SCHEMBL11237876

SCHEMBL11237876

CCC1=C(CC)C(=O)C=CC1=O

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
XIAP P98170 1/20 0.41
MGLL Q99685 4/20 0.35
GMNN O75496 1/20 0.35
ALDH1A1 P00352 1/20 0.35
LMNA P02545 1/20 0.35
MAPT P10636 1/20 0.35
THPO P40225 1/20 0.35
BLM P54132 1/20 0.35
PMP22 Q01453 1/20 0.35
NPSR1 Q6W5P4 1/20 0.35
ACHE P22303 1/20 0.33
BACE1 P56817 1/20 0.33
IDO1 P14902 1/20 0.32
MAOA P21397 1/20 0.32
MAOB P27338 1/20 0.32
CDC25B P30305 1/20 0.32
AKT1 P31749 1/20 0.32
SNCA P37840 1/20 0.32
MAP2K1 Q02750 1/20 0.32
PIN1 Q13526 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4534555 0.84 XIAP (0.33) XIAP
SCHEMBL11771402 0.83 XIAP (0.35) XIAP
SCHEMBL10772074 0.81 XIAP (0.54) XIAPALDH1A1MAPTCDC25BERBB2
SCHEMBL15782814 0.75 XIAP (0.35) XIAPFGFR1FGFR2FGFR4FGFR3
SCHEMBL11772926 0.75 XIAP (0.43) XIAPMGLL
SCHEMBL17581121 0.73
SCHEMBL11771327 0.73 XIAP (0.38) XIAP
SCHEMBL7866839 0.71 ACHE (0.47) XIAPALDH1A1MAPTACHEBACE1
SCHEMBL21814660 0.70 NR1H2 (0.41) ALDH1A1LMNAMAPTNPSR1IDO1
SCHEMBL9491519 0.67 XIAP (0.40) XIAPFGFR1FGFR2FGFR4FGFR3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110520433-B Phosphorus-containing phenol compound, phosphorus-containing epoxy resin, curable resin composition or epoxy resin composition, and cured product thereof 日铁化学材料株式会社 2023-12-05 CN disclosed
CN-110951048-B Phosphorus-containing hardener, epoxy resin composition, cured product, prepreg, and laminate 日铁化学材料株式会社 2023-09-29 CN disclosed
CN-115685676-A Photosensitive transfer material, light-shielding material, LED array, and electronic device 富士胶片株式会社 2023-02-03 CN disclosed
CN-110194843-B Phosphorus-containing phenoxy resin, resin composition, material for circuit board, and cured product 日铁化学材料株式会社 2023-01-03 CN disclosed
CN-110951048-A Phosphorus-containing curing agent, epoxy resin composition, cured product, prepreg, and laminate 日铁化学材料株式会社 2020-04-03 CN disclosed
EP-3620459-A1 PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, PHOSPHORUS-CONTAINING EPOXY RESIN, CURABLE RESIN COMPOSITION THEREOF, OR EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF NIPPON STEEL Chemical & Material Co., Ltd. (JP) 2020-03-11 EP disclosed
CN-110520433-A Phosphorus-containing phenol compound, phosphorus-containing epoxy resin, curable resin composition or epoxy resin composition thereof, and cured product thereof NIPPON STEEL & SUMIKIN CHEMICAL COMPANY 2019-11-29 CN disclosed
CN-110194843-A Phosphorous phenoxy resin, resin combination, circuit board use material and hardening thing 日铁化学材料株式会社 2019-09-03 CN disclosed
US-4360469-A Preparation of quinones by salcomine-catalyzed oxidation of phenols EASTMAN KODAK COMPANY (US) 1982-11-23 US disclosed
US-3970640-A Process for the production of polyphenylene ethers having a desired polymerization degree MITSUBISHI GAS CHEMICAL COMPANY, INC. (JA) 1976-07-20 US disclosed