOUND AS PDE3/PDE4 DUAL INHIBITOR | Chia Tai Tianqing Pharmaceutical Group Co., Ltd. (CN) | 2021-05-19 | — | — | EP | disclosed |
| WO-2020011254-A1 | FUSED TRI-CYCLIC COMPOUND AS PDE3/PDE4 DUAL INHIBITOR | 正大天晴药业集团股份有限公司 | 2020-01-16 | — | — | WO | disclosed |
| CN-110204559-A | A kind of carbazolyl-containing Triterpenic acid derivative and preparation method thereof | 陕西科技大学 | 2019-09-06 | — | — | CN | disclosed |
| CN-110177903-A | Post etch residue removal for high-order node process backend processing | 恩特格里斯公司 | 2019-08-27 | — | — | CN | disclosed |
| CN-107108565-A | The N pyridine yl acetamide derivatives of the inhibitor of approach are transmitted as WNT signals | 莱德克斯制药公共有限公司 | 2017-08-29 | — | — | CN | disclosed |
| WO-2010091045-A2 | NON-FLUORIDE CONTAINING COMPOSITION FOR THE REMOVAL OF POLYMERS AND OTHER ORGANIC MATERIAL FROM A SURFACE | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2010-08-12 | — | — | WO | disclosed |
| CN-101528765-A | Macrocyclic antagonists of the motilin receptor for treatment of gastrointestinal dysmotility disorders | TRANZYME PHARMA INC (US) | 2009-09-09 | — | — | CN | disclosed |
| EP-2082024-A1 | COMPOSITIONS AND METHODS FOR THE REMOVAL OF PHOTORESIST FOR A WAFER REWORK APPLICATION | Advanced Technology Materials, Inc. (US) | 2009-07-29 | — | — | EP | disclosed |
| EP-1929512-A2 | HIGH THROUGHPUT CHEMICAL MECHANICAL POLISHING COMPOSITION FOR METAL FILM PLANARIZATION | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2008-06-11 | — | — | EP | disclosed |
| WO-2008039730-A1 | COMPOSITIONS AND METHODS FOR THE REMOVAL OF PHOTORESIST FOR A WAFER REWORK APPLICATION | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2008-04-03 | — | — | WO | disclosed |
| WO-2007019342-A2 | HIGH THROUGHPUT CHEMICAL MECHANICAL POLISHING COMPOSITION FOR METAL FILM PLANARIZATION | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2007-02-15 | — | — | WO | disclosed |
| EP-1583997-A2 | PHOTORESIST REMOVAL | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2005-10-12 | — | — | EP | disclosed |
| WO-2004059700-A2 | PHOTORESIST REMOVAL | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2004-07-15 | — | — | WO | disclosed |