SCHEMBL11270979

SCHEMBL11270979

CC(CN)C(C)(C)CCN

nearest known ligand 0.33

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL714289 0.84 ODC1 (0.33) ALDH1A1
SCHEMBL17477190 0.81 GABRR1 (0.32)
SCHEMBL19645212 0.77 FDPS (0.35) ALDH1A1
SCHEMBL13997246 0.77 TSHR (0.33)
SCHEMBL18970406 0.77
SCHEMBL20863089 0.77
SCHEMBL21790427 0.75
SCHEMBL18962260 0.75
Hydrochloric Acid SCHEMBL27478680 0.74
SCHEMBL3837695 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250289926-A1 CURABLE COMPOSITION FOR INSULATING FILM FORMATION, INSULATING FILM FORMATION METHOD, AND TERMINALLY MALEIMIDE-MODIFIED POLYPHENYLENE ETHER RESIN TOKYO OHKA KOGYO CO LTD (JP) 2025-09-18 US disclosed
US-12312489-B2 Curable composition, cured product and method for forming insulating film TOKYO OHKA KOGYO CO., LTD. (JP) 2025-05-27 US disclosed
US-20220289889-A1 CURABLE COMPOSITION, CURED PRODUCT AND METHOD FOR FORMING INSULATING FILM TOKYO OHKA KOGYO CO., LTD. (JP) 2022-09-15 US disclosed
US-20220282043-A1 CURABLE COMPOSITION FOR INSULATING FILM FORMATION, INSULATING FILM FORMATION METHOD, AND TERMINALLY MALEIMIDE-MODIFIED POLYPHENYLENE ETHER RESIN TOKYO OHKA KOGYO CO., LTD. (JP) 2022-09-08 US disclosed
CN-114258511-A Curable composition, cured product, and method for forming insulating film 东京应化工业株式会社 2022-03-29 CN disclosed
CN-114222775-A Curable composition for forming insulating film, method for forming insulating film, and maleimide-modified-terminated polyphenylene ether resin 东京应化工业株式会社 2022-03-22 CN disclosed
WO-2021033442-A1 CURABLE COMPOSITION FOR INSULATING FILM FORMATION, INSULATING FILM FORMATION METHOD, AND TERMINALLY MALEIMIDE-MODIFIED POLYPHENYLENE ETHER RESIN 東京応化工業株式会社 2021-02-25 WO disclosed
WO-2021033441-A1 CURABLE COMPOSITION, CURED PRODUCT AND METHOD FOR FORMING INSULATING FILM 東京応化工業株式会社 2021-02-25 WO disclosed
US-4354981-A Method for synthesizing dinitriles, products obtained thereby and their derivatives ANIC, S.P.A. (IT) 1982-10-19 US disclosed
US-4279834-A REACTING AN ALPHA, BETA SATURATED VITRILE WITH AN ALPHA, BETA UNSATURATED NITRILE ANIC S.P.A. (IT) 1981-07-21 US disclosed