SCHEMBL1127587

SCHEMBL1127587

c1ccc(C[n+]2cccc3ccccc32)cc1

nearest known ligand 0.76

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ACHE P22303 13/20 0.76
BCHE P06276 11/20 0.76
KDM4E B2RXH2 1/20 0.64
NPC1 O15118 1/20 0.64
MITF O75030 1/20 0.64
ALDH1A1 P00352 1/20 0.64
GLA P06280 1/20 0.64
GAA P10253 1/20 0.64
HPGD P15428 1/20 0.64
HTT P42858 1/20 0.64
RAB9A P51151 1/20 0.64
SMN1; SMN2 Q16637 1/20 0.64
MEN1 O00255 1/20 0.61
POLB P06746 1/20 0.61
APOBEC3A P31941 1/20 0.61
KMT2A Q03164 1/20 0.61
APOBEC3G Q9HC16 1/20 0.61

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29729955 1.00 ACHE (0.76) ACHEBCHEKDM4ENPC1MITF
Hydrochloric Acid SCHEMBL29943765 0.98 ACHE (0.73) ACHEBCHEKDM4ENPC1MITF
Bromide SCHEMBL1069897 0.98 ACHE (0.79) ACHEBCHEKDM4ENPC1MITF
Hydrochloric Acid SCHEMBL1071121 0.98 ACHE (0.73) ACHEBCHEKDM4ENPC1MITF
SCHEMBL20263107 0.93 ACHE (0.67) ACHEBCHEKDM4ENPC1MITF
SCHEMBL20657095 0.93 ACHE (0.67) ACHEBCHEKDM4ENPC1MITF
SCHEMBL18320448 0.93 ACHE (0.67) ACHEBCHEKDM4ENPC1MITF
SCHEMBL9644491 0.89 ACHE (0.63) ACHEBCHEKDM4ENPC1MITF
SCHEMBL21381177 0.88 ACHE (0.67) ACHEBCHEMEN1POLBAPOBEC3A
SCHEMBL20152086 0.88 ACHE (0.82) ACHEBCHEMEN1POLBAPOBEC3A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 112 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3430629-B1 ELECTRICAL INSULATION SYSTEM BASED ON EPOXY RESINS FOR GENERATORS AND MOTORS HUNTSMAN ADV MAT LICENSING SWITZERLAND GMBH (CH) 2020-03-18 EP claimed
EP-3317318-B1 A THERMOSETTING EPOXY RESIN COMPOSITION FOR THE PREPARATION OF OUTDOOR ARTICLES, AND THE ARTICLES OBTAINED THEREFROM HUNTSMAN ADV MAT LICENSING SWITZERLAND GMBH (CH) 2019-04-24 EP claimed
EP-2449152-B1 METAL LOSS INHIBITOR FORMULATIONS AND PROCESSES HENKEL AG & CO KGAA (DE) 2018-12-19 EP claimed
US-8999076-B2 Trichrome passivates for treating galvanized steel HENKEL AG & CO. KGAA (DE) 2015-04-07 US claimed
WO-2007087099-A2 METHOD OF REMOVING SCALE AND ACIDIC COMPOSITION USED THEREOF JOHNSONDIVERSEY, INC. (US) 2007-08-02 WO claimed
EP-1709048-A2 METHOD OF PREPARING PORPHYRIN DERIVATIVES, PORPHYRIN DERIVATIVES, USES THEREOF AND PHARMACEUTICAL COMPOSITIONS Photobiochem N.V. (NL) 2006-10-11 EP claimed
WO-2005058909-A2 METHOD OF PREPARING PORPHYRIN DERIVATIVES, PORPHYRIN DERIVATIVES, USES THEREOF AND PHARMACEUTICAL COMPOSITIONS PHOTOBIOCHEM N.V. (NL) 2005-06-30 WO claimed
EP-0813945-B1 Fabrication of mouled bodies from a one-coponent epoxy resin composition by means of an automatic pressure gelling process VANTICO AG (CH) 2003-04-09 EP claimed
EP-1105431-B1 HEAT CURABLE EPOXY COMPOSITIONS VANTICO AG (CH) 2003-01-29 EP claimed
EP-0996506-B1 METHOD FOR THE COATING OR ENCAPSULATION OF FLUIDISABLE SUBSTRATES VANTICO AG (CH) 2002-08-14 EP claimed
CN-1309680-A heat curable epoxy composition VANTICO AG (CH) 2001-08-22 CN claimed
EP-1105431-A2 HEAT CURABLE EPOXY COMPOSITIONS Vantico AG (CH) 2001-06-13 EP claimed
WO-2000004075-A2 HEAT CURABLE EPOXY COMPOSITIONS VANTICO AG (CH) 2000-01-27 WO claimed
EP-0673104-B1 One component epoxy systems for drip process and hot dipping burnish method CIBA GEIGY AG (CH) 1999-07-07 EP claimed
EP-0192130-B1 CORROSION INHIBITOR COMPOSITION HENKEL CORPORATION (a Delaware corp.) (US) 1990-06-27 EP claimed
WO-2024204692-A1 RESIN COMPOSITION, TRANSPARENT MATERIAL, TRANSPARENT FILM, PLATE MATERIAL FOR SCREEN PRINTING, STENCIL FOR SCREEN PRINTING, AND PHOTOSENSITIVE RESIST FILM 株式会社ムラカミ 2024-10-03 WO disclosed
US-20240288772-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-08-29 US disclosed
EP-0293749-A1 N,N'-Biscyano-p-benzoquinonebisimines, charge-transfer complexes containing them and radical-ion salts of the biscyano-benzoquinonebisimines BASF Aktiengesellschaft (DE) 1988-12-07 EP disclosed
US-4698168-A Corrosion inhibitor for well acidizing treatments HUGHES TOOL COMPANY (US) 1987-10-06 US disclosed
EP-0206266-A2 Radical-ion salts BASF Aktiengesellschaft (DE) 1986-12-30 EP disclosed